The Master thesis deals with technology of mounting QFN packages on to the printed circuits boards. Describes also influence of shape and size of soldering pads and the amount of soldering paste with respect to the quality and the reliability. In first part overview of existing packages is summarised. Second part describes design of testing board and the factors which leads to eliminating errors during manufacturing process.

Le développement à grande échelle des microbatteries pour des applications diverses comme l’alimentation de secours de certains composants électroniques dans les téléphones portables nécessite une compatibilité avec le procédé de solder-reflow employé dans le domaine de la microélectronique. Dans ce contexte, cette étude porte sur la mise au point d’un nouveau procédé de réalisation de couches minces d’oxysulfures de titane lithiés (LixTiOySz) pour une utilisation en tant qu’électrode positive dans une microbatterie Li-ion. Tout d’abord ce travail a débuté par la synthèse et la caractérisation de plusieurs compositions de sulfures de titane lithiés à l’état massif par réaction en solution de TiS2 ou TiS3 avec le n-butyllithium mais aussi par réaction à l’état solide à haute température entre les précurseurs TiS2, Li2S et Ti. Par la suite, des couches minces de LixTiOySz ont été déposées par pulvérisation cathodique radiofréquence à effet magnétron de cibles réalisées à partir des matériaux lithiés à l’état massif. La composition chimique de ces dépôts dépend de celle de la cible utilisée ce qui permet d’obtenir des couches plus ou moins riches en lithium et en soufre. En revanche, elles sont toutes très mal cristallisées, denses et elles ne présentent pas de structuration particulière. Enfin, les caractérisations électrochimiques des dépôts de LixTiOySz, à la fois en électrolyte liquide et solide, ont permis de mettre en évidence une corrélation entre leur composition chimique et leur comportement électrochimique. Globalement, ces dernières sont performantes, compatibles avec le solder-reflow et donc tout à fait intéressante pour l’application. / Large-scale development of microbatteries for various applications such as back-up power sources for cell phone electronic components needs suitability with reflowing process that is often used in microelectronic. Here we report on the development of a new realization process to produce lithiated titanium oxysulfides (LixTiOySz) thin films for use as positive electrode in Li-ion microbatteries. First of all, this work began with synthesis and characterization of several lithiated titanium sulfides compounds prepared by reaction between TiS2 or TiS3 with n-butyllithium but also by solid state reaction at high temperature between TiS2, Li2S and Ti. Then, LixTiOySz thin films were sputtered by magnetron effect radio-frequency sputtering from targets made of lithiated materials previously synthesized. The chemical composition of those films depends on the target one and allows obtaining thin films with different lithium and sulfur contents. In contrast, they are all amorphous, dense and they don’t have a morphological structuration. Finally, electrochemical characterizations of thin films, both in liquid and solid electrolyte, have highlighted a correlation between their chemical composition and their electrochemical behavior. Taken as a whole, LixTiOySz thin films are powerful, suitable with reflowing process and thus very interesting for the application.

Over the past 50 years, electronics manufacturing industry has undergone revolutionary changes, which have provided consumers with a plethora of electronic products. The increase in functionality of electronic products and decrease in cost due to continuous miniaturization and lower manufacturing costs have evolved over time. As electronics manufacturing technology becomes more advanced, reliability of electronic products and devices have become more of a concern. Thermomechanical reliability in electronics is studied in this research. Thermomechanical failures are failures due to temperature loading conditions electronic products and devices experience during manufacturing and service. The thermomechanical issue studied in this research is the effect of convective solder reflow on the warpage of packaged electronic devices, bare boards and chip packages. A convective reflow-projection moir warpage measurement system is designed and implemented in this research. The system is the first available system capable of measuring warpage of printed wiring boards (PWBs) with and without electronic components during simulated convective reflow process. A finite element prediction tool is also developed to predict the warpage of PWBs populated with plastic ball grid array (PBGA) packages. The developed warpage measurement system as well as the developed finite element model is used to study various PWB assembly (PWBA) configurations during simulated convective reflow processes.

This diploma thesis is focused on detecting of defects on BGA (Ball Grid Array) components using of X-ray. Defects are formed during reflow BGA components during assembly, but also later due to mechanical and thermal stress. Therefore, there is an overview of defects and methods of diagnosis of BGA packages eg .: modern X-ray defect detection or micro sections. There is disclosed a device NORDSON DAGE XD7600NT its operation and setup. The device enables advanced methods of scanning called X-plane. For creating 3D models used reconstructive software called CERA, which uses raw data from the method of X-Plane.