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Triplexer Transceiver Modules on the Silicon Bench using Ultra-thin Thin-film Filter and Optical FibersChen, Yi-ting 23 June 2006 (has links)
The primary target of this paper is to fabricate triplexer modules based on Si-bench technology. The triplexer modules were formed by hybrid integration of single mode lensed fibers and ultra-thin thin-film filters (TFF) on silicon bench as using V-groove and U-groove techniques. The output light at 1.31 µm was launched into the input lensed fiber of the module. After passing through two filters, the light was received by the output lensed fiber of the module. The insertion loss of the module at the 1.31 µm light was 1.25 dB. On the other hand, incoming lights at 1.49µm and 1.55µm were received from the output lensed fiber. Lights at 1.49µm will pass through the first filter, and be reflected by the second filter, and eventually be collected into the second multimode fiber. The insertion loss of the module at the 1.49 µm light was 1.14 dB. The 1.55µm wavelength lights received at the lensed fiber are reflected by the first filter and collected by the first multimode fiber. The insertion loss of the module at the 1.55 µm light was 0.68 dB.
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Passive Alignment of Buried Optical Waveguide and Single Mode Fiber on the Silicon BenchHung, Sheng-Feng 15 June 2005 (has links)
The objective of this thesis is to integrate the optical waveguide and single mode fiber in a passive alignment way on a silicon bench. This technique can reduce the complexity of packaging the individual components and increase yield of the module in order to achieve the goal of the mass production. In this module, buried waveguide structure was used for light guidance. A 1.31µm semiconductor laser was used as the input light source. Light signal launched by semiconductor laser is transferred through the buried waveguide into the single mode fiber.
This module structure is consisted of two major parts, namely, the buried waveguide and the silicon bench. Buried optical Waveguide uses SO2 as the bottom cladding. Conventional photolithography procedures and etching technique were used to form a trench on the SiO2 cladding. The waveguide core was fabricated by coating the organic-inorganic hybrid materials into the trench. Finally, an organic-inorganic hybrid materials with a refractive index smaller than that of the core is used as the top cladding. The silicon benches were obtained by etching V-groove and saw-cutting U-groove on the silicon substrates for fixing the fiber. The patterning of buried waveguide and silicon V-groove were fabricated by a single optical mask procedure. Therefore accurate alignment between the waveguide and the single mode fiber can be obtained.
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