NDLTD Global ETD Search
  • Refine Query
  • Source
  • Publication year
  • to
  • Language
  • 69
  • 15
  • 11
  • 2
  • 1
  • 1
  • 1
  • 1
  • 1
  • 1
  • 1
  • 1
  • 1
  • Tagged with
  • 128
  • 128
  • 29
  • 22
  • 19
  • 17
  • 17
  • 16
  • 15
  • 15
  • 14
  • 14
  • 13
  • 12
  • 11
  • About
  • The Global ETD Search service is a free service for researchers to find electronic theses and dissertations. This service is provided by the Networked Digital Library of Theses and Dissertations.
    Our metadata is collected from universities around the world. If you manage a university/consortium/country archive and want to be added, details can be found on the NDLTD website.

Search results

Showing 41 to 50 of 128 (0.07 seconds)

Spelling suggestions: "subject:"aprinted circuits"" "subject:"gprinted circuits""

41

Application of internal state variable models to thermal processing and reliability of plated through holes in printed wiring boards

Fu, Chia-Yu 08 1900 (has links)
No description available.
Printed circuits Testing
Semiconductors Thermal properties
42

Improved prediction modeling with validation for thermally-induced PWB warpage

Polsky, Yarom 05 1900 (has links)
No description available.
Printed circuits Design and construction
Surface mount technology
43

Factors which enhance conductive anodic filament (CAF) formation

Ready, William Judson, IV 05 1900 (has links)
No description available.
Printed circuits
44

Design, fabrication, and dynamic modeling of a printed circuit based MEMS accelerometer

Rogers, John E., Ramadoss, Ramesh. Hung, John Y. January 2007 (has links) (PDF)
Thesis(M.S.)--Auburn University, 2007. / Abstract. Vita. Includes bibliographic references (p.44-45).
45

Computational drop testing of printed circuit boards with BGA components

Jordy, Daniel Edward. January 2007 (has links)
Thesis (M.S.)--State University of New York at Binghamton, Watson School of Engineering and Applied Science (Mechanical Engineering), 2007. / Includes bibliographical references.
46

Experimental and numerical study of solder ball joints' reliability at package level & board level /

Xu, Zhengjian. January 2009 (has links)
Thesis (M.Phil.)--Hong Kong University of Science and Technology, 2009. / Includes bibliographical references (leaves 99-110).
47

Spectrophotometric studies of individual components of a cupric chloride etchant used in printed wiring board manufacturing processes /

Mee, Christine. January 1986 (has links)
Thesis (B.S.)--Rochester Institute of Technology, 1986. / Typescript. Includes bibliographical references (leaf 34).
48

Simulation of a complex mix of circuit boards in a drilling environment

Schneider, Maria J. January 2008 (has links)
Thesis (M.S.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department of Systems Science and Industrial Engineering, 2008. / Includes bibliographical references.
49

Variable swing optimal parallel links minimal power, maximal density for parallel links /

Barrera-Gonzalez, Claudia Patricia. January 2009 (has links)
Thesis (Ph.D.)--University of Delaware, 2009. / Principal faculty advisor: Fouad Kiamilev, Dept. of Electrical & Computer Engineering. Includes bibliographical references.
50

Monitoring and control system for hot air solder leveling process

Schuh, Amy Jeanne 12 January 2010 (has links)
Master of Science
Printed circuits industry
LD5655.V851 1991.S383

Page generated in 0.0884 seconds