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  • About
  • The Global ETD Search service is a free service for researchers to find electronic theses and dissertations. This service is provided by the Networked Digital Library of Theses and Dissertations.
    Our metadata is collected from universities around the world. If you manage a university/consortium/country archive and want to be added, details can be found on the NDLTD website.
21

LIGA cavity resonators and filters for microwave and millimetre-wave applications

Ma, Zhen 06 December 2007
High performance microwave cavities for various circuits in the front-end of transceivers such as filters, diplexers, and oscillators have conventionally been built with rectangular or cylindrical metallic waveguides, which typically have low loss, high quality (Q) factor, and higher power handling capability. However such waveguide cavity based circuits made by traditional metal machining techniques tend to be costly, particularly for complex multiple cavity based circuits, and not well suited to high volume commercial applications and integration with planar microwave integrated circuits. As commercial transceiver applications progress toward higher microwave and millimetre-wave frequencies, the use of waveguide based circuits for compact, highly integrated transceivers is becoming feasible, along with an increasing need for cost effective batch fabrication processes for realizing complex metallic cavity circuits without sacrificing structural quality and performance. It is expected that significant advancements in both microwave performance and integration will be achieved through the development of novel technologies for realizing vertically oriented three-dimensional (3-D) structures.<p>Although improvement has been made on increasing the resonator Q factor by exploiting silicon micromachining and low-temperature cofired ceramics (LTCC) techniques, there are some drawbacks inherent to silicon cavity micromachining and LTCC technology, including non-vertical sidewalls, depth limitations, and surface roughness for the silicon resonator, and dielectric and radiation loss for LTCC resonator.<p>Polymer-based fabrication is a promising alternative to silicon etching and LTCC technologies for the batch fabrication of ultra-deep microwave cavity structures. In particular, deep X-ray lithography (XRL), as part of the LIGA process, is a microfabrication technology for precisely structuring polymers, and is increasingly being applied to RF/microwave microstructures. In addition to precise patterning capabilities, deep XRL is able to structure ultra-deep cavities due to the penetration ability of hard X-rays. Cavities of several millimetres are possible in a single lithographic exposure, and with excellent sidewall quality, including verticality near 90 degrees and surface roughness on the order of tens of nanometres. These structured polymers are subsequently used as electroforming templates for fabricating metal structures with correspondingly good sidewall quality.<p>This thesis investigates the possibility of realizing high-Q cavity resonators and filters at microwave frequencies using the LIGA microfabrication process. Finite element method (FEM) electromagnetic simulation results based on the cavity models representing different fabrication conditions show that smooth LIGA cavity structures result in promising Q improvement over silicon and LTCC structures. And the potential advantages of LIGA resonators are more dramatic with cavity height and increasing operating frequency. Deep polymer cavity structures (1.8 mm) fabricated using deep XRL demonstrate excellent sidewall verticality in the PMMA structure, with only slight shrinkage at the top surface of 8.5 2.5 mm in either lateral dimensions. This corresponds to sidewalls with verticality between 89.82o and 89.9o. The structure polymers are subsequently used as templates for metal electroforming to produce cavity resonators. The performance of the resonator is measured in a planar environment. A RT/duroid6010 soft substrate patterned with coupling structures forms the sixth side, and thus completes the cavity. Despite the rather crude test assembly for the sixth side made by clamping, the measured resonator has a high unloaded Q of 2122.2 85 at the resonant frequency of 24 GHz, indicating that LIGA cavities are especially promising for high performance applications. <p>The relatively simple, single-step lithographic exposure also facilitates extension to more structurally complicated waveguide and multiple cavity-based circuits. This research work also proposes a high performance ``split-post' 3-pole cylindrical post coupled Chebyshev bandpass filter suitable for LIGA fabrication. In addition to potentially batch fabricating such a filter lithographically by exposing the entire waveguide depth in a single exposure, the filter structures composed of three cavities with metallic multi-post coupling would be extremely difficult to fabricate using traditional machining techniques, due to the extremely fine post structure and high vertical aspect ratio required. However, these types of structures could be ideal for LIGA fabrication, which offers sub-micron features, aspect ratios of 100:1 or higher, resist thicknesses of up to 3 mm, and almost vertical and optically smooth sidewalls. Also, representative LIGA sidewall roughness is used to predict very low loss and high performance, suggesting that complicated structures with multiple resonator circuits and high internal components with high aspect ratios are possible.
22

LIGA cavity resonators and filters for microwave and millimetre-wave applications

Ma, Zhen 06 December 2007 (has links)
High performance microwave cavities for various circuits in the front-end of transceivers such as filters, diplexers, and oscillators have conventionally been built with rectangular or cylindrical metallic waveguides, which typically have low loss, high quality (Q) factor, and higher power handling capability. However such waveguide cavity based circuits made by traditional metal machining techniques tend to be costly, particularly for complex multiple cavity based circuits, and not well suited to high volume commercial applications and integration with planar microwave integrated circuits. As commercial transceiver applications progress toward higher microwave and millimetre-wave frequencies, the use of waveguide based circuits for compact, highly integrated transceivers is becoming feasible, along with an increasing need for cost effective batch fabrication processes for realizing complex metallic cavity circuits without sacrificing structural quality and performance. It is expected that significant advancements in both microwave performance and integration will be achieved through the development of novel technologies for realizing vertically oriented three-dimensional (3-D) structures.<p>Although improvement has been made on increasing the resonator Q factor by exploiting silicon micromachining and low-temperature cofired ceramics (LTCC) techniques, there are some drawbacks inherent to silicon cavity micromachining and LTCC technology, including non-vertical sidewalls, depth limitations, and surface roughness for the silicon resonator, and dielectric and radiation loss for LTCC resonator.<p>Polymer-based fabrication is a promising alternative to silicon etching and LTCC technologies for the batch fabrication of ultra-deep microwave cavity structures. In particular, deep X-ray lithography (XRL), as part of the LIGA process, is a microfabrication technology for precisely structuring polymers, and is increasingly being applied to RF/microwave microstructures. In addition to precise patterning capabilities, deep XRL is able to structure ultra-deep cavities due to the penetration ability of hard X-rays. Cavities of several millimetres are possible in a single lithographic exposure, and with excellent sidewall quality, including verticality near 90 degrees and surface roughness on the order of tens of nanometres. These structured polymers are subsequently used as electroforming templates for fabricating metal structures with correspondingly good sidewall quality.<p>This thesis investigates the possibility of realizing high-Q cavity resonators and filters at microwave frequencies using the LIGA microfabrication process. Finite element method (FEM) electromagnetic simulation results based on the cavity models representing different fabrication conditions show that smooth LIGA cavity structures result in promising Q improvement over silicon and LTCC structures. And the potential advantages of LIGA resonators are more dramatic with cavity height and increasing operating frequency. Deep polymer cavity structures (1.8 mm) fabricated using deep XRL demonstrate excellent sidewall verticality in the PMMA structure, with only slight shrinkage at the top surface of 8.5 2.5 mm in either lateral dimensions. This corresponds to sidewalls with verticality between 89.82o and 89.9o. The structure polymers are subsequently used as templates for metal electroforming to produce cavity resonators. The performance of the resonator is measured in a planar environment. A RT/duroid6010 soft substrate patterned with coupling structures forms the sixth side, and thus completes the cavity. Despite the rather crude test assembly for the sixth side made by clamping, the measured resonator has a high unloaded Q of 2122.2 85 at the resonant frequency of 24 GHz, indicating that LIGA cavities are especially promising for high performance applications. <p>The relatively simple, single-step lithographic exposure also facilitates extension to more structurally complicated waveguide and multiple cavity-based circuits. This research work also proposes a high performance ``split-post' 3-pole cylindrical post coupled Chebyshev bandpass filter suitable for LIGA fabrication. In addition to potentially batch fabricating such a filter lithographically by exposing the entire waveguide depth in a single exposure, the filter structures composed of three cavities with metallic multi-post coupling would be extremely difficult to fabricate using traditional machining techniques, due to the extremely fine post structure and high vertical aspect ratio required. However, these types of structures could be ideal for LIGA fabrication, which offers sub-micron features, aspect ratios of 100:1 or higher, resist thicknesses of up to 3 mm, and almost vertical and optically smooth sidewalls. Also, representative LIGA sidewall roughness is used to predict very low loss and high performance, suggesting that complicated structures with multiple resonator circuits and high internal components with high aspect ratios are possible.
23

Applying loop-mirror reflector in the fabrication and design of Fabry-Perot laser

Lai, Chun-ming 10 July 2006 (has links)
The purpose of this research is to present design and fabrication of resonant loop-mirror Fabry-Perot lasers. Single filter has simple fabrication processes and good potential for intergration. A 1.55-£gm symmetric quantum well InGaAlAs epi-layer wafer is used to fabricate the laser. In device design, we apply loop mirror to obtain reflection instead of cleaved facet and take 1x2, 2x2 Multi-Mode Interference (MMI) with different splitting ratio (50%:50%¡F15%:85%) as a coupler. Then we combine MMI couplers with ring cavities to reflect specific wavelength at particular position. Therefore we can obtain semiconductor laser with property of wavelength-selection filter. In this design of the mask, we add a mask of deep-etch around MMI in order to decrease the loss of higher mode inside MMI. In the part of devices design, we apply multi-step technology for wet etch to obtain necessary depth. Finally, we use the etch solution (HBr¡GHCl¡GH2O2¡GH2O¡×5¡G4¡G1¡G70) to smooth the sidewall of the waveguide, and to reduce scattering loss of the device. In the part of planarization, we can adhere dummy wafers to surround the main sample and extend the total area. If we can fill the gap flat, the problem of high edge by spinning will be solved. However, we were not able to fill the gap.
24

The Design and Fabrication of Ring Cavity Semiconductor Laser

Wang, Chun-Kai 24 June 2003 (has links)
This paper presents design and fabrication of ring cavity semiconductor lasers with simple fabrication processes and good potential for integration. A 1.55-£gm symmetric quantum well InGaAsP epi-layer wafer is used to fabricate the lasers. The fabrication processes involve a bi-level deep etching to reduce the bending losses. Two geometric types of ring cavity semiconductor lasers have been investigated. For the type 1 ring cavity in the form of race tracks, two different designs are presented. One has a single ring resonator (SRR) design and the other has a coupled double ring resonators (DRR) design. The resonator of the type 2 ring cavity is formed between a cleaved facet and a loop mirror. Both a single ring resonator (SRR) design and a double ring resonator (DRR) design are presented for this type of cavity also. The maximum saturation output light powers of 0.479 and 0.409 mW are observed in room temperature L-I measurements for type 1 and type 2 ring cavity semiconductor lasers respectively. The spontaneous emission spectra of the type 1 ring cavity semiconductor lasers show a red-shift phenomenon under increasing drive currents. The type 1 ring cavity semiconductor lasers with ring resonators of 100 and 200 £gm radii have also been found to exhibit an interesting wavelength clamping phenomenon of the output light.
25

Applying multimode interference couplers in ring resonators

Tsai, Yi-Lin 02 August 2009 (has links)
This study uses vertical mirror optical waveguide reflector and bending waveguide to fabricate semiconductor ring resonators. By using multimode interference couplers with specific width and length that generate distinctive energy distribution to achieve the power splitting of 85:15. We integrate vertically deep etching turning mirror to reflect optical mode, and reduce the component size to 37.6%. In fabrication process, this study applies multiple wet etching technique to form the waveguide structure. First, we use wet etching technique to etch ridge waveguide and turning mirror, and then perform deep etching in the periphery of bending and turning region to reduce the bending loss. Finally, the etching mask is lifted off, and the wafer is polished and sliced for measurement. After measuring the signal, we can compute waveguide loss by Fabry-perot resonant situation. The waveguide loss is 59.6dB/cm. Power splitting of 90:10 is achieved. The free spectral range (FSR) is 72GHz for the ring resonators.
26

Fabrication of SMR Filter and Its Thermal Annealing Treatment

Wen, Jau-Yu 17 August 2009 (has links)
In this study, 1/2 £f mode SMR filters on Si substrates by reactive RF magnetron sputtering method were fabricated. In addition, the thermal annealing process was adopted to improve the insertion loss of SMR filter. The Bragg reflector in SMR is alternately mounted by high and low acoustic impedance materials, with low acoustic impedance material of SiO2 and high acoustic impedance material of W. We could obtained three kinds of crystal structures of W, £\ - phase W¡B£] - phase W and £\ & £] - mixed phase W, respectively, it could be obtained by modulating the sputtering recipe. £\ - phase W possesses higher acoustic impedance and is suitable for high acoustic impedance material in bragg reflector. The piezoelectric layer of ZnO is sputtered by a 2-step deposition method on Si substrates with different temperature. The ZnO film with stronger C-axis (002) orientation and lower surface roughness value could be obtained at substrate temperature of 200 ¢J, which is suitable for fabricating SMR device. After the SMR filter had completed, the device is thermal annealed with CTA¡BRTA and RTA in O2 ambient. After thermal treatment, the properties of filters are improved. The properties could be optimized with RTA in O2 ambient condition. The insertion loss was improved from -12.03 dB to -6.96 dB. The film characteristics of ZnO changes after the SMR processed thermal treatment. The strongest C-axis (002) intensity with the lowest surface roughness value at 400 ¢J annealing temperature could be obtained, in that, approximate equal Zn:O ratio could be achieved by XPS examination. The central frequency of SMR filter drifted to higher value as the temperature of thermal treatment increased, which is attributed to the changes of the ZnO acoustic velocity(£o) after thermal treatment.
27

Micromachined viscosity sensors

Riesch, Christian January 2009 (has links)
Zugl.: Wien, Techn. Univ., Diss., 2009
28

The development of a vibrating wire viscometer and a microwave cavity resonator for the measurement of viscosity, dew points, density, and liquid volume fraction at high temperature and pressure.

Kandil, Mohamed E. January 2005 (has links)
This thesis describes the development and testing of two apparatuses; a vibrating wire viscometer to measure the viscosity of fluids over a wide range of temperature and pressure; and a microwave cavity resonator to measure dew points, gas phase densities, and liquid drop out volumes. Viscosity and density of downhole fluids are very important properties as their values can determine the economic viability of a petroleum reservoir. A vibrating wire viscometer has been developed with an electrically insulating tensioning mechanism. It has been used with two wires, of diameters (0.05 and 0.150) mm, to measure the viscosity of methylbenzene and two reference fluids with viscosities of (10 and 100) mPa·s at T = 298 K and p = 0.1 MPa, at temperatures in the range (298 to 373) K and pressures up to 40 MPa, where the viscosity covers the range (0.3 to 100) mPa·s, with a standard uncertainty < 0.6 %. The results differ from literature values by < ±1 %. The results demonstrate that increasing the wire diameter increases the upper operating viscosity range of the vibrating wire viscometer, a result anticipated from the working equations. For the microwave cavity resonator, the method is based on the measurements of the resonance frequency of the lowest order inductive-capacitance mode. The apparatus is capable of operating at temperatures up to 473 K and pressures below 20 MPa. This instrument has been used to measure the dew pressures of {0.4026CH4 + 0.5974C3H8} at a temperature range from 315 K up to the cricondentherm ˜ 340 K. The measured dew pressures differ by less than 0.5 % from values obtained by interpolation of those reported in the literature, which were determined from measurements with experimental techniques that have quite different potential sources of systematic error than the radio-frequency resonator used here. Dew pressures estimated from both NIST 14 and the Peng-Robinson equation of state lie within < ±1 % of the present results at temperature between (315 and 337) K while predictions obtained from the Soave-Redlich-Kwong cubic equation of state deviate from our results by 0.4 % at T = 315 K and these differences increase smoothly with increasing temperature to be -2.4 % at T = 337 K. Densities derived from dielectric permittivity measurements in the gas phase lie within < 0.6 % of the values calculated from the Soave-Redlich-Kwong cubic equation of state and about 1 % from values obtained with the Harvey and Prausnitz correlation based on a mixture reduced density. The calculations with Kiselev and Ely parametric crossover equation of state (based on Patel-Teja EOS) gave deviations < 0.7 %. Liquid volume fractions, in the 2-phase region, were measured from (0.5 to 7) cm3 in a total volume of about 50 cm3 at different isochors. The measured liquid volume fractions differ from values obtained with the Soave-Redlich-Kwong cubic equation of state by between 0 and 3 % at T < 326 K and about 8 % on approach to the critical region. The large deviations observed in the critical region were anticipated because of the known poor performance of the cubic equations of state with regard to the calculation of the liquid density in the vicinity of the critical temperature.
29

Resonant cavity method for broadband dielectric measurements

Muhammad-Ahmad, Ma January 1987 (has links)
The project investigates the Cavity Perturbation Method (CRM) and design of a coaxial resonator covering a wide frequency band from 2.5 to 11.5 GHz. Using the published analyses for coaxial cavities, original theoretical analysis of Cavity Perturbation Method for TEM coaxial cavity was carried out by the author. Using similar approach, the H(_011) cylindrical cavity was analyzed. The deliberate objective of the method was to produce a wide band technique since there are none available at present. The method then examines the possibility of employing the coaxial cavity as an important and necessary measuring device for dielectric measurements using CPM. It was the aim in the investigations to state clearly what assumptions were made so that the accuracy of the calculated results could be assessed. A new measurement technique, using a Sweep Generator/ Spectrum Analyzer Assembly (SG/SA) was introduced. The technique is based on very precise measurements of the changes in cavity Q and its resonant frequency, displayed on Spectrum Analyzer, when the test sample of the material is inserted. Because the main objective of the project is the method of measurements, the assessment of its validity and accuracy was fully discussed. Measurements were carried out on fifteen materials of various types of ceramics over the frequency range of interest. These materials were used mainly for the assessment of the validity and accuracy of the new Sweep Generator/Spectrum Analyzer Assembly technique, and also a test of the capability of the constructed broadband coaxial cavity to be used for dielectric measurements. The well-known Bridge and Q-meter methods, were employed initially to provide the low frequency values for the materials as reference. An attempt has also been made to justify the validity of the universal law on those materials. Additional work not directly related to the main project has been carried out on Curie temperature measurements. The object was to develop a simple and reliable method using the Gouy balance technique.
30

Improvement of MR Images Using a Wireless Axial Pair Resonator

TOYOOKA, Nobuo, ANDO, Yoko, MAEDA, Hisatoshi 10 1900 (has links)
No description available.

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