The factors determining the quality of surface mount technology (SMT) solder joints are numerous, and complex. The exploration of these factors, and how they may affect the reliability and quality of the joints can only be achieved through continuous research. In this project, essential areas of SMT joints were selected for study and analysis, with the intention of providing additional design and process guidelines for the production of quality SMT joints. In the infrared reflow process, one of the common defect phenomena is the occurrence of tombstoning; that is after soldering only one end of the component is soldered while the other is lifted up, assuming a position like a tombstone. The initiation of tombstoning during reflow was analysed based on the forces acting on the component. A model was developed to predict the initiation of this phenomenon. The model shows that, under vibration-free conditions, the surface tension of the molten solder is the source of the force causing the initiation of tombstoning. The contact angle, which varies with the length of the printed circuit board solder land, has a significant effect on the value of the surface tension acting as a force pulling upward on the component. The model further shows that tombstoning initiation is due to the combined effects of the surface tension; the weight of the component; the dimensions of the component; the length of the solder underneath the component; and the length of the solder protruding from the end of the component. Selected components were used as examples for predicting the conditions of initiation, and these conditions were further substantiated by a series of experiments. Another area of study was a method which directly pulled the components off printed circuit boards and this was used as a means for testing the bond quality of surface mount technology leadless chip solder joints. Components D7243, CC1206, RC1206, RC121O, and CC1 812 were selected for this study. It was found that the ultimate tensile force which breaks a component off the printed circuit board has the potential to be used as a parameter for measuring the quality of the solder joint. The effect of solder thickness on the strength of a joint has also been investigated. The shape of joints soldered by two methods, wave soldering and infrared reflow, were compared. Joints at the two ends of a component produced by infrared reflow were found more uniform than the ones produced by wave soldering. A recommendation is made here for the wave soldering approach in achieving uniform solder joints. The effects of solder shape on the joint strength were further investigated by finite element analysis. A convex joint was found marginally more robust than a concave joint. Two aspects of the internal structure of SMT solder joints were investigated, void content and copper/tin intermetallic compounds. The voiding conditions of wave-soldered and infrared reflow joints were compared. No voids were found in all specimens that were produced by wave soldering. However, there were always voids inside joints produced by infrared reflow. Microhardness tests indicated that the hardness of compounds at the copper/solder interface of infrared reflowed joints is lower than that in the wave-soldered joints. It is considered that the lower hardness of the interfacial region of the infrared reflowed joints is due to the presence of voids. Scanning electron microscopy was used to study the formation of copper/tin intermetallic compounds for joints produced by infrared reflow. The results show that Cu 6 Sn5 was the only compound with a detectable thickness. Other compounds such as Cu3 Sn, were virtually not found at all. Aging of the joints at 100°C, shows that both the Cu 6Sn5 and the overall interfacial thickness grew with time. One of the important areas which had been overlooked previously and was studied in some details was the effects of solder paste exposure on the quality of solder paste. The characteristic changes of solder paste due to exposure were investigated in three areas, weight loss, tackiness, and rheology. The evaporation of low boiling point solvents was considered as the main contribution to the loss in the weight of the solder paste. The weight loss against exposure time was found to follow an exponential behaviour. A method was designed to evaluate the tackiness changes of solder paste due to exposure. It was found that the decay of tackiness against exposure time can be expressed by a power law. It is recommended that solder paste manufacturers should provide the necessary characteristic constants so as to enable the characteristics to be calculated after a specific exposure. The rheological changes of the solder paste as a result of exposure were also investigated. The implication on the printability of the solder paste due to these changes was studied and discussed.

Chlorinated solvents are common contaminants in soil and water. Under anaerobic conditions microbes are capable of transforming chlorinated solvents into ethylene which would result in a remediation of the contaminated area. In order to use natural attenuation as a remediation method evidence of continuous degradation is required. Furthermore, the degradation must occur at a sufficient rate and continuous monitoring of the site is needed until the demanded levels are achieved. A field study was performed on the basis of data from a dry-cleaning facility contaminated mainly by perchloroethylene. The purpose of the study was to define the existing situation regarding distribution and transformation of contaminant in order to evaluate the possibilities of using natural attenuation as a method of remediation. Degradation of perchloroethylene proceeds through successive removal of chlorine, with the formation of trichloroethylene, dichloroethylene, vinyl chloride and ethylene. There exists evidence of degradation as far as vinyl chloride on the site but whether transformation continues to ethylene is not established. The computer model Biochlor was used to simulate distribution and degradation of the contaminants. The site possesses a complex hydrogeology and the existing data are not sufficient to distinguish the effect of degradation from other factors such as spreading of contaminant between different layers of soil. Since degradation failed to be quantified, natural attenuation can not be recommended as a safe remediation method at the considered site without further investigations. / Klorerade lösningsmedel är vanligt förekommande föroreningar i mark och vatten. Under anaeroba förhållanden kan mikrober omvandla klorerade kolväten till eten vilket leder till rening av det förorenade området. För att kunna använda denna naturliga nedbrytning som saneringsmetod krävs bevis för att nedbrytning fortskrider i tillräcklig utsträckning för att rena området och därefter krävs kontinuerlig provtagning till dess målen för saneringen har uppnåtts. En fallstudie utfördes utifrån data från en kemtvättsfastighet förorenad av i första hand perkloreten. Syftet var att kartlägga föroreningssituationen med avseende på spridning och nedbrytning av de klorerade föreningarna för att undersöka om naturlig nedbrytning var en möjlig framtida saneringsmetod. Nedbrytning av perkloreten sker stegvis genom att klor avspjälkas, under bildande av produkterna trikloreten, dikloreten, vinylklorid och etengas. Nedbrytning av förorening har konstaterats ske på fastigheten fram till vinylklorid men huruvida nedbrytning avstannat där eller fullföljts till etengas är ej klarlagt. Datormodellen Biochlor användes för att simulera spridning och nedbrytning av utsläppet. Fältplatsen har en komplex hydrogeologi och befintliga fältdata var inte tillräckliga för att särskilja nedbrytningens effekt från faktorer såsom spridning av förorening mellan olika jordlager. Eftersom nedbrytningen inte kunde kvantifieras kan naturlig nedbrytning inte rekommenderas som säker saneringsmetod på denna fältplats utan kompletterande analyser.

Since resin composites were first presented to dentistry more than half a century ago, the composition of resin composites has developed significantly. One major change was that the reinforcing filler particles were reduced in size to generate materials of a given filler content that display better physical and mechanical properties. Resin composites may absorb water and chemicals from the surrounding environment but at the same time, composites may release constituents to their surroundings. The physical/mechanical properties of a restorative material provide an indication of how the material will function under stress in the oral environment. The aims of this research were to examine the effects of water at 37°C on the physical and mechanical properties, and the effect of food-simulating solvents of a variety of experimental and contemporary resin composites, on the surface properties. Eight representative resin composites were selected (Exp. VT, BL, NCB, TEC, GSO, XB, VDF and CXD). Due to the recent development of bulk fill materials on the market during the course of this research, the post-cure depth of cure of new bulk fill materials was also investigated. Five representative resin composites were selected: TBF, XB, FBF, VBF and SF. Water sorption and solubility were investigated at 37°C for 150 days. Sorption and solubility are affected by the degree of hydrophilicity of the resin matrix. The bulk fill materials examined showed the lowest water sorption and solubility. Laser scan micrometer (LSM) was used to investigate hygroscopic expansion. The extent of the hygroscopic expansion positively correlated with the amount of water sorption. The effect of water on fracture toughness was also examined. A self-adhesive hydrophilic resin matrix decreased in fracture toughness after 7 days of storage at 37°C. By contrast, the least water absorbed bulk fill material increased in fracture toughness over time. The effect of food-simulating solvents (distilled water, 75% ethanol/water and MEK) on surface micro-hardness, colour stability and gloss retention were investigated. The MEK solvent resulted in the lowest micro-hardness and the greatest colour change (ΔE) for most of the examined composites, while the 75% ethanol/water solution caused the greatest loss in gloss for most of the examined composites. A highly filled nano-composite showed the best result over time, regardless of the condition of storage. Surface micro-hardness profiles were used as an indirect method to assess the depth of cure of bulk fill resin composites. The examined bulk fill resin composites can be cured to an acceptable depth (4 mm).

This thesis explores the robustness and the versatility of pressurized hot water extraction (PHWE) for a variety of analytes and matrices. Applications discussed include: selective extraction of alkaloids in goldenseal followed by their degradation studies; in-cell clean-up of pesticides in medicinal plants employing custom made molecularly imprinted polymers (MIPs) sorbents; in-cell pre-concentration followed by desorption of aflatoxins in plants with MIPs; desorption of pesticides from electrospun nanofiber sorbents; and removal of templates from MIPs sorbents. It was demonstrated that selective extractions could be achieved by just changing the temperature of water while adjusting the pressure. For instance, the alkaloids in goldenseal (hydrastine and berberine), were extracted at 140 °C, 50 bars, 1 mL min⁻¹ in 15 min; organochlorine pesticides from medicinal plants were extracted at 260 °C, 80 bars, 1 mL min-1 in 10 min; while aflatoxins AFG2, AFG1, AFB2 and AFB1 were extracted at 180 °C, 60 bars and a flow rate of 0.5 mL min⁻¹ in 10 min. The selectivity of PHWE was further enhanced by combining it with selective MIPs sorbents at higher temperatutes. In-cell clean-up of interfering chlorophyll was successfully removed from the medicinal plants during pesticides analysis while clean-up of aflatoxins AFG2, AFG1, AFB2 and AFB1 was achieved in two extraction cells connected in series. Ultrasound was also combined with PHWE for extraction of hydrastine and berberine at 80 °C and 40 bars in 30 min. PHWE was further evaluated for removal of templates from quercetin, phthalocynine and chlorophyll MIPs. The templates were thoroughly washed off their MIPs within 70 min with PHWE compared to over 8 h for Soxhlet and ultrasound assisted extraction. Pesticides were also desorbed from electrospun nanofibers at 260 °C, 80 bars in 10 min employing only water at 0.5 mL min⁻¹. In the light of green chemistry, the decrease in the usage of organic solvents was 100%, resulting in no organic solvent waste.

The electrochemical oxidation of CoCl2(PPh3)2 was investigated in a mixture of acetonitrile and pentanol (1:1) at a platinum disk working electrode using Cyclic Voltammetry (CV) and Chronoamperometry. Elemental Analysis and Infrared Spectroscopy were used to characterise the synthesized compounds i.e. CoCl2(PPh3)2 and CoCl(PPh3)3. Cyclic Voltammetry was utilised for the examination of different working electrode materials that could be used for the anodic voltammetric studies of CoCl2 (PPh3)2, to characterise the reactants and products of each electrode reaction, to investigate the chloride binding ability to a CoCl(PPh3)3 complex, and to evaluate the electrocatalytic substitution of chloride by PPh3 from the complex CoCl2(PPh3)2. Use of ferrocene as an internal standard during the anodic studies of CoCl2(PPh3)2 was also evaluated. The number of electron involved in the electrode process, CoII to CoIII from CoCl2(PPh3)2 and diffusion coefficient of ferrocene in a mixture of acetonitrile and pentanol (1:1) were determined using Chronoamperometry. Ultraviolet-Visible (UV-Vis) and 31P Nuclear Magnetic Resonance (31P NMR) spectra were used to assist with the characterisation of the electrode reactions involved during oxidation of CoCl2(PPh3)2. / Dissertation (MSc (Chemistry))--University of Pretoria, 2008. / Chemistry / unrestricted

Flash photolysis techniques were applied to studies of solvent displacement by Lewis bases (L) from solvated metal carbonyl complexes of Cr, Mo, and W. On the basis of extensive studies of the reaction rate laws, activation parameters , and linear-free-energy-relationships, it was concluded that the mechanisms of solvent displacement reactions depend on the electronic and steric properties of the solvents and L, as well as the identities of the metal atoms. The strengths of solvent-metal bonding interactions, varying from ca. 7 to 16 kcal/mol, and the bonding "modes" of solvents to metals are sensitive to the structures of the solvent molecules and the identities of the metal centers. The results indicate dissociative desolvation pathways for many arene solvents in (solvent)Cr(CO)_5 (solvent = benzene, fluorobenzene, toluene, etc.) complexes, and are consistent with competitive interchange and dissociative pathways for (n-heptane)M(CO)_5. Different types of (arene)-Cr(CO)_5 interactions were suggested for chlorobenzene (CB) vs. fluorobenzene and other non-halogenated arenes, i.e. via σ-halogen-Cr bond formation in the CB solvate vs. π-arene-Cr bond formation through "isolated" double bonds in solvates of the other arenes. The data also indicate the increasing importance of interchange pathways for solvent displacement from the solvates of Mo and W vs. that of Cr.