• Refine Query
  • Source
  • Publication year
  • to
  • Language
  • 2
  • 1
  • Tagged with
  • 3
  • 3
  • 2
  • 2
  • 2
  • 1
  • 1
  • 1
  • 1
  • 1
  • 1
  • 1
  • 1
  • 1
  • 1
  • About
  • The Global ETD Search service is a free service for researchers to find electronic theses and dissertations. This service is provided by the Networked Digital Library of Theses and Dissertations.
    Our metadata is collected from universities around the world. If you manage a university/consortium/country archive and want to be added, details can be found on the NDLTD website.
1

Thulium doped tellurium oxide amplifiers and lasers integrated on silicon and silicon nitride photonic platforms

Miarabbas Kiani, Khadijeh January 2022 (has links)
Silicon photonics (SiP) has evolved into a mature platform for cost-effective low power compact integrated photonic microsystems for many applications. There is a looming capacity crunch for telecommunications infrastructure to overcome the data-hungry future, driven by streaming and the exponential increase in data traffic from consumer-driven products. To increase data capacity, researchers are now looking at the wavelength window of the thulium-doped fiber amplifier (TDFA), centered near 2 µm as an attractive new transmission window for optical communications, motivated by the demonstrations of low loss, low nonlinearity, and high bandwidth transmission. Large-scale implementation of SiP telecommunication infrastructure will require light sources (lasers) and amplifiers to generate signals and boost transmitted and/or received signals, respectively. Silicon (Si) and silicon nitride (Si3N4) have become the leading photonic integrated circuit (PIC) material platforms, due to their low-cost and wafer-scale production of high-performance circuits. Silicon does however have a number of limitations as a photonic material, including that it is not an ideal light-emitting/amplifying material. This proposed research pertains to the fabrication of on-chip silicon and silicon nitride lasers and amplifiers to be used in a newly accessible optical communications window of the TDFA band, which is a significant step towards compact PICs for the telecommunication networks. Tellurium oxide (TeO2) is an interesting host material due to its large linear and non-linear refractive indices, low material losses and large rare-earth dopant solubility showing good performance for compact low-loss waveguides and on-chip light sources and amplifiers. Chapter 1 provides an overview of silicon photonics in the context of particularly rare earth lasers and amplifiers, operating at extended wavelengths enabled by the Thulium doped fiber amplifier. Chapter 2 presents a theoretical performance of waveguides and microresonators as the efficient structure for laser and amplifiers applications designed for optimized use in Erbium and Thulium doped fiber amplifier wavelength bands. Then spectroscopic study thulium (Tm3+) has been studied as the rare earth element for Thulium doped fiber amplifier wavelength bands. Chapter 3 presents an experimental study of TeO2:Tm3+ coated Si3N4 waveguide amplifiers with internal net gains of up to 15 dB total in a 5-cm long spiral waveguide. Chapter 4 provides a study of TeO2:Tm3+ -coated Si3N4 waveguide lasers with up to 16 mW double-sided on-chip output power. Chapter 5 presents an experimental study of low loss and high-quality factor silicon microring resonators coated with TeO2 for active, passive, and nonlinear applications. Chapter 6 represents the first demonstration of an integrated rare-earth silicon laser, with high performance, including single-mode emission, a lasing threshold of 4 mW, and bidirectional on-chip output powers of around 1 mW. Further results with a different design are presented showing lasers with more than 2 mW of double-sided on-chip output power, threshold pump powers of < 1 mW and lasing at wavelengths over a range of > 100 nm. Importantly, a simple, low-cost design was used which is compatible with silicon photonics foundry processes and enables wafer scale integration of such lasers in SiP PICs using robust materials. Chapter 7 summarizes the thesis and provides paths for future work. / Dissertation / Doctor of Engineering (DEng)
2

Réalisation de sources laser III-V sur silicium

Dupont, Tiphaine 19 January 2011 (has links)
Le substrat SOI (Silicon-On-Insulator) constitue aujourd’hui le support de choix pour la fabrication de fonctions optiques compactes. Cette plateforme commune avec la micro-électronique favorise l’intégration de circuits photoniques avec des circuits CMOS. Néanmoins, si le silicium peut être utilisé de manière très avantageuse pour la fabrication de composants optiques passifs, il présente l’inconvénient d’être un très mauvais émetteur de lumière. Ceci constitue un obstacle majeur au développement de sources d’émission laser, briques de constructions indispensables à la fabrication d’un circuit photonique. La solution exploitée dans le cadre de cette thèse consiste à reporter sur SOI des épitaxies laser III-V par collage direct SiO2-SiO2. L’objectif est de réaliser sur SOI des sources lasers à cavité horizontale permettant d’injecter au moins 1mW de puissance dans un guide d’onde silicium inclus dans le SOI. Notre démarche est de transférer un maximum des fonctions du laser vers le silicium, dont les procédés sont familiers au monde de la micro-électronique. Dans l’idéal, le III-V ne devrait être utilisé que comme matériau à gain ; la cavité laser pouvant être fabriquée dans le silicium. Mais cette ligne de conduite n’est pas forcément aisée à mettre en œuvre. En effet, les photons sont produits dans le III-V mais doivent être injectés dans un guide silicium placé sous l’épitaxie. La difficulté est que les deux matériaux sont séparés par plus d’une centaine de nanomètres d’oxyde de collage faisant obstacle au transfert de photons. Le développement de lasers III-V couplés à un guide d’onde SOI demande alors de nouvelles conceptions du système laser dans son ensemble. Notre travail a donc consisté à concevoir un laser hybride III-IV / silicium se pliant aux contraintes technologiques du collage. En s’appuyant sur la théorie des modes couplés et les concepts des cristaux photoniques, nous avons imaginé, réalisé, puis caractérisé un laser à contre-réaction distribuée hybride (en anglais : « distributed feedback laser », laser DFB). Son fonctionnement optique original, permet à la fois un maximum de gain et d’efficacité de couplage grâce à une circulation en boucle des photons du guide III-V au guide SOI. Sur ces dispositifs, nous montrons une émission laser monomode (SMSR de 35 dB) à température ambiante en pompage optique et électrique pulsé. Comme attendu, la longueur d’onde d’émission est dépendante du pas de réseau DFB. Les lasers fonctionnent avec une épaisseur de collage de silice de 200 nm, ce qui offre une grande souplesse quant au procédé d’intégration. Tous les lasers fonctionnent jusqu’à des longueurs de 150 μm (la plus petite longueur prévue sur le masque). Malgré les faibles niveaux de puissances récoltés dans la fibre lors des caractérisations, la prise en compte des pertes optiques induites pas les coupleurs fibres nous indique que la puissance réellement injectée dans le guide silicium dépasse le milliwatt. Notre objectif de ce point de vue est donc rempli. Malheureusement le fonctionnement des lasers en injection électrique continue n’a pas pu être obtenu dans les délais impartis. Cependant, les faibles densités de courant de seuil mesurées en injection pulsée (300A / cm2 à température ambiante sur les lasers de 550 μm de long) laissent présager un fonctionnement prochain en courant continu. / Silicon-On-Insulator (SOI) is today the utmost platform for the fabrication of compact optical functions. This common platform with microelectronics favors the integration of photonic circuits with CMOS circuits. Nevertheless, if silicon allows for the fabrication of compact passive photonic functions, its poor light emission properties constitute a major obstacle to the development of an integrated laser source. The solution used within the framework of this thesis consists in integrating III-IV laser stacks on 200 mm SOI wafers by the mean of SiO2-SiO2 direct bonding. The aim of this work is to demonstrate a III-V on SOI laser that couples at least 1mW to a silicon waveguide. Our approach is to transfer a maximum of the laser complexity to the silicon, which processes are familiar to microelectronics. Ideally, III-V should be just used as a gain material ; the laser cavity being made out of silicon. However, this approach is not so easy to put into practice. Indeed, photons are generated by the III-V waveguide but have to be transferred into the silicon waveguide located under the stack. The difficulty is that both waveguides are separated by a low index bonding layer, which thickness ranges from one hundred to several hundreds of nanometres. The development of a III-V on SOI laser then requires a new thinking of the whole laser system. Therefore, our work has consisted in designing a III-V on silicon hybrid laser that takes into consideration the specific constraints of the integration technology. Based on the coupled mode theory and on the photonic crystals concepts, we have designed, fabricated and characterized an hybrid Distributed Feedback Laser (DFB). Its original work principle allows for both a high amount of gain and coupling efficiency, thanks to a continuous circulation of photons from the III-V to the SOI waveguide. On these devices, we show a monomode laser emission at room temperature (with a side mode suppression ratio of 35dB) under pulsed optical and electrical pumping. As expected, the lasing wavelength is function of the DFB grating pitch. The lasers work with a bonding layer as thick as 200nm, that greatly relaxes the constraints of the bonding technology. Lasers work down to a minimum length of 150 μm, which is the shortest laser lenght of the mask. Despite the low power levels collected by the fibre during the characterizations, accounting for the high optical losses due to the fiber couplers, the optical power effectively injected to the silicon waveguide should be in the miliwatt range. Unfortunately, the low threshold current densities measured under pulsed operation (300 A / cm2 at room temperature) suggest that the continuous-wave regime should be reached in a very near future.
3

Silicon Photonic Devices for Microwave Signal Generation and Processing

Ehteshami, Nasrin January 2016 (has links)
Silicon photonics as a one of the most promising photonic integration technologies has attracted many attentions in recent years. The major feature of this technology is its compatibility with complementary metal-oxide semiconductor (CMOS) processes which makes it possible to integrate optical and electronic devices in a same chip and reduce the cost significantly. Another reason of using silicon photonics is the high index contrast between the silicon core and silicon dioxide cladding which ensures the high density integration of photonic devices on a single chip. Monolithic integration with electronic and optical circuits makes silicon photonics technology suitable for numerous applications. One example is microwave photonics (MWP). MWP is an area that studies the interaction between microwave and optical signal for the generation, processing, control and distribution of microwave signals by means of photonics. Silicon photonics offers a reduction in footprint, losses, packaging cost and power dissipation in MWP systems. This research in this thesis is focused on the design and fabrication of the silicon photonic devices for MWP signal processing and generation. Four MWP systems based on silicon photonic devices are proposed and experimentally demonstrated. 1) A single pass-band frequency-tunable MWP filter based on phase-modulation to intensity-modulation conversion in an optically pumped silicon-on-insulator (SOI) microring resonator (MRR) is designed and experimentally demonstrated. In the proposed filter, a phase-modulated optical signal is filtered by the SOI MRR, to have one first-order sideband suppressed by the MRR notch. The phase-modulated optical signal is converted to an intensity-modulated single-sideband (SSB) signal and detected at a photodetector (PD). The entire operation is equivalent to a single pass-band filter. The frequency tunability is achieved by tuning the resonance wavelength of the MRR, which is realized by optically pumping the MRR. A single pass-band MWP filter with a tunable center frequency from 16 to 23 GHz is experimentally demonstrated. 2) A broadband optically tunable MWP phase shifter with a tunable phase shift using three cascaded SOI MRRs that are optically pumped is designed and experimentally demonstrated. A microwave signal to be phase shifted is applied to an optical single-sideband (OSSB) modulator to generate an optical carrier and an optical sideband. The phase shift is introduced to the optical carrier by placing the optical carrier within the bandwidth of one resonance of the three cascaded MRRs. The experimental results show that by optically pumping the cascaded MRRs, a broadband MWP phase shifter with a bandwidth of 7 GHz with a tunable phase shift covering the entire 360o phase shift range is achieved. 3) A multi tap MWP filter with positive and negative coefficients using a silicon ring resonator modulator (RRM) is proposed and experimentally demonstrated. The RRM is designed and fabricated to operate based on the carrier depletion effect. The positive and negative coefficients are obtained by using opposite slopes of the modulation transmission response of the RRM. Two filter responses with two and three taps are experimentally demonstrated, showing the proof-of-principle for frequencies up to 18 GHz. 4) An approach to generate microwave signal based on enhanced four wave mixing (FWM) in an active silicon waveguide (SiWG) is studied. This SiWG is designed and fabricated, and the use of the active SiWG for MWP frequency multiplication to generate a frequency-sextupled millimeter-wave signal is experimentally demonstrated. Thanks to a reverse-biased p-n junction across the SiWG, the conversion efficiency of the FWM is improved, which leads to the improvement of the microwave frequency multiplication efficiency.

Page generated in 0.067 seconds