In this research, a set of integrated I/O interconnection and packaging technologies are investigated. MEMS-based sea-of-leads (SoL) compliant interconnects are demonstrated to be promising to eliminate the need for underfill between a Si chip and organic packaging substrate. Wafer-level packaging with the compliant interconnects can largely reduce the impact on the fragile low-k interlevel dielectric (ILD) films. The technology feasibility of the SoL MEMS I/O interconnects is demonstrated by process integration, assembly, and reliability assessment. To achieve the high power dissipation with compact form factor, integrated thermal-fluidic I/O interconnects and CMOS compatible microchannels are developed to enable a prototype on-chip microfluidic heat sink. In addition, highly integrated electrical and optical interconnects based on dual-mode polymer pillars are fabricated, assembled and tested as a potential solution to the I/O bandwidth bottleneck. The resulting integrated I/O interconnection and packaging technologies are compatible with back-end-of-the-line (BEOL) wafer processing and conventional flip-chip assembly.

Boiling is the most efficient form of heat transfer. Thermo-fluidic transport mechanisms at different length and time scales govern the nature of boiling. This study was conducted to enhance the understanding of the surface temperature variations and fluctuations during boiling. Microfabricated thin film thermocouples were used in this study. The main aim of this study was to develop a repeatable procedure for fabrication of thin film thermocouples and to test them by measuring surface temperatures during various boiling regimes. Since thin film thermocouples are known to provide reliable measurements at very fast response rates, they were selected for this study. Small temperature fluctuations at high sampling rates were studied in boiling experiments conducted using PF-5060 as the boiling medium. An experimental apparatus was fabricated for conducting these experiments and it contained a viewing chamber whichblock for sensing the temperature during boiling on its surface. The small size of these thermocouples was another big advantage as they were expected to cause minimal interference to the temperature distribution and the transport phenomenon during boiling. This thesis reports the design evolution of the thermocouples according to the need of packaging and describes the fabrication process with sufficient detail so that it can be easily reproduced given the same facilities and environment. The results of testing show that they can be used for monitoring and analyzing surface temperature variations and fluctuations during various boiling regimes with better temporal resolution. housed the copper block used for providing the heat for boiling. The substrate with thin film thermocouples was placed on top of this copper block for sensing the temperature during boiling on its surface. The small size of these thermocouples was another big advantage as they were expected to cause minimal interference to the temperature distribution and the transport phenomenon during boiling. This thesis reports the design evolution of the thermocouples according to the need of packaging and describes the fabrication process with sufficient detail so that it can be easily reproduced given the same facilities and environment. The results of testing show that they can be used for monitoring and analyzing surface temperature variations and fluctuations during various boiling regimes with better temporal resolution.

The Study of Microstructure Analysis of Pb/Sn And Sn/Ag/Cu Solder Ball in BGA Package.

This dissertation proposes a novel packaging methodology for micro-electro-mechanical systems (MEMS) based pressure sensors by using a patterned ultra-thick (150

In this study, we present a 10-Gb/s coaxial-type laser modules package with signal input of single-end and differential-end designs, separately. By using the method of coaxial-type package with low-cost and high-performance characteristics, it can be applied to high-speed optical fiber communication, fiber to the home (FTTH), and passive-optical-network (PON) applications. Because the structure of traditional TO-Can header without proper modification, the laser module with single-end signal input design results in poor RF transmission characteristic. The notch filter effect induced by the parasitic inductance of the long lead and wires is becoming the traditional TO-Can¡¦s one of the major factors. A coaxial-type laser module with commercial TO-Can materials and an internal matching resistor of 18 ohms to reduce the signal reflection is used in this work. In single end signal modulation, The proposed coaxial laser module is fitted with an internal matching resistor of 18£[ to reduce the signal reflection. With the transmission signal of 231-1 and 10Gb/s operation, the coaxial-type laser module with single-end input can meet the mask of OC-192 standard and 26% eye mask margin. The laser module with the design of differential-end signal input that has two reverse voltage V+ and V- can reduce effect of the common-mode noise. Because the differential-signal input with shunt connection was adopted, the matching resistor of 39ohm was used for impedance matching. In addition, the laser module with common-mode signal input was also used to compare. The laser module with common-mode signal input was measured with ER (extinction-ratio) of 3.5dB and Jitter of 23ps. Due to the laser submount without optimization design, the laser module with differential-mode signal input can not be measured a good result.

Thesis (Ph. D.)--Lehigh University, 2000. / Includes vita. Includes bibliographical references (leaves 101-106).

Thesis (Ph. D.)--Lehigh University, 2000. / Includes vita. Includes bibliographical references (leaves 220-231).

Thesis (Ph. D.)--School of Electrical and Computer Engineering, Georgia Institute of Technology, 2004. Directed by Mark G. Allen. / Vita. Includes bibliographical references (leaves 271-284).

Thesis (M.S. in M.S.E.)--School of Materials Science and Engineering, Georgia Institute of Technology, 2004. Directed by C.P. Wong. / Includes bibliographical references (leaves 94-102).

This project has been carried out in collaboration with CC Pack, a Swedish packaging company located in Tibro, and under the supervision of University of Skövde. The aim of the project is the creation of a new aluminium packaging, with the intention of satisfying the highest number of customers' requirements, getting also a differentiation from the competitors. Archer’s model is followed during the design process. This model allows strengthening the efficiency of project design. The compilation of information in order to make a complete requirement classification is based on: CC Pack requirements, a study of customer needs focused on interviews and pilot study, and a literature study lead by Maslow’s hierarchy translated to design along with the 4 pleasures of Patrick Jordan. After the requirements classification, it is time to start with the concept generation phase. This phase consist of diverse methods of generation and evaluation of ideas, such as brainstorming or the weighted objective method, until a final solution is reached. This last solution, which consists of an aluminium tray surrounded by a cardboard structure, is communicated at the end of the project through illustrations created through design software such as PTC Creo Parametric and Photoshop. Conclusions obtained are quite positive in general, nevertheless there is still an aspect that could be improved. It is related to the shipping system and it is commented in chapter 7 conclusions. There is also a chapter devoted to propose possible future contributions in order to implement this project.