Dissertation (Ph.D.)--Auburn University, 2006. / Abstract. Vita. Includes bibliographic references (p.137-141).

Annular gas seal clearances were simulated with closely spaced parallel plates using a Flat?Plate tester. The device is designed to measure the pressure gradient along the test specimen. The main function of the Flat?Plate tester is to provide friction factor data and measure dynamic pressure oscillations. A detailed description of the test facility is described, and a theory for determining the friction factor is reviewed. Three clearances were investigated: 0.635, 0.381, and 0.254 mm. Tests were conducted at three different inlet pressures (84, 70, and 55 bars), producing Reynolds numbers range from 50,000 to 700,000. Three surface configurations were tested including smooth?on-smooth, smooth?on?hole, and hole?on?hole. The Hole?pattern plates are identical with the exception of the hole depth. The results indicate that, for the smooth?on?smooth and smooth?on?hole configurations, the friction factor remains constant or increases slightly with increasing Reynolds numbers. Moreover, the friction factor increases as the clearance between the plates increases. However, the results from the hole?on-hole configurations are quite different. A "friction?factor jump" phenomenon was observed, and the Helmholtz frequency was detected on the frequency spectra.

In this study, forced convection cooling of package of 2-D parallel boards with heat generating chips is investigated. The main objective of this study is to determine the optimal board-to-board spacing to maintain the temperature of the components below the allowable temperature limit and maximize the rate of heat transfer from parallel heat generating boards cooled by forced convection under constant pressure drop across the package. Constant heat flux and constant wall temperature boundary conditions on the chips are applied for laminar and turbulent flows. Finite elements method is used to solve the governing continuity, momentum and energy equations. Ansys-Flotran computational fluid dynamics solver is utilized to obtain the numerical results. The solution approach and results are compared with the experimental, numerical and theoretical results in the literature. The results are presented for both the laminar and turbulent flows. Laminar flow results improve existing relations in the literature. It introduces the effect of chip spacing on the optimum board spacing and corresponding maximum heat transfer. Turbulent flow results are original in the sense that a complete solution of turbulent flow through the boards with discrete heat sources with constant temperature and constant heat flux boundary conditions are obtained for the first time. Moreover, optimization of board-to-board spacing and maximum heat transfer rate is introduced, including the effects of chip spacing.

Three dimensional laminar natural convection flow of and heat transfer in incompressible air between two inclined parallel plates are analyzed with the Boussinesq approximation by using spectral methods. The plates are assumed to be infinitely long in streamwise and spanwise directions. For these directions, periodic boundary conditions are used and for the normal direction constant wall temperature and no slip boundary conditions are used. Unsteady Navier-Stokes and energy equations are solved using a pseudospectral C code in order to obtain velocity and temperature profiles inside the channel. Fourier series are used to expand the variables in x and z directions, while Chebyshev polynomials are used to expand the variables in y direction. By using the temperature distribution between the plates, local and average Nusselt numbers (Nu) are calculated. Nu values are correlated with &amp / #966 / ,which is the inclination angle, and with Racos&amp / #966 / to compare the results with the literature. Additionally, non-dimensional velocity values and streamlines of the fluid are presented with proper plots.

Orientador: Kamal Abdel Radi Ismail / Dissertação (mestrado) - Universidade Estadual de Campinas, Faculdade de Engenharia Mecanica / Made available in DSpace on 2018-08-09T04:28:28Z (GMT). No. of bitstreams: 1 GonzalezBejarano_MarioElias_M.pdf: 3100005 bytes, checksum: 12668e0ddb58dbc3a200122e0c40da4b (MD5) Previous issue date: 2006 / Resumo: No presente trabalho estuda-se o fenômeno de mudança de fase de um PCM em placas paralelas que compõe um banco de gelo. Parâmetros importantes como o espaçamento entre as placas, a temperatura da placa, a temperatura do fluido de trabalho e a vazão, são considerados numa faixa variável. Desenvolveu-se um modelo numérico para simular o processo de solidificação com o objetivo de determinar a posição da frente de solidificação e a distribuição de temperaturas na fase sólida, além de avaliar a influência dos parâmetros considerados. As equações governantes, considerando transferência de calor unidimensional, foram discretizadas utilizando o método de diferenças finitas e o esquema modificado de espaço de tempo variável (MVTS) para a resolução da malha computacional. Considera-se a temperatura inicial do PCM igual à da solidificação e com propriedades constantes. A modelagem da solidificação foi feita para os casos de temperatura da superfície da placa constante e variável. Para validar o modelo numérico, foi construída uma bancada experimental onde foram feitos diversos testes com os parâmetros mencionados anteriormente. Os resultados numéricos obtidos foram analisados e comparados. Estes mostraram concordância satisfatória com os resultados experimentais para a modelagem realizada com temperatura da placa variável. Os resultados deste trabalho podem ser utilizados para o projeto de armazenadores de calor latente em geometrias planas / Abstract: In the present work, the phase change phenomenon of a PCM in parallel plates that compose an ice bank is studied. Important parameters such as the gap between the plates, the plate temperature, the temperature and flow of the secondary fluid are considered. A numerical model was developed to simulate the solidification process with the aim of determine the position of the solidification front and the temperatures distribution at the solid phase, moreover, to evaluate the influence of the considered parameters. The governing equations, considering one-dimensional heat transfer, had been discretized using the finite differences method and the modified variable time steps scheme (MVTS) to resolve the computational mesh. The PCM was considered initially at solidification temperature and with constant thermal properties. The solidification model was made for the cases of constant plate temperature and variable temperature. To validate the numerical model, an experimental device was constructed where many tests were carried through with the mentioned parameters. The numerical results were analyzed and compared. These ones show satisfactory agreement with the experimental results for the modeling carried through with variable plate temperature. The results of this work can be used for the project of latent heat storage systems with plain geometries / Mestrado / Engenharia Termica e Fluidos / Mestre em Engenharia Mecânica

Orientador: Carlos Alberto Carrasco Altemani / Tese (doutorado) - Universidade Estadual de Campinas, Faculdade de Engenharia Mecanica / Made available in DSpace on 2018-08-06T09:32:44Z (GMT). No. of bitstreams: 1 Souza_ValterCesarde_D.pdf: 4532174 bytes, checksum: 07cf885bb91505cb080fc4a067621191 (MD5) Previous issue date: 2005 / Resumo: Os dissipadores térmicos de placas paralelas com entrada de topo e saída lateral constituem uma alternativa para intensificar a remoção da potência elétrica dissipada em microprocessadores. Neste trabalho, três dissipadores térmicos de placas paralelas foram construídos e testados com escoamento variável de ar sob condições de entrada de topo e saída lateral. Os resultados experimentais foram comparados com correlações da literatura e com resultados de simulações numéricas tridimensionais. Após a validação com os resultados experimentais, o modelo numérico foi utilizado num procedimento para obter o número de aletas do dissipador para a máxima troca térmica convectiva. Dois casos foram considerados, um deles baseado numa velocidade média do ar constante na entrada do dissipador, e o outro, numa relação linear da curva de operação de um ventilador / Abstract: The parallel plates heat sinks with top inlet and side exit constitute an enhanced heat transfer alternative for the local removal of electric power dissipation in microprocessors. In the present work, three parallel plates heat sinks were built and tested with variable airflow under the conditions of top inlet and side exit. The experimental results were compared with correlations from the literature and with results from three-dimensional numerical simulations. After the validation with the experimental results, the numeric model was used in an optimization procedure to obtain the heat sink number of fins for the maximum convective heat transfer. Two cases were considered, one based on a constant average inlet air velocity, and the other, on an assumed linear fan curve / Doutorado / Termica e Fluidos / Doutor em Engenharia Mecânica