Thesis (Ph. D.)--University of Hong Kong, 1997. / Includes bibliographical references (leaves 90-91).

Thesis (Ph. D.)--University of Texas at Austin, 2006. / Vita. Includes bibliographical references.

Low cost, rapid and high thermal by IR heating, rapid cooling and high efficiency, there are RTP (Rapid Thermal Processing) properties. We can use RTP for annealing, diffusion, contacting, oxidation and others. Rapid temperature change and IR heating can be followed positive effects in the silicon substrate. This paper is focused on annealing by RTP. Wafers were p-type monocrystalline CZ silicon with different bulk minority carrier lifetime. Minority carrier lifetime was measured by MW-PCD (Microwave Photoconductance Decay) before and after thermal processing.

Neste trabalho foram crescidos filmes finos de oxinitreto de silício (SiOxNy) por processamento térmico rápido (RTP) utilizando um forno térmico convencional adaptado, objetivando fabricar células solares MOS com baixo custo agregado e bom rendimento de conversão de baixas intensidades luminosas em energia elétrica de forma reprodutível. A receita de oxinitretação otimizada foi desenvolvida em ambiente misto de 5N2:1O2 na temperatura de 850°C para tempos de processo, na faixa de 10 a 80s seguido por uma passivação em 2L/min de N2 por 80s. Os dielétricos crescidos foram caracterizados fisicamente quanto à espessura (entre 1,50 e 2,95nm), à microrugosidade (<0,95nmRMS) e à concentração de nitrogênio (1,0-2,1%atm). As características de tunelamento foram investigadas em capacitores MOS e apontaram para a existência de armadilhas interfaciais do tipo K capazes de armazenar cargas positivas. Nas células solares MOS, a corrente de fundo foi característica para todos os processos de oxinitretação empregados (~0,5-2µA/cm2) e apresentaram níveis de resposta à luz incidente na faixa de 1 a 8mA/cm2 compatível com aplicações de conversão de energia em ambientes internos e externos (energy harvesting). A característica densidade de corrente x tensão de porta (JxVG) das células solares apresentou um comportamento aproximadamente linear desde a densidade de corrente de curto-circuito (JSC) até a tensão de curto-circuito (VOC) implicando em potência gerada máximas (PGmáx) de até centenas de µA/cm2 para VG ? VOC/2 para uma ampla faixa de intensidade radiante incidente (11,8 - 105,7mW/cm2) alcançando rendimentos de conversão de até 5,5%. / In this work, silicon oxynitrides (SiOxNy) were grown by means of a homemade Rapid Thermal Processing (RTP). The goal was to manufacture MOS solar cells with a reduced price and reasonable light conversion efficiency for low light intensity. The optimized oxidation recipe consisted of using an environment with gas mixture of 5N2:1O2 at a temperature of 850°C and different processing times in the range of 10 to 80s followed by a passivation step in ultrapure N2 (2L/min) at the same temperature of 850oC for 80s. The oxynitrides were grown with thickness in the range of 1.50 to 2.95nm with surface microroughness lower than 0.95nmRMS and nitrogen concentration in the range of 1.0 to 2.1%atm. The tunneling characteristics were studied with the aid of MOS capacitor and K-type interfacial traps related to Si(p)/Si?N structure were detected positively charged for VG > 0. The background current in the MOS solar cells (~0.5-2µA/cm2) were similar for all samples and the current response to the incident light was in the range of 1 to 8mA/cm2, which is compatible with energy conversion for indoor and outdoor environments (energy harvesting). The current density x gate voltage (JxVG) characteristics of the MOS solar cells presented a nearly linear behavior since the short-circuit current density (JSC) till to the open circuit voltage (VOC) so that the maximum generated power was of hundreds of µA/cm2 for VG ? VOC/2 for a large range of radiant intensities (11.8 - 105.7 mW/cm2) and achieving efficiency conversion up to 5.5%.

In polycrystalline silicon (pc-Si) thin-film solar cells, defect passivation is critical to device performance. Isoelectronic or covalently bonded impurities, hydrogenic, extended defects and defects with localized levels in the bandgap (deep level defects) are typically introduced during the fabrication of, and/or are inherent to, pc-Si thin-film solar cells. These defects dramatically affect minority carrier lifetimes. Removing and/or passivating these defects is required to maximize minority carrier lifetimes and is typically done through thermal annealing and passivation techniques. For pc-Si thin-film solar cells on low temperature glass superstrates, rapid thermal annealing (RTA) and hydrogen plasma passivation (hydrogenation) are powerful techniques to achieve effective removal and passivation of these defects. In this thesis, three silicon thin-film solar cells structures on low-temperature glass are subjected to variations in RTA high-temperature plateaus, RTA plateau times, and hydrogen plasma passivation parameters. These solar cells are referred to as ALICIA, EVA and PLASMA. By varying the RTA plateau temperature and time at plateau, the trade-off between extensive dopant diffusion and maximum defect removal is optimized. To reduce the density of point defects and to electrically activate the majority of dopants, an RTA process is shown to be essential. For all three of the thin-film solar cell structures investigated in this thesis, a shorter, higher-temperature RTA process provides the best open-circuit voltage (Voc). Extensive RTA plateau times cause excessive dopant smearing, increasing n = 2 recombination and shunt resistance losses. Hydrogenation is shown to be an essential step to achieve maximum device performance by `healing' the defects inherent to pc-Si thin-film solar cells. If the hydrogen concentration is about 1-2 times the density of oxygen in the cells as measured by secondary ion mass spectroscopy (SIMS), the cells seem to respond best to hydrogenation, with good resultant Voc and short-circuit for all cells investigated in this thesis. The effect of hydrogen passivation on the Voc is spectacular, typically increasing it by a factor of 2 to 3.5. Hydrogen de-bonding from repeated thermal treatments at increasing temperature provides a deeper understanding of what defects exist and the nature of the defects that limit the cell voltage. The variation in RTA and hydrogenation process parameters produces significant empirical insight into the effectiveness of RTA processes for point defect removal, dopant activation, point defect and grain boundary passivation, and impurity passivation. SIMS measurements are used to determine the impurities present in the cells' bulk and the amount of hydrogen available to passivate defects. From the results presented it appears that pc-Si thin-film solar cells on low-temperature glass are a promising, and potentially lower-cost, alternative to Si wafer based cells.

In this thesis, the lithium tantalite [LiTaO3, abbreviated to LT] thin films were deposited on Pt/Ti/SiO2/Si substrates by spin coating with sol-gel processing and rapid thermal processing. 1,3 propanediol was used as solvent to minimize the number of cycles of spin coating and drying processes to obtain the desired thickness of thin film. By changing the heating rate (600~3000¢J/min) and the heating temperature (500~800¢J), the effects of various processing parameters on the thin films growth are studied. In addition, the thermal isolation of detecting elements was achieved by the anisotropic wet etching of back silicon substrate. In order to reduce the thermal mass and thermal time constant of detector, the sensing element was built-up on a thin membrane. By changing the membrane thickness (20~350 £gm), the effects of various membrane thickness on the response of pyroelectric IR detector devices are studied also. Experimental results reveal that the heating rate will influence strongly on grain size, dielectricity, ferroelectricity and pyroelectricity of LT thin films. With the increase of heating rate, the grain size of LT thin film decreases slightly, and the c-axis orientation is enhanced. The relative dielectric constant (£`r ) of LT thin film increases from 28 up to 45.6, the dielectric loss (tan

No description available.

The development and advancement of microelectronics technology have been dramatically. The time and cost, for research and optimization of process and equipment, can be saved by using flow simulation. The governing equations of flow field, inside chemical vapor deposition (CVD) reactor, are constructed, dispersed, and solved by grid mesh and numerical method. At present, rapid thermal process (RTP) is becoming more important and popular for thin-film depositing technology. In this thesis, vertical type single wafer RTCVD reactor in poly-silicon thin-film depositing process is analyzed by numerical method. Several operating process parameters, such as: (a) the gap between shower head and wafer surface, (b) gas inlet velocity in shower head, and (c) operating pressure inside chamber of reactor, are considered for discussion and analysis of steady or unsteady phenomenon in three steps of thin-film depositing process, including (¢¹) heating for wafer, (¢º) deposition in steady state, (¢») cooling after deposition etc.. As shown in the results, each operating parameters performs different relations and phenomenon in these steady and unsteady steps: Operating pressure can affect the activity of chemical reaction strongly in unsteady or steady region. Larger gap between wafer and shower head causes less influence by flow effects or buoyancy. And also, radiation heat transfer, which is adopted by RTCVD process, can decrease the influence of some parameters on flow field.

Thesis (Ph.D.)--University of Central Florida, 2008. / Adviser: Neelkanth G. Dhere. On t.p. "x" and "y" are subscripts. Includes bibliographical references (p. 130-142).

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