No description available.

Techn. Univ., Diss.--Dresden, 2006.

In recent years, the miniaturization of cell phones and computers has led to a requirement for antennas to be small and lightweight. Antennas, desired to operate in the WLAN frequency range, often possess physical sizes that are too large for integration with radio-frequency (RF) devices. When integrating antennas into three-dimensional (3D) system-on-package (SOP) transceivers, the maintenance of a compact size also provides isolation from other devices, hence, surface wave propagation or high dielectric constant materials such as low temperature cofired ceramics (LTCC) does not affect nearby components of the transceiver such as filters, baluns, and other embedded passives. Therefore, the application of design methods is necessary for realizing compact antennas in the wireless community that can be integrated to RF packages. Furthermore, it is essential that these compact antennas maintain acceptable performance characteristics, such as impedance bandwidth, low cross-polarization, and high efficiency. In addition, the analysis of circuit modeling techniques that could be used to obtain a better understanding of the physical phenomena of the antenna is quite necessary as modules become more and more complex. Based on these requirements, the focus of this research is to improve the design of compact antennas for wireless communications, wireless local area networks (WLAN), and millimeter-wave applications by using time-domain electromagnetic and circuit modeling techniques and optimizations. These compact antenna designs are applied to practical wireless communications systems such as global system of mobile communications (GSM), Bluetooth Industrial-Scientific-Medical (ISM) devices, IEEE802.11a WLAN, and Local Multipoint Distribution Systems (LMDS) applications. Parametric analyses are conducted to study critical parameters that may affect the antenna designs. Moreover, optimizations are performed to optimize the structures, and measured results are presented to validate design techniques.

Zugl.: Dresden, Techn. Univ., Diss., 2006

Aachen, Techn. Hochsch., Diss., 2007.

Bandpass filters are an essential component of wireless communication systems that only transmits frequencies corresponding to the communication band and rejects all other frequencies. As the deployment of 5G draws nearer, first deployments are expected in 2020 [1], the need for viable filters at the new frequency bands becomes more imminent. Size and performance are two critical considerations for a filter that will be used in emerging mobile communication applications. The high frequency of 5G communication, 28 GHz as opposed to sub 6 GHz for nearly all previous communication protocols, means that previously utilized lumped component based solutions cannot be implemented since they are ill-suited for mm-wave applications. The focus of this work is the miniaturization of a high-performance filter. The Substrate Integrated Waveguide (SIW) is a high performance and promising structure and Low Temperature Co-Fired Ceramic (LTCC) is a high-performance material that both can operate at higher frequencies than the technologies used for previous telecommunication generations. To miniaturize the structure, a compact folded four-cavity SIW filter is designed, implemented and tested. The feeding structure is integrated into the filter to exploit the System on Package (SoP) attributes of LTCC and further reduce the total area of the filter individually and holistically when looking at the final integrated system. Two unique three dimensional (3D) integrated SoP LTCC two-stage SIW single cavity filters and one unique four-cavity filter all with embedded planar resonators are designed, fabricated and tested. The embedded resonators create a two-stage effect in a single cavity filter. The better single cavity design provides a 15% fractional bandwidth at a center frequency of 28.12 GHz, and with an insertion loss of -0.53 dB. The fabricated four-cavity filter has a 3-dB bandwidth of .98GHz centered at 27.465 GHz, and with an insertion loss of -2.66 dB. The designs presented highlight some of the previously leveraged advantages of SoP designs while also including additions of embedded planar resonators to feed the SIW cavity. The integration of both elements realizes a compact and high-performance filter that is well suited for future mm-wave applications including 5G.

Les travaux présentés dans cette thèse sont une contribution à l'étude d'antennes reconfigurables à base de MEMS en intégration hétérogène 3D pour les systèmes de communication millimétriques. Ces travaux de thèse s'inscrivent dans le cadre d'un projet ANR nommé SIPCOM (Intégration hétérogène 3D (System-In-Package) pour objets communicants en gamme millimétrique), qui concerne l'intégration hétérogène d'un microsystème intelligent communicant à 60GHz. Au cours de ce manuscrit, nous proposons la réalisation d'antennes sur membrane selon 3 technologies. Dans un premier temps, une nouvelle technologie simple et bas coût basée sur un empilement de FR4 et de Pyralux ainsi qu'un nouveau concept d'antenne patch sur membrane alimentée par un guide d'onde intégré via une fente de couplage sont présentés. Dans un second temps, ce nouveau concept d'antenne a été adapté afin de pouvoir l'intégrer au module SiP réalisé en technologie Silicium / BCB. Enfin, la troisième technologie basée sur des substrats de quartz permet de démontrer la faisabilité d'une antenne à balayage électronique pour laquelle chaque excitateur est intégré dans le design d'un déphaseur à base de MEMS permettant de s'affranchir des interconnexions par bonding entre le déphaseur et la partie antennaire. / The work presented in this PhD thesis is a contribution for the study of reconfigurable antennas based on MEMS integration for 3D heterogeneous millimeter communication systems. This study falls within the framework of a ANR project named SIPCOM, for heterogeneous integration of smart millimeter communicating systems. During this manuscript, we propose the implementation of membrane antennas with three technological processes. Firstly, a new simple and low cost technology based on FR4 and Pyralux substrates and a new concept of patch antenna fed by integrated waveguide are investigated. In a second time, this new antenna design has been matched in order to be integrated in the SIP module using Silicon/BCB technology. The third technology based on quartz substrates is used to demonstrate the feasibility of an electronic beamscanning antenna for which one each slot feeder is integrated into the design of the MEMS phase shifter to overcome the bonding interconnections between the phase shifter and the antenna.

由於產品微型化的趨勢，與近十年「系統單晶片」(System-on-Chip，SoC)的發展方向截然不同地，「系統構裝晶片」(System-in-Package，SiP) 技術成為為近年新興產業技術，更已成為未來半導體及封測產業重點發展方向。近年來國內外已陸續發表針對「系統構裝晶片」的技術論文或期刊，但大多數的研究文獻僅著重於「系統構裝晶片」的技術，少有對「系統構裝晶片」產品開發者如何進行市場推廣的深入探討。 本研究將從半導體產業現況來說明「系統構裝晶片」的未來發展潛力；接著以「交易成本理論」以及「策略行銷4C架構」做為理論基礎，分析「系統構裝晶片」的產品特性，並進而歸納出「系統構裝晶片」產品的市場行銷策略，以期對於有志從事「系統構裝晶片」產品市場銷售推廣之業者有所助益。 本研究並以「交易成本理論」為根據，指出半導體產業因「系統構裝晶片」的興起而導致可能的演變，以期對於從事產業分析及觀察之有志之士提供一些未來研究觀察之可能方向。 / As a result of the microminiaturization's tendency, with in the recent ten years “System-on-Chip” (SoC) development, “System-in-Package” (SiP) technology which is entirely different for the recent years emergent industry technology, has become the future prioritize direction of the semiconductor and package-and-testing industry. In recent years domestic or foreign paper or the periodical has published one after another aims at “SiP” the technology, however the majority research literature only emphatically on “SiP” techniques, how to explore the market of “SiP” product is still rare to be seen. This research will deviate the future industry development potential of “SiP” from the present situation of semiconductor industry; Then take the “4C framework of Strategic Marketing” as well as the “Transaction Cost Theory” as the rationale to analysis the characteristic of “SiP” product, and then induces the marketing strategy of “SiP” product, hence to provide some guideline of marketing or promotion to those entrepreneurs of “SiP” industry. This research also takes the “Transaction Cost Theory” as the basis, points out the possible evolution of semiconductor industry because of the emerging “SiP” technology, hence to provide some possible direction to those who are devoted to future industry observation and research.

Afin d'étendre la diversité des composants intégrables dans un System in Package (SiP), il apparaît nécessaire de développer l'intégration de composants hétérogènes. Cette étude présente une solution par report avec un scellement en polymère. L'utilisation de ces matériaux entraîne des problèmes de fiabilité thermomécanique. Grâce à un prototype virtuel, il est possible d'évaluer les sollicitations et de comprendre ce comportement de la structure. Cela permet de mieux appréhender les mécanismes de défaillance et d'optimiser la structure avant sa fabrication. Pour démontrer la faisabilité, nous avons utilisé des filtres à ondes acoustiques de surfaces (SAW filters). Nous avons étudié trois types de polymères (BCB, SU8 et TMMF) pour réaliser le scellement et protéger le filtre. Différents tests mécaniques, électriques et de fiabilité ont permis de valider cette solution. Nous avons réalisé un SiP comprenant un tuner et un filtre SAW dans un même boîtier pour de la télévision sur mobile / In the objective to extend the variety of the integrated components inside a System in Packahe (SiP), it is necessary to develop the integration of heterogeneous component. This study presents a flip-chip solution with an adhesive bonding. The use of such materials involves some problems of thermo-mechanical reliability. With virtual prototyping, it is possible to evaluate the strains and to understand the behaviour of the structure. These allow us to know the origin of the failure and to optimize its design before the fabrication. The feasability of the technique is demonstrated with a surface acoustic waves filter (SAW). We study three different types of polymer (BCB, SU-8 and TMMF) for the sealing and for the protection of the active area of the filter. Different tests : mechanical, electrical and reliability validate our solution. We have made a complete SiP composed by a silicon tuner and a SAW filter inside a single package for a television on mobile application

Ubiquitous computing and Internet-of-Things (IoT) implies an untapped opportunity in the realm of information and communication technology, in which a large number of micro-devices with communication and/or computing capabilities, provides connectivity for anything, by anyone at anytime and anywhere. Especially, these devices can be equipped with sensors and actuators that interact with our living environment. Barcode, smart contactless card, Radio Frequency Identification (RFID) systems, wireless sensor network (WSN), and smart mobile phones are some examples which can be utilized in ubiquitous computing. RFIDs and WSN have been recognized as the two promising enablers for realization of ubiquitous computing. They have some great features such as low-cost and small- size implementation, non-line of sight operation, sensing possibilities, data storing ability, and positioning. However, there are several challenges which need to be addressed, such as limited life time for battery powered device, maintenance cost, longer operation range, higher data rate, and operation in dense multipath and multiuser environment. Ultra-Wideband Impulse Radio (UWB-IR) with its huge advantages has been recognized as a great solution for future WSN and RFID. UWB-IR technique has the possibility of achieving Gb/s data rate, hundreds of meter operation range, pJ energy per bit, centimeter accuracy of positioning, and low cost implementation. In this work utilization of UWB-IR in WSN and RFID is investigated. A wireless sensor network based on UWB-IR is proposed focusing on low-cost and low-power implementation. Our contribution is to imply two different architectures in base station and sensor nodes to satisfy power, complexity and cost constraints. For sensor nodes, an autonomous UWB-IR detection is proposed, which detects the UWB signal autonomously and no restrict synchronization is required. It reduces the circuit complexity significantly. The performance in term of bit-error-rate is compared with two other common detection techniques. It is shown that the new detection is more robustness to timing jitter and clock skew, which consequently reduces the clock and synchronization requirements considerably. A novel wireless sensing and identification system, based on remote-powered tag with asymmetric wireless link, is proposed. Our innovative contribution is to deploy two different UWB and UHF communication techniques in uplink and downlink respectively. In the proposed system, tags capture the required power supply from different environmental sources (e.g. electromagnetic wave transmitted by a reader) and transmit data through an ultra-low power impulse UWB link. A new communication protocol is devised based on slotted-aloha anti-collision algorithm. By introducing several improvements including of pipelined communication, adaptive frame size, and skipping idle slots, the system throughput of more than 2000 tags/s is achieved. To prove the system concept a single chip integrated tag is implemented in UMC 0.18μm CMOS process. The measurement results show the minimum sensitivity of -18.5 dB (14.1 μW) and adaptive data rate up to 10 Mb/s. It corresponds to 13.9 meters operation range, considering 4W EIRP, a matched antenna to the tag with 0dB gain, and free space path loss. This is a great improvement in operation range and data rate, compared with conventional passive RFID, which data rate is limited to a few hundreds of Kb/s. System integration in a Liquid-Crystal-polymer (LCP) substrate is investigated. The integration of a tunable UWB-IR transmitter and a power scavenging unit are studied. Our contribution includes embedding and modeling the RF components and antenna in substrate and co-optimizing the chip and package with on-chip versus off-chip passives trade-offs. Simulation results verify the potential of system-on-package solution for UWB integration. The effect of antenna miniaturization in a UWB system is studied. Our focus is to scale down a UWB antenna and optimize the performance through the chip-antenna co-design. A tunable impulse- UWB transmitter is designed in two cases - a conventional 50Ω design and a co-design methodology. The simulation results show that the standard 50Ω design technique can not reach the best condition in all cases, when a real antenna is placed into the system. The performance can be improved significantly when doing codesign. The antennas and UWB transmitter performances are evaluated in a given UWB systems. It is shown that the operation distance at a target performance is reduced with antenna scaling factor and it can be compensated by antenna-transceiver co-design. The result proves the importance of antenna-transceiver codesign, which needs to be addressed in the earliest phases of the design flow. / QC 20100701