This dissertation introduces new and simple techniques for suppression of multispurious passbands, which are inherent to the conventional microstrip parallel coupleline bandpass filters. In addition, the operation of harmonic suppression is analyzed using a simple model. Special emphasis is placed on the applications of several new filter designs for microstrip diplexers and multiplexers. Compact, full-duplex beam scanning antenna transceiver systems with extremely broad bandwidth have also been developed. Recent advances in broadband monolithic microwave integrated circuit (MMIC) amplifiers make the realization of extremely broadband phased-array transceiver systems possible. The ultra-wideband phased-array transceiver systems can be used in multi-band mobile satellite communication systems and wideband radars. This dissertation presents a multi-band, compact, full-duplex, beam scanning antenna transceiver system for satellite communications and two designs of ultra-wideband, low-cost radar systems as applications of the MMIC amplifiers. In addition, a multi-frequency antenna has been developed. A single-feed triple frequency microstrip patch antenna is presented as an answer to the recent demand for multi-function systems in the wireless communications. In summary, the research presented in this dissertation covers every component required to build an ultra-wideband, full-duplex beam scanning phased-array antenna transceiver. The work done in this dissertation should have many applications in the wireless communication systems and wideband radar technologies.

In this thesis, the circuits which comprise the front-end of a millimeter-wave transmit-receive module are investigated using a state-of-the-art 90 nm SiGe BiCMOS process for use in radar remote sensing applications. In Chapter I, the motivation for a millimeter-wave radar in the context of space-based remote sensing is discussed. In addition, an overview of Silicon-germanium technology is presented, and the chapter concludes with a discussion of design challenges at millimeter-wave frequencies. In Chapter II, a brief history of radar technology is presented - the motivations leading to the development of the transmit-receive module for active electronically scanned arrays are discussed, and the critical components which reside in nearly every high-frequency transmit-receive module are introduced. In Chapter III, the design and results of a W-band single-pole, double-throw switch using SiGe p-i-n diodes are discussed. In particular, the design topology and methods used to achieve low-loss and high power handling over a wide matching bandwidth without sacrificing isolation are described. In Chapter IV, the design and results of a W-band low-noise amplifier using SiGe HBT's are discussed. The design methodologies used to achieve high gain and exceptional noise performance over a wide matching bandwidth are described. Concluding remarks and a discussion of future work are in Chapter V.

Because of the tremendous amount of media streaming, video calling and high definition TV and gaming, the biggest challenge for the wireless industry is the increasing demand of high data rates. Utilization of mm-wave frequencies is an attractive option to meet this high demand. Recent advances in low cost semiconductor technologies allow realization of low-cost on-chip RF front-ends in the high millimeter wave (mm-wave) frequencies, making it possible to realize compact systems for these application areas. Although integrated circuits (ICs) are one of the main building blocks of a mm-wave system, in order to realize a fully functional wireless system, cost-effective antenna design and packaging are two important pre-conditions. Researchers have investigated and reported low-cost electronics packaging up to 100 GHz to a great extent on ceramic substrates, but mm-wave packaging above 100 GHz is relatively less explored, particularly on organic substrates. This Ph.D. dissertation demonstrates the design and development of microwave and mm-wave on-chip and on-package antennas and organically packaged components and modules ranging from 20 GHz to 170 GHz. The focus of this research was to design and develop mm-wave components and modules on LCP, to investigate the viability of this organic substrate and development of fabrication techniques in the K- (18-26.5 GHz), V- (50 to 70 GHz), W- (75 to 110 GHz), and D- (110 to 170 GHz) bands. Additionally, a demonstration of a micro-machined on-chip antenna has also been presented. This dissertation is divided in three parts: (1) characterization of liquid crystal polymer from 110 to 170 GHz. (2) development of highly radiation efficient on-chip and AiP antennas, and (3) development of mm-wave modules with the integration of antennas.