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Thesis (M.S.)--State University of New York at Binghamton, Dept. of Systems Science and Industrial Engineering, 2007. / Includes bibliographical references.

Dissertation (Ph.D.)--Auburn University, 2005. / Vita. Includes bibliographical references (ℓ. 79-83).

Thesis (M.S.)--Rochester Institute of Technology, 1991. / Typescript. Includes bibliographical references.

Thesis--Auburn University, 2005. / Abstract. Vita. Includes bibliographic references

Thesis (M.S.)--State University of New York at Binghamton, Dept. of Systems Science and Industrial Engineering, 2007. / Includes bibliographical references.

Thesis (M.S.)--Missouri University of Science and Technology, 2009. / Vita. The entire thesis text is included in file. Title from title screen of thesis/dissertation PDF file (viewed November 16, 2009) Includes bibliographical references (p. 90-91).

Thesis (M.S.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department of Systems Science and Industrial Engineering, 2009. / Includes bibliographical references.

The ultrasonic welding of Cu110, electrolytic tough pitch copper sheet to electroless plated laminate circuit board was experimentally investigated within the range of 20 kHz. The effects of machine parameters; energy, amplitude and pressure as well as material characteristics such as surface roughness, gauge, temper, and silver and gold plating schemes were compared through pull tests and analysis of microstructure. Evidence was discovered which attributes plastic deformation, mechanical interlocking, and acoustic softening to the mechanism of weld formation. It was further determined that ultrasonic welding of Cu110 sheet to silver immersion laminate circuit boards as means of electrical termination is a robust process. Therefore it was the goal of this thesis to understand the mechanism of ultrasonic welding and determine if ultrasonic welding to laminate circuit boards is an alternative to soldering electrical terminations.

As the drive continues to reduce the size of Printed Wiring Assemblies (PWAs), improve performance of electronic assemblies, and reduce costs of these products, reliable secondary (bottom) side reflow operations must be developed. Attaching Surface Mount Technology (SMT) components to the secondary side of a Printed Circuit Board (PCB) is accomplished by placing components on the PCB's secondary side and processing it through the reflow oven at this point. This board is then flipped over so that more components can be placed on the side that is facing up (primary side). The PCB must again be processed through the reflow oven. Large Integrated Circuit (IC) packages that are soldered to the secondary side fall off of the PCB during reflow of the primary side. Intuition may lead one to believe this is caused solely by weight, size, etc., but experienced personnel are not able to consistently predict which components will fail. The purpose of this work is to convey the necessary knowledge to explain and predict the behavior of components during Secondary Side Reflow (SSR). This thesis will ultimately present a method by which guidelines for SSR can be created. Currently, SSR is limited to small passive devices and small Integrated Circuit (IC) packages. It is anticipated that future PWA designs will require large ICs such as Quad Flat Packs (QFP) and Ball Grid Arrays (BGA) on the secondary side. A large variety of SMT components are available, but the focus of this research was directed towards large IC packages. Current manufacturing guidelines for such products do not exist and development of these are imperative if a costly trial and error approach is to be avoided. In an environment where product technology advancement and cost reduction are key to survival, industry must develop and understand this manufacturing process. Cost savings from SSR will be most directly realized with compressed product development cycles, reduced use of PCBs, components, and raw materials, and more efficient use of manufacturing capital and employees. These cost savings would be realized nearly immediately after a set of manufacturing guidelines is developed. / Graduation date: 2000