Apresenta-se inicialmente o problema do Circuito Impresso na Automação de Projetos de Sistemas Digitais. É descrito um processo de fabricação, já em uso mencionando-se as principais fases da implementação de circuitos impressos. Dá-se ênfase aos algoritmos desenvolvidos para a definição do mapa de rotas, bem como à forma de descrição dos dados para processamento de problemas. São descritos sumariamente os arquivos e programas usados para a realização do \"Lay-out\", e complementarmente, discute-se um caso exemplo desde o seu preparo até as saídas gráficas. Alguns exemplos reais são expostos a na forma como foram processados. Dá-se destaque ainda ao conjunto de mensagens de erro emitidas pelos programas, que auxiliam o usuário no projeto do mapa de rotas de interconexão. / The problem of printed circuit boards in digital systems Project automation is initially presented. A manufacturing process for printed circuit boards is considered and the important phases of its implementation are described. This manufacturing process has been already successfully implemented. The central point of this dissertation is the set of algorithms developed for route mapping. The format description for processing is also a problem of importance and concern. The files and program for lay-out construction are briefly described, and an example illustrates all the relevant steps in the process, starting from data preparation and ending with the graphic outputs. Several real case examples are also presented in the form they were processed. A set of error messages printed by the program is presented. These messages are of great help to the user in projecting interconnection routing map.

Electromagnetic compatibility remains an important topic in the design and manufacturing of printed circuit boards (PCBs). Compatibility of these devices with their surroundings is becoming increasingly difficult as a modern PCB can have hundreds or thousands of parts, operating on many layers, and all at high speed. One such part is a via and its clearance, or via hole, commonly required in multilayer circuits where vertical connections between layers are used. The via hole may be exposed to large electromagnetic fields within the PCB. Although electrically small, the via hole provides a pathway for the fields to excite the exterior, either directly or through coupling to adjacent structures. To quantify this process, the near fields and radiation of an excited via hole are analysed, and are the focus of this thesis. The near fields of the via hole are first decoupled into electric and magnetic fields of the 'static' type. In both cases a series solution for two regions, one outside, and one inside the layers is constructed. The coefficients of the terms of the series are chosen to best satisfy the boundary behaviour of the fields on the conducting surfaces and across the hole. The criteria for assessing quality of the solution is based on the least squares method (LSM). Linear equation systems for both models are derived, and as no numerical integration or discretisation is required, an efficient and robust implementation to find the near fields is developed. Transformation into the far field is then achieved through surface integration of relevant field quantities close to the via hole. The far fields are best viewed as that due to two dipoles, of the magnetic and electric type, with strength and orientation depending on how the via hole is excited. It is shown that the two dipole model is sufficient to find the radiation from a 1mm diameter via hole at a frequency up to 8 GHz. Of further interest is how the choice of via hole dimensions affects the dipole moments and the near fields solved earlier are a key to this understanding.

Thesis (M.S.)--State University of New York at Binghamton, Department of Systems Science and Industrial Engineering, 2006. / Includes bibliographical references.

Graduation date: 1993

No description available.

The research presented in this thesis entailed an investigation of heavy metal uptake by Palmaria palmata, a red marine alga. The alga was dry and organically certified. The heavy metals of interest were those commonly found in the wastewaters of the printed wiring board industry, namely Cu2+Pb2+, Cd2+, Zn 2+ and Ni2+. The ultimate objective of the work was to determine whether or not the factors expected to influence the metal uptake to the greatest extent could be optimized within functional ranges, leading eventually to process design (beyond the scope of this thesis). These factors were pH, temperature, initial concentration of metal in aqueous solution, and contact time. A number of preliminary experiments were performed to establish a basis for the design of the optimization studies. / Although it was not possible to adequately define optimal regions of operation for the biosorption of heavy metals by Palmaria palmata , general trends were elucidated, and the limitations of the methodology used were clarified. (Abstract shortened by UMI.)

No description available.

Thesis (M. App. Sc.)--Carleton University, 2004. / Includes bibliographical references (p. 104-105). Also available in electronic format on the Internet.

Thesis (M.App.Sc.) - Carleton University, 2006. / Includes bibliographical references (p. 70-71). Also available in electronic format on the Internet.

Thesis (M.S.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department of Mechanical Engineering, 2008. / Includes bibliographical references.