published_or_final_version / Electrical and Electronic Engineering / Doctoral / Doctor of Philosophy

Fung Yun Ming. / Thesis (M.Phil.)--Chinese University of Hong Kong, 2001. / Includes bibliographical references (leaves 134-140). / Abstracts in English and Chinese. / Abstract --- p.I / Acknowledgement --- p.III / Contents --- p.IV / List of Figure captions --- p.VIII / List of Table captions --- p.XIII / Chapter Chapter 1 --- Introduction --- p.1 / Chapter Chapter 2 --- Theory and Applications / Chapter 2.1 --- Principle of field emission / Chapter 2.1.1 --- The Fowler-Nordheim Theory --- p.3 / Chapter 2.1.2 --- Field emission from metals --- p.6 / Chapter 2.1.3 --- Field emission from semiconductors --- p.8 / Chapter 2.1.3.1 --- Advantages and limitations of silicon --- p.9 / Chapter 2.1.4 --- Application of the Fowler-Nordheim theory --- p.10 / Chapter 2.1.5 --- Factors influencing field emission efficiency --- p.11 / Chapter 2.2 --- Applications --- p.11 / Chapter 2.2.1 --- Operation of a Field Emission Displays --- p.11 / Chapter 2.2.2 --- Basic structure of a Field Emission Displays --- p.13 / Chapter 2.2.3 --- Parameters relevant to applications --- p.15 / Chapter 2.3 --- The fabrication processes --- p.17 / Chapter 2.3.1 --- The anisotropic wet etching method --- p.18 / Chapter 2.3.2 --- The isotropic wet etching method --- p.19 / Chapter 2.3.3 --- Field emission from coating materials --- p.20 / Chapter 2.3.3.1 --- Coating enhancement --- p.20 / Chapter 2.3.3.2 --- Diamond and diamond-like films --- p.21 / Chapter 2.3.3.3 --- Metallic coatings --- p.22 / Chapter 2.3.3.4 --- Porous silicon coatings --- p.22 / Chapter 2.3.3.5 --- Silicon carbide coatings --- p.22 / Chapter 2.3.4 --- Fabrication of field emitters with gate --- p.23 / Chapter Chapter 3 --- Sample Preparation and Characterization Methods / Chapter 3.1 --- Sample preparation --- p.25 / Chapter 3.2 --- The fabrication process / Chapter 3.2.1 --- Isotropic etching of silicon / Chapter 3.2.1.1 --- The anodization process --- p.25 / Chapter 3.2.1.2 --- Porous silicon formation --- p.26 / Chapter 3.2.2 --- Anistropic etching of silicon --- p.27 / Chapter 3.2.3 --- The sputtering system --- p.28 / Chapter 3.2.4 --- The MEVVA Ion Source Implanter --- p.30 / Chapter 3.3 --- Characterization Methods / Chapter 3.3.1 --- Atomic Force Microscopy (AFM) --- p.32 / Chapter 3.3.2 --- Scanning Electron Microscopy (SEM) --- p.34 / Chapter 3.3.3 --- Field emission measurement / Chapter 3.3.3.1 --- Vacuum requirements --- p.35 / Chapter 3.3.3.2 --- Testing system / Chapter 3.3.3.3 --- Fluctuation of field emission --- p.38 / Chapter Chapter 4 --- Fabrication of Silicon Tips and their field emission charateristics / Chapter 4.1 --- The anodization etching process / Chapter 4.1.1 --- Introduction --- p.40 / Chapter 4.1.2 --- Experimental details --- p.42 / Chapter 4.1.3 --- Results and Discussions / Chapter 4.1.3.1 --- N type (100) sample --- p.45 / Chapter 4.1.3.2 --- Ntype(lll) sample --- p.60 / Chapter 4.1.3.3 --- Fluctuations of the emission current --- p.64 / Chapter 4.1.3.4 --- The effect of Concentration of HF solution on First Step Anodization --- p.68 / Chapter 4.1.3.5 --- The effect of the Concentration of HF solution on Second Step Anodization --- p.70 / Chapter 4.1.3.6 --- Gated silicon field emitter --- p.70 / Chapter 4.1.4 --- Conclusions --- p.73 / Chapter 4.2 --- Anisotropic texturing process / Chapter 4.2.1 --- Introduction --- p.74 / Chapter 4.2.2 --- Experimental details --- p.76 / Chapter 4.2.3 --- Results and Discussions --- p.78 / Chapter 4.2.4 --- Conclusion --- p.92 / Chapter 4.3 --- Formation of Porous Silicon Layer on silicon / Chapter 4.3.1 --- Introduction --- p.93 / Chapter 4.3.2 --- Experimental details --- p.94 / Chapter 4.3.3 --- Results and Discussions --- p.95 / Chapter 4.3.4 --- Conclusion --- p.100 / Chapter 4.4 --- Chapter Summary --- p.101 / Chapter Chapter 5 --- Improvement in the field emission characteristics of the silicon tips upon coating with low work function materials / Chapter 5.1 --- Amorphous carbon coating / Chapter 5.1.1 --- Introduction --- p.102 / Chapter 5.1.2 --- Experimental details --- p.103 / Chapter 5.1.3 --- Results and Discussions --- p.104 / Chapter 5.1.4 --- Conclusion --- p.118 / Chapter 5.2 --- Silicon carbide coated Silicon emitter by MEWA / Chapter 5.2.1 --- Introduction --- p.119 / Chapter 5.2.2 --- Experimental details --- p.120 / Chapter 5.2.3 --- Results and Discussions --- p.121 / Chapter 5.2.4 --- Conclusion --- p.125 / Chapter 5.3 --- Chapter Summary --- p.126 / Chapter Chapter 6 --- Conclusions --- p.127 / Reference --- p.134 / List of publications --- p.140

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M.Ing. / Measurement of acceleration is of importance for several applications such as impact tests and navigation. The design and manufacture of a symmetrical piezoresistive accelerometer, which can measure accelerations up to 60 000 g, are presented in this work. Various accelerometers are discussed and compared. The design of an accelerometer is an interdisciplinary activity which requires knowledge of the mechanical and electronic properties of materials as well as electronic signal processing. Computer design aids such as finite element analysis and semiconductor process modelling are used in this work to optimize first order designs. Since accelerometers with large dynamic range must be small in size in order to cause the minimum disturbance of the measurand, micromachining of silicon is used to manufacture extremely small devices. A substantial part of this work deals with the different materials and methods used in the manufacturing process. Since there is an inevitable spread in the parameters of the accelerometers, each one requires calibration. A test facility was developed to test and calibrate accelerometers up to 20 000 g. Because shock impulse response is determined by the test facility, a Fourier-transform is used to compute the frequency response of the accelerometer. The result of this work is the development and manufacture of an accelerometer with a mass of approximately 1 mg. The extremely small size and mass makes it very useful for measuring high accelerations.

M.Sc. (Physics) / Please refer to full text to view abstract

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This thesis presents architectures and integrated circuits for the implementation of energy-efficient, high-power "digital'' transmitters to realize high-speed long-haul links at millimeter-wave frequencies in nano-scale silicon-based processes.