The wastewater from the electroplating processes required for the production of printed circuit boards has a high heavy metal content. The regulatory agencies of both the Federal Government and the State of Florida set pretreatment limitations on the quantity of the hazardous heavy metal ions that may be discharged t o a receiving body of water or to a Publicly Owned Treatment Works. A number of treatment processes are available for the effective removal of these pollutants. The mechanism behind the more common processes are discussed in this paper. Many variables must be considered in the design of a wastewater pretreatment system. The more important variables are enumerated and the criteria to integrate these variables into the treatment selection process and ultimately into the design of the pretreatment system are covered in detail. Flow diagrams and equipment lists for the treatment processes selected are given as well as a breakdown of the total construction costs for this project.

by Pang King Man. / Thesis (M.Phil.)--Chinese University of Hong Kong, 2003. / Includes bibliographical references (leaves 186-204). / Text in English; abstracts in English and Chinese. / by Pang King Man. / Acknowledgments --- p.i / Abstract --- p.ii / Content --- p.v / List of Figures --- p.xiii / List of Tables --- p.xvii / List of Plates --- p.xxii / Chapter 1. --- INTRODUCTION --- p.1 / Chapter 1.1 --- Printed circuit board manufacturing industry in Hong Kong --- p.1 / Chapter 1.1.1 --- Principal manufacturing processes of printed circuit board --- p.2 / Chapter 1.1.1.1 --- Cleaning and surface preparation --- p.3 / Chapter 1.1.1.2 --- Catalyst application and electroless plating --- p.3 / Chapter 1.1.1.3 --- Pattern printing and masking --- p.4 / Chapter 1.1.1.4 --- Electroplating --- p.4 / Chapter 1.1.1.5 --- Etching --- p.5 / Chapter 1.1.2 --- Characteristics of wastestreams from printed circuit board manufacturing --- p.5 / Chapter 1.1.2.1 --- Spent solvents --- p.6 / Chapter 1.1.2.2 --- Spent etchants --- p.8 / Chapter 1.1.2.3 --- Rinsewaters --- p.9 / Chapter 1.1.2.4 --- Air emission --- p.9 / Chapter 1.1.3 --- Environmental legislation relating to PCB manufacturing industry --- p.10 / Chapter 1.1.3.1 --- Water Pollution Control Ordinance (WPCO) --- p.10 / Chapter 1.1.3.2 --- Sewage Services (Sewage Charges) Regulation --- p.10 / Chapter 1.1.3.3 --- Waste Disposal (Chemical Waste) Regulation --- p.11 / Chapter 1.1.3.4 --- Air Pollution Control Ordinance (APCO) --- p.11 / Chapter 1.2 --- Chemical-specific approach against toxicity-based approach --- p.11 / Chapter 1.3 --- Toxicity identification evaluation --- p.13 / Chapter 1.3.1 --- Phase I: Toxicity characterization --- p.15 / Chapter 1.3.2 --- Phase II: Toxicity identification --- p.16 / Chapter 1.3.3 --- Phase III: Toxicity confirmation --- p.18 / Chapter 1.3.4 --- Toxicity identification evaluation on industrial effluents --- p.20 / Chapter 1.4 --- Toxicity tests --- p.21 / Chapter 1.4.1 --- Selection of organisms for bioassays --- p.22 / Chapter 1.4.2 --- Organisms used in TIE --- p.23 / Chapter 1.4.3 --- Organisms used in this study --- p.23 / Chapter 1.5 --- Ecotoxicological study of effluent from PCB manufacturing industry --- p.27 / Chapter 2. --- OBJECTIVES --- p.29 / Chapter 3. --- MATERIALS AND METHODS --- p.30 / Chapter 3.1 --- Source of samples --- p.30 / Chapter 3.2 --- Phase I - Toxicity characterization: Baseline toxicity test --- p.32 / Chapter 3.2.1 --- Microtox® test --- p.32 / Chapter 3.2.1.1 --- Sample preparation --- p.33 / Chapter 3.2.1.2 --- Procedures --- p.33 / Chapter 3.2.2 --- Survival test of a marine amphipod Hylae crassicornis --- p.35 / Chapter 3.2.2.1 --- Sample preparation --- p.38 / Chapter 3.2.2.2 --- Procedures --- p.38 / Chapter 3.3 --- Phase I - Toxicity characterization: Manipulations --- p.39 / Chapter 3.3.1 --- pH adjustment filtration test --- p.42 / Chapter 3.3.1.1 --- Sample preparation --- p.43 / Chapter 3.3.1.2 --- Procedures --- p.43 / Chapter 3.3.2 --- pH adjustment test --- p.44 / Chapter 3.3.2.1 --- Procedures --- p.44 / Chapter 3.3.3 --- pH adjustment aeration test --- p.44 / Chapter 3.3.3.1 --- Sample preparation --- p.45 / Chapter 3.3.3.2 --- Procedures --- p.45 / Chapter 3.3.4 --- pH adjustment C18 solid phase extraction (SPE) test --- p.46 / Chapter 3.3.4.1 --- Sample preparation --- p.46 / Chapter 3.3.4.2 --- Procedures --- p.47 / Chapter 3.3.5 --- Cation exchange test --- p.48 / Chapter 3.3.5.1 --- Sample preparation --- p.48 / Chapter 3.3.5.2 --- Procedures --- p.48 / Chapter 3.3.6 --- Anion exchange test --- p.49 / Chapter 3.3.6.1 --- Sample preparation --- p.49 / Chapter 3.3.6.2 --- Procedures --- p.50 / Chapter 3.4 --- Phase II - Toxicity identification --- p.50 / Chapter 3.4.1 --- Determination of total organic carbon (TOC)-TOC analyzer --- p.51 / Chapter 3.4.1.1 --- Principle --- p.51 / Chapter 3.4.1.2 --- Sample preparation --- p.52 / Chapter 3.4.2 --- Determination of metal ions-Inductively coupled plasma emission spectroscopy (ICP-ES) --- p.54 / Chapter 3.4.2.1 --- Principle --- p.54 / Chapter 3.4.2.2 --- Sample preparation --- p.56 / Chapter 3.4.3 --- Determination of metal ions-Atomic absorption spectroscopy (AAS) --- p.56 / Chapter 3.4.3.1 --- Principle --- p.56 / Chapter 3.4.3.2 --- Sample preparation --- p.58 / Chapter 3.4.4 --- Determination of anions - Ion chromatography (IC) --- p.58 / Chapter 3.4.4.1 --- Principle --- p.58 / Chapter 3.4.4.2 --- Sample preparation --- p.60 / Chapter 3.5 --- Phase III - Toxicity confirmation --- p.60 / Chapter 3.5.1 --- Chemicals preparation --- p.60 / Chapter 3.5.2 --- Mass balance test --- p.61 / Chapter 3.5.2.1 --- Procedures --- p.61 / Chapter 3.5.3 --- Spiking test --- p.61 / Chapter 3.5.3.1 --- Procedures --- p.62 / Chapter 4. --- RESULTS --- p.63 / Chapter 4.1 --- Chemical characteristics of the whole effluent samples --- p.63 / Chapter 4.2 --- Phase I - Toxicity characterization: Baseline toxicity test --- p.63 / Chapter 4.2.1 --- Baseline toxicity of whole effluent samples on the Microtox® test --- p.63 / Chapter 4.2.2 --- Baseline toxicity of whole effluent samples on the survival test of a marine amphipod Hyale crassicornis --- p.63 / Chapter 4.3 --- Phase I - Toxicity characterization --- p.67 / Chapter 4.3.1 --- Toxicity characterization of effluent samples using the Microtox® test --- p.67 / Chapter 4.3.1.1 --- Effect of manipulations on Sample El --- p.67 / Chapter 4.3.1.2 --- Effect of manipulations on Sample E2 --- p.72 / Chapter 4.3.1.3 --- Effect of manipulations on Sample E3 --- p.77 / Chapter 4.3.1.4 --- Effect of manipulations on Sample E4 --- p.80 / Chapter 4.3.1.5 --- Effect of manipulations on Sample E5 --- p.83 / Chapter 4.3.1.6 --- Effect of manipulations on Sample E6 --- p.86 / Chapter 4.3.2 --- Toxicity characterization of effluent samples using the survival test of amphipod Hyale crassicornis --- p.89 / Chapter 4.3.2.1 --- Effect of manipulations on Sample El --- p.89 / Chapter 4.3.2.2 --- Effect of manipulations on Sample E2 --- p.94 / Chapter 4.3.2.3 --- Effect of manipulations on Sample E3 --- p.99 / Chapter 4.3.2.4 --- Effect of manipulations on Sample E4 --- p.102 / Chapter 4.3.2.5 --- Effect of manipulations on Sample E5 --- p.102 / Chapter 4.3.2.6 --- Effect of manipulations on Sample E6 --- p.107 / Chapter 4.4 --- Phase II - Toxicity identification --- p.110 / Chapter 4.4.1 --- Chemical reduction on Sample El --- p.113 / Chapter 4.4.2 --- Chemical reduction on Sample E2 --- p.117 / Chapter 4.4.3 --- Chemical reduction on Sample E3 --- p.117 / Chapter 4.4.4 --- Chemical reduction on Sample E4 --- p.122 / Chapter 4.4.5 --- Chemical reduction on Sample E5 --- p.122 / Chapter 4.4.6 --- Chemical reduction on Sample E6 --- p.125 / Chapter 4.5 --- Phase III - Toxicity confirmation --- p.130 / Chapter 4.5.1 --- Mass balance and spiking tests on the Microtox® test --- p.130 / Chapter 4.5.1.1 --- Mass balance and spiking tests of Sample El on the Microtox® test --- p.131 / Chapter 4.5.1.2 --- Mass balance and spiking tests of Sample E2 on the Microtox® test --- p.131 / Chapter 4.5.1.3 --- Mass balance and spiking tests of Sample E3 on the Microtox® test --- p.133 / Chapter 4.5.1.4 --- Mass balance and spiking tests of Sample E4 on the Microtox® test --- p.135 / Chapter 4.5.1.5 --- Mass balance and spiking tests of Sample E5 on the Microtox® test --- p.138 / Chapter 4.5.1.6 --- Mass balance and spiking tests of Sample E6 on the Microtox® test --- p.140 / Chapter 4.5.2 --- Mass balance and spiking tests on the survival test of amphipod Hyale --- p.140 / Chapter 4.5.2.1 --- Mass balance and spiking tests of Sample El on the amphipod survival test --- p.142 / Chapter 4.5.2.2 --- Mass balance and spiking tests of Sample E2 on the amphipod survival test --- p.142 / Chapter 4.5.2.3 --- Mass balance and spiking tests of Sample E3 on the amphipod survival test --- p.144 / Chapter 4.5.2.4 --- Mass balance and spiking tests of Sample E4 on the amphipod survival test --- p.146 / Chapter 4.5.2.5 --- Mass balance and spiking tests of Sample E5 on the amphipod survival test --- p.149 / Chapter 4.5.2.6 --- Mass balance and spiking tests of Sample E6 on the amphipod survival test --- p.149 / Chapter 5. --- DISCUSSION --- p.153 / Chapter 5.1 --- Phase I - Toxicity characterization: Baseline toxicity test --- p.153 / Chapter 5.1.1 --- Baseline toxicity of whole effluent samples on the Microtox® test --- p.154 / Chapter 5.1.2 --- Baseline toxicity of whole effluent samples on the survival test of amphipod Hyale crassicornis --- p.155 / Chapter 5.2 --- Phase I - Toxicity characterization: Manipulations --- p.155 / Chapter 5.2.1 --- Effect of manipulations on the Microtox® test --- p.156 / Chapter 5.2.1.1 --- pH adjustment filtration test --- p.156 / Chapter 5.2.1.2 --- pH adjustment test --- p.158 / Chapter 5.2.1.3 --- pH adjustment aeration test --- p.159 / Chapter 5.2.1.4 --- pH adjustment C18 solid phase extraction (SPE) test --- p.159 / Chapter 5.2.1.5 --- Cation exchange test --- p.160 / Chapter 5.2.1.6 --- Anion exchange test --- p.160 / Chapter 5.2.1.7 --- Conclusion of the Phase I manipulations on the Microtox® test --- p.161 / Chapter 5.2.2 --- Effect of manipulations on the survival test of a marine amphipod Hyale crassicornis --- p.162 / Chapter 5.2.2.1 --- pH adjustment filtration test --- p.162 / Chapter 5.2.2.2 --- pH adjustment test --- p.162 / Chapter 5.2.2.3 --- pH adjustment aeration test --- p.163 / Chapter 5.2.2.4 --- pH adjustment C18 solid phase extraction (SPE) test --- p.163 / Chapter 5.2.2.5 --- Cation exchange test --- p.163 / Chapter 5.2.2.6 --- Anion exchange test --- p.164 / Chapter 5.2.2.7 --- Conclusion of the Phase I manipulations on the survival test of a marine amphipod Hyale crassicornis --- p.164 / Chapter 5.3 --- Phase II - Toxicity identification --- p.164 / Chapter 5.3.1 --- Chemical reduction on anions --- p.165 / Chapter 5.3.2 --- Chemical reduction on metal ions --- p.166 / Chapter 5.3.3 --- Conclusion of the Phase II toxicity identification --- p.166 / Chapter 5.4 --- Phase III - Toxicity confirmation --- p.167 / Chapter 5.4.1 --- Mass balance and spiking tests on the Microtox® test --- p.167 / Chapter 5.4.2 --- Mass balance and spiking tests on the survival test of amphipod Hyale crassicornis --- p.169 / Chapter 5.4.3 --- Conclusion of the Phase III toxicity confirmation --- p.170 / Chapter 5.4.4 --- Comparison between the results of the Microtox® test and survival test of amphipod Hyale crassicornis --- p.170 / Chapter 5.5 --- Comparison between the concentrations of the identified toxicant(s) in the PCB effluents with the technical memorandum on standards for effluent discharged --- p.172 / Chapter 5.6 --- Toxicity of the identified toxicant(s) in the PCB effluents --- p.175 / Chapter 5.6.1 --- Copper --- p.175 / Chapter 5.6.2 --- Chloride and sulfate --- p.177 / Chapter 5.7 --- Treatment technologies --- p.179 / Chapter 5.8 --- Recommendations --- p.183 / Chapter 6. --- CONCLUSIONS --- p.184 / Chapter 7. --- REFERENCES --- p.186

Over the last two decades, the assembly of printed circuit boards (PCB) has generated a huge amount of industrial activity. One of the major developments in PCB assembly was introduction of surface mount technology (SMT). SMT has displaced through-hole technology as a primary means of assembling PCB over the last decade. It has also made it easy to automate PCB assembly process. The component placement machine is probably the most important piece of manufacturing equipment on a surface mount assembly line. It is used for placing components reliably and accurately enough to meet the throughput requirements in a cost-effective manner. Apart from the fact that it is the most expensive equipment on the PCB manufacturing line, it is also often the bottleneck. There are a quite a few areas for improvements on the machine, one of them being component placement sequencing. With the number of components being placed on a PCB ranging in hundreds, a placement sequence which requires near minimum motion of the placement head can help optimize the throughput rates. This research develops an application using genetic algorithm (GA) to solve the component placement sequencing problem for a single headed placement machine. Six different methods were employed. The effects of two parameters which are critical to the execution of a GA were explored at different levels. The results obtained show that the one of the methods performs significantly better than the others. Also, the application developed in this research can be modified in accordance to the problems or machines seen in the industry to optimize the throughput rates. / Graduation date: 2004

For some decades, the assembly of printed circuit boards (PCB), had been thought to be an ordinary example of mass production systems. However, technological factors and competitive pressures have currently forced PCB manufacturers to deal with a very high mix, low volume production environment. In such an environment, setup changes happen very often, accounting for a large part of the production time. PCB assembly machines have a fixed number of component feeders which supply the components to be mounted. They can usually hold all the components for a specific board type in their feeder carrier but not for all board types in the production sequence. Therefore, the differences between boards in the sequence determines the number of component feeders which have to be replaced when changing board types. Consequently, for each PCB assembly line, production control of this process deals with two dominant problems: the determination for each manufacturing line of a mix resulting in larger similarity of boards and of a board sequence resulting in setup reduction. This has long been a difficult problem since as the number of boards and lines increase, the number of potential solutions increases exponentially. This research develops an approach for applying Genetic Algorithms (GA) to this problem. A mathematical model and a solution algorithm were developed for effectively determining the near-best set of printed circuit boards to be assigned to surface mount lines. The problem was formulated as a Linear Integer Programming model attempting to setup reduction and increase of machine utilization while considering manufacturing constraints. Three GA based heuristics were developed in order to search for a near optimal solution for the model. The effects of several crucial factors of GA on the performance of each heuristic for the problem were explored. The algorithm was then tested on two different problem structures, one with a known optimal solution and one with a real problem encountered in the industry. The results obtained show that the algorithm could be used by the industry to reduce setups and increase machine utilization in PCB assembly lines. / Graduation date: 1998

No description available.

Thesis (Ph. D.)--United States International University, 1989. / Includes bibliographical references (leaves 153-157).

Thesis (M.S.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department of Systems Science and Industrial Engineering, 2007. / Includes bibliographical references.

published_or_final_version / abstract / Electrical and Electronic Engineering / Master / Master of Philosophy

A study has been carried out to investigate the use of "real-time" radiography as a method of automated inspection of through-hole electronic circuit board solder joints. By evaluating five major solder defects it has been found that film radiography employing high contrast film results in a definite distinction between a good solder joint and a defective solder joint. The same five defects were also found to be distinguishable from a good solder joint when evaluated by a real-time radiographic inspection unit using digital image processing. Although the type of defect being investigated was not discernible, the ability to distinguish a good solder joint from a defective solder joint is a major step in the implementation of automated solder joint inspection for military electronics.

Ching Ngai-hung. / Thesis (M.Phil.)--Chinese University of Hong Kong, 2001. / Includes bibliographical references (leaves 81-83). / Abstracts in English and Chinese. / Chapter CHAPTER 1 ´ؤ --- INTRODUCTION --- p.1 / Chapter 1.1 --- Background on Micro Power Supply --- p.1 / Chapter 1.2 --- Literature Survey --- p.3 / Chapter 1.2.1 --- Comparison Among Different Power Sources & Transduction Mechanisms --- p.3 / Chapter 1.2.2 --- Previous Works in Vibration Based Generator --- p.6 / Chapter CHAPTER 2 一 --- DESIGN OF THE MICRO-POWER GENERATOR --- p.8 / Chapter 2.1 --- Concept of Power Generation --- p.8 / Chapter 2.2 --- Design Objectives of the Micro Power Generation --- p.9 / Chapter 2.3 --- System Modelling and Configuration of the Generator --- p.10 / Chapter 2.4 --- RESONATING STRUCTURE --- p.13 / Chapter 2.4.1 --- Material Selection --- p.13 / Chapter 2.4.2 --- Fabrication Method --- p.14 / Chapter CHAPTER 3 一 --- INDUCTING STRUCTURE --- p.17 / Chapter 3.1 --- Selection of Winding Method --- p.17 / Chapter 3.2 --- Solenoid Windings --- p.19 / Chapter 3.2.1 --- Fabrication Process --- p.19 / Chapter 3.3 --- PCB Windings --- p.20 / Chapter 3.3.1 --- Fabrication Process of the Prototype of Six-layer PCB --- p.21 / Chapter CHAPTER 4 一 --- EXPERIMENTAL RESULTS --- p.27 / Chapter 4.1 --- Experimental Setup --- p.27 / Chapter 4.1.1 --- Generator Systems --- p.27 / Chapter 4.1.2 --- Measurement of Vibration and Output from the Generator --- p.28 / Chapter 4.1.3 --- Observations of Vibration Motions --- p.31 / Chapter 4.2 --- SPRING FOR THE MICRO GENERATOR --- p.32 / Chapter 4.2.1 --- Spring Micromachining Optimization --- p.32 / Chapter 4.2.2 --- Mode Shapes and Spiral-spring Structures --- p.35 / Chapter 4.3 --- MAGNET FOR THE MICRO GENEARTOR --- p.37 / Chapter 4.3.1 --- Generator Output and Magnetic Dipole Orientation --- p.37 / Chapter 4.4 --- HAND-WIRED COIL GENEARTOR --- p.45 / Chapter 4.4.1 --- Performance of Different Design of Housings --- p.45 / Chapter 4.5 --- PCB COIL GENERATOR --- p.48 / Chapter 4.5.1 --- Size of PCB Coils vs. Generator Output --- p.48 / Chapter 4.5.2 --- Effect of Number of PCB Layers --- p.54 / Chapter 4.5.3 --- Array of Generators --- p.61 / Chapter CHAPTER 5 一 --- MODELLING AND COMPUTER SIMULATION --- p.63 / Chapter 5.1 --- Modelling the Second-Order System --- p.63 / Chapter CHAPTER 6 一 --- APPLICATION DEMONSTRATIONS --- p.69 / Chapter 6.1 --- INFRARED SIGNAL TRANSMISSION --- p.69 / Chapter 6.2 --- RF WIRELESS TEMPERATURE SENSING SYSTEM --- p.70 / Chapter CHAPTER 7 ´ؤ --- CONCLUSION --- p.75 / Chapter CHAPTER 8 一 --- FUTURE WORK --- p.77 / BIBLIOGRAPHY --- p.81 / APPENDIX --- p.84