Spelling suggestions: "subject:"semiconductor wafers."" "subject:"emiconductor wafers.""
1 |
3D inspection of wafer bump quality without explicit 3D reconstruction.January 2004 (has links)
Zhao Yang. / Thesis (M.Phil.)--Chinese University of Hong Kong, 2004. / Includes bibliographical references (leaves 87-95). / Abstracts in English and Chinese. / Chapter 1 --- Introduction --- p.1 / Chapter 1.1 --- Objectives of the Thesis --- p.1 / Chapter 1.2 --- Wafer bumping inspection by using Biplanar Disparity approach --- p.2 / Chapter 1.3 --- Thesis Outline --- p.4 / Chapter 2 --- Background --- p.5 / Chapter 2.1 --- What is wafer bump? --- p.5 / Chapter 2.1.1 --- Common defects of wafer bump --- p.6 / Chapter 2.1.2 --- Literature review on exist wafer bump inspection method --- p.11 / Chapter 3 --- Model 1: the one camera model-Homography approach --- p.21 / Chapter 3.1 --- The introduction of the theoretical base of model 1 --- p.21 / Chapter 3.1.1 --- The objective of model 1 --- p.21 / Chapter 3.1.2 --- Desires --- p.22 / Chapter 3.1.3 --- Some background knowledge on Homography --- p.22 / Chapter 3.2 --- "Model 1- ""Pseudo Homography"" Approach" --- p.24 / Chapter 3.2.1 --- The description of the configuration of model 1 --- p.24 / Chapter 3.2.2 --- The condition of pseudo Homography --- p.25 / Chapter 3.2.3 --- The formation of pseudo Homgraphy H --- p.26 / Chapter 3.3 --- Methodology of treatment of the answer set --- p.32 / Chapter 3.3.1 --- Singular Value Decomposition-SVD --- p.32 / Chapter 3.3.2 --- The Robust Estimation --- p.33 / Chapter 3.3.3 --- Some experimental results by using manmade Ping Pang balls to test SVD[31] and Robust Estimation [24] --- p.35 / Chapter 3.3.4 --- the measurement of the Homography matrix answer set --- p.37 / Chapter 3.4 --- Preliminary experiment about model 1 --- p.43 / Chapter 3.5 --- Problems unsolved --- p.47 / Chapter 4 --- Model 2: the two camera model-Biplanar Disparity approach --- p.48 / Chapter 4.1 --- Theoretical Background --- p.48 / Chapter 4.1.1 --- the linearization of Homography matrix changes --- p.49 / Chapter 4.1.2 --- Problem Nature --- p.51 / Chapter 4.1.3 --- Imaging system setup --- p.52 / Chapter 4.1.4 --- Camera Calibration[13] --- p.52 / Chapter 4.2 --- Methodology --- p.54 / Chapter 4.2.1 --- Invariance measure --- p.54 / Chapter 4.2.2 --- The Geometric meaning of the Biplanar Disparity matrix --- p.58 / Chapter 4.3 --- RANSAC-Random Sample Consensus --- p.64 / Chapter 4.3.1 --- finding Homography matrix by using RANSAC[72] [35] --- p.64 / Chapter 4.3.2 --- finding Fundamental matrix by using RANSAC[73] [34] --- p.65 / Chapter 4.4 --- Harris Corner detection --- p.65 / Chapter 5 --- Simulation and experimental results --- p.67 / Chapter 5.1 --- Simulation experiments --- p.67 / Chapter 5.1.1 --- Preliminary experiments --- p.67 / Chapter 5.1.2 --- Specification for the synthetic data system --- p.71 / Chapter 5.1.3 --- Allowed error in the experiment --- p.71 / Chapter 5.2 --- Real images experiments --- p.72 / Chapter 5.2.1 --- Experiment instrument --- p.72 / Chapter 5.2.2 --- The Inspection Procedure --- p.74 / Chapter 5.2.3 --- Images grabbed under above system --- p.75 / Chapter 5.2.4 --- Experimental Results --- p.81 / Chapter 6 --- CONCLUSION AND FUTURE WORKS --- p.83 / Chapter 6.1 --- Summary on the contribution of my work --- p.83 / Chapter 6.2 --- Some Weakness of The Method --- p.84 / Chapter 6.3 --- Future Works and Further Development --- p.84 / Chapter 6.3.1 --- About the synthetic experiment --- p.84 / Chapter 6.3.2 --- About the real image experiment --- p.85 / Bibliography --- p.87
|
2 |
Analysis of Shipley Microposit Remover 1165 and AZ P4620 Photoresist waste disposal for Company XYZBarthen, Michael L. January 2001 (has links) (PDF)
Thesis--PlanB (M.S.)--University of Wisconsin--Stout, 2001. / Includes bibliographical references.
|
3 |
Plastic deformation in silicon at room temperature as a mode for stacking fault formationCoppus, George Mitchell, 1953- January 1978 (has links)
No description available.
|
4 |
An analysis of chlorine trifluoride as an effective substitute for nitrogen triflouride in the chemical vapor deposition reactor cleaning processVan Dyke, Stephanie A. January 1998 (has links) (PDF)
Thesis--PlanB (M.S.)--University of Wisconsin--Stout, 1998. / Includes bibliographical references.
|
5 |
Analysis of production control methods for semiconductor research and development fabs using simulation /Ramamurthi, Vikram. January 2004 (has links)
Thesis (M.S.)--Rochester Institute of Technology, 2004. / Typescript. Includes bibliographical references (leaves 72-75).
|
6 |
Off-axis illumination for extending optical microlithographic system performance /Brainerd, Steve, January 1993 (has links)
Thesis (M.S.), Oregon Graduate Institute of Science & Technology, 1993.
|
7 |
Advanced process control and optimal sampling in semiconductor manufacturingLee, Hyung Joo, January 1900 (has links)
Thesis (Ph. D.)--University of Texas at Austin, 2008. / Vita. Includes bibliographical references.
|
8 |
GCA 4800 DSW wafer stepper /Comard, Matthew J. January 1988 (has links)
Thesis (M.S.)--Rochester Institute of Technology, 1988. / Typescript. Includes bibliographical references (leaves 94-95).
|
9 |
Construction of an integrated down-converter for operation at 200 GHzDigby, John William January 1999 (has links)
No description available.
|
10 |
Electromigration induced step instabilities on silicon surfacesGibbons, Brian J., January 2006 (has links)
Thesis (Ph. D.)--Ohio State University, 2006. / Title from first page of PDF file. Includes bibliographical references (p. 161-165).
|
Page generated in 0.058 seconds