NDLTD Global ETD Search
  • Refine Query
  • Source
  • Publication year
  • to
  • Language
  • 679
  • 275
  • 108
  • 101
  • 97
  • 62
  • 42
  • 28
  • 25
  • 22
  • 17
  • 17
  • 17
  • 17
  • 17
  • Tagged with
  • 1870
  • 242
  • 231
  • 202
  • 199
  • 175
  • 140
  • 140
  • 129
  • 123
  • 101
  • 89
  • 84
  • 82
  • 78
  • About
  • The Global ETD Search service is a free service for researchers to find electronic theses and dissertations. This service is provided by the Networked Digital Library of Theses and Dissertations.
    Our metadata is collected from universities around the world. If you manage a university/consortium/country archive and want to be added, details can be found on the NDLTD website.

Search results

Showing 41 to 50 of 1870 (0.051 seconds)

Spelling suggestions: "subject:"packaging"" "subject:"ackaging""

41

Simultaneous solder reflow and underfill cure in next generation flip chip assembly

Fennell, Brett Jamerson 08 1900 (has links)
No description available.
Packaging Testing
Packaging
42

An integrated process modeling methodology and module for sequential multilayered high-density substrate fabrication for microelectronic packages

Dunne, Rajiv Carl 12 1900 (has links)
No description available.
Electronic packaging Design
43

Thermo-mechanical evaluation of interfacial integrity in multilayered microelectronic packages

Xie, Weidong 05 1900 (has links)
No description available.
Electronic packaging Thermal properties
Electronic packaging Testing
44

Prediction and validation of thermomechanical reliability in electronic packaging

Ding, Hai 08 1900 (has links)
No description available.
Electronic packaging Reliability
Electronic packaging Design
45

Asymmetric thermal cycles : a different approach to accelerated reliability assessment of microelectronic packages

Classe, Francis Christopher 08 1900 (has links)
No description available.
Chip scale packaging Reliability
Electronic packaging Reliability
46

Virtual qualification methodology for next-generation area-array packages

Raghunathan, Rajiv 08 1900 (has links)
No description available.
Packaging
Packaging Testing
47

Flip chip assembly process development, process characterization, and reliability assessment of polymer stud grid array-chip scaled package

Paydenkar, Chetan S. 05 1900 (has links)
No description available.
Microelectronic packaging Reliability
Microelectronic packaging Materials
48

An exploratory investigation of consumers' perceptions and perceptual process regarding food packaging / K. Venter

Venter, Karin January 2008 (has links)
Thesis (M. Consumer Science)--North-West University, Potchefstroom Campus, 2009.
Packaging
Sales packaging
Labels
Perception
Perceptor
49

An exploratory investigation of consumers' perceptions and perceptual process regarding food packaging / K. Venter

Venter, Karin January 2008 (has links)
Thesis (M. Consumer Science)--North-West University, Potchefstroom Campus, 2009.
Packaging
Sales packaging
Labels
Perception
Perceptor
50

The leader of the pack : a service perspective on packaging and customer satisfaction /

Löfgren, Martin, January 2006 (has links)
Diss (sammanfattning) Karlstad : Karlstads universitet, 2006. / Härtill 5 uppsatser.

Page generated in 0.0555 seconds