In this research, a systematic and multi-disciplinary study was conducted to understand the fundamental science of moisture-induced degradation of interfacial adhesion. The research is comprised of both experimental and modeling components of analysis and consists of four primary components. First, the moisture transport behavior within underfill adhesives is experimentally characterized and incorporated into a finite element model to depict the moisture ingress and interfacial moisture concentration for each respective level of moisture preconditioning. Second, the effect of moisture on the variation of the underfill elastic modulus is demonstrated and the physical mechanisms for the change identified. Third, the aggregate effect of moisture on the interfacial fracture toughness of underfill to both copper and FR-4 board substrates is determined. This includes the primary effect of moisture being physically present at the interface and the secondary effect of moisture changing the elastic modulus of the adhesive when absorbed. Last, the recovery of both the elastic modulus and interfacial fracture toughness from moisture preconditioning is assessed with reversible and irreversible components identified. Using adsorption theory in conjunction with fracture mechanics, an analytical model is developed that predicts the loss in interfacial fracture toughness as a function of moisture content. The model incorporates key parameters relevant to the problem of moisture in epoxy joints identified from the experimental portion of this research, including the interfacial hydrophobicity, epoxy nanopore density, saturation concentration, and density of water. This research results in a comprehensive understanding of the primary mechanisms responsible for the interfacial degradation due to the presence of moisture. The experimental results obtained through this research provide definitive data for the electronics industry to use in their product design, failure analysis, and reliability modeling. The predictive model developed in this research provides a useful tool for developing new adhesives, innovative surface treatment methods, and effective protection methodologies for enhancing interfacial adhesion.

<p>This thesis is a study for analysing costs affected by packaging in a producing industry. The purpose is to develop a model that will calculate and present possible cost savings for the customer by using Volvo Logistics Corporations, VLC’s, returnable packaging instead of other packaging solutions.</p><p>The thesis is based on qualitative data gained from both theoretical and empirical studies. The methodology for gaining information has been to study theoretical sources such as course literature and articles, as well as through interviews and consolidation with staff at Volvo Logistics Corporations office in Gothenburg.</p><p>The model is constructed in Microsoft Excel and consists of six different sheets. The first sheet is a front page that summarises the costs calculated in the other sheets and presents the possible cost savings. After the front page there are three sheets with calculations for the costs in different scenarios, Today’s Situation, VLC Packaging Solution (Pre implementation) and VLC Packaging Solution (Post implementation). The first sheet, Today’s Situation, presents the result of the model that will calculate the customers’ current costs that are associated with packaging. The different costs presented in the model are costs for unloading, repacking, today’s cost for an internal packaging solution, quality related costs, one-way packaging costs and the costs for other packaging solutions. The next sheet, VLC Packaging Solution (Pre), presents an estimation of the cost for thecustomer when using VLC’s returnable packaging system. The estimation will serve as an investment tool, for calculating possible cost savings compared to the present situation. The different costs that will be discussed are handling costs, quality related costs, distribution cost, transaction cost, and investment cost. The third and final calculation sheet, VLC Packaging Solution (Post), presents the actual costs for the customer after the implementation. When the costs have been calculated they will be used to evaluate the actual cost savings for the customer. The last two sheets are a data sheet, which consists of data needed for the calculations in the previous sheets, and an instruction sheet where there are instructions to the different calculations in the model.</p><p>The conclusion shows that the objective to create a model for calculating the costs for different packaging systems and present possible cost savings is fulfilled.</p>

Thesis (Ph. D.)--OGI School of Science and Engineering at OHSU, 2001.

Thesis (Ph. D.)--University of Texas at Austin, 2000. / Vita. Includes bibliographical references (leaves 118-119). Available also in a digital version from Dissertation Abstracts.

Thesis (Ph. D.)--School of Mechanical Engineering, Georgia Institute of Technology, 2004. Directed by Daniel F. Baldwin. / Vita. Includes bibliographical references (leaves 202-210).

Thesis (M. Phil.)--Hong Kong University of Science and Technology, 2003. / Includes bibliographical references (leaves 129-132). Also available in electronic version. Access restricted to campus users.

Thesis (Ph. D.)--University of Texas at Austin, 2002. / Vita. Includes bibliographical references. Available also from UMI Company.

All projects employ work packaging to divide the project scope into manageable portions of work for planning and execution. Enhanced work packaging, however, provides an organized and structured approach to planning through the project lifecycle in order to provide the construction work face with everything they need to successfully execute their work. This approach leads to increased field productivity and project predictability in terms of cost and schedule. Construction Industry Institute (CII) Research Team (RT) 272 developed a lifecycle execution model that encompasses recommendations for implementing enhanced work packaging throughout the project lifecycle. The model provides work packaging steps and considerations for each project phase from project definition through construction to system turnover. The model was founded upon industry practices as recorded in literature, team experiences, and through case studies and expert interviews. These recommendations were validated in conjunction with the case studies and through expert review. When properly implemented, enhanced work packaging improves field productivity, cost and schedule predictability, safety performance, and reduced rework, amongst other benefits. / text

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An integral equation formulation for the calculation of the capacitance of three-dimensional VLSI geometries is presented. A proper combination of 2D and 3D methods is used for efficient numerical computations. The method of moments is used for the solution of the integral equation. In addition, Green's functions that satisfy the boundary conditions at the dielectric interfaces are implemented in order to minimize the number of unknowns involved in the numerical solution. The mathematical formulation presented here and the associated computer program are appropriate for obtaining the capacitance matrix of complex three-dimensional multi-conductor configurations of the microstrip and the stripline type. Finally, numerical results for the per-unit-length capacitance and total capacitance of several interconnections are provided and compared with known results. Applications include the extraction of lumped capacitive elements used in the equivalent circuit representations of coupled conductor bends, vias and crossovers. In addition, calculations of per-unit-length capacitance of coupled flaring lines are performed.