Scheduling is one of the most important issues in the planning of manufacturing systems. This research focuses on solving the test scheduling problem which arises in semiconductor manufacturing environment. Semiconductor wafer devices undergo a series of test processes conducted on computer-controlled test stations at various temperatures. A test process consists of both setup operations and processing operations on the test stations. The test operations occur in a specified order on the wafer devices, resulting in precedence constraints for the schedule. Furthermore, the assignment of the wafer devices to test stations and the sequence in which they are processed affects the time required to finish the test operations, resulting in sequence dependent setup times. The goal of this research is to develop a realistic model of the semiconductor wafer test scheduling problem and provide heuristics for scheduling the precedence constrained test operations with sequence dependent setup times. A mathematical model is presented and two heuristics are developed to solve the scheduling problem with the objective of minimizing the makespan required to test all wafer devices on a set of test stations. The heuristic approaches generate a sorted list of wafer devices as a dispatching sequence and then schedule the wafer lots on test stations in order of appearance on the list. An experimental analysis and two case studies are presented to validate the proposed solution approaches. In the two case studies, the heuristics are applied to actual data from a semiconductor manufacturing facility. The results of the heuristic approaches are compared to the actual schedule executed in the manufacturing facility. For both the case studies, the proposed solution approaches decreased the makespan by 23-45% compared to the makespan of actual schedule executed in the manufacturing facility. The solution approach developed in this research can be integrated with the planning software of a semiconductor manufacturing facility to improve productivity. / Master of Science

IEEE P1687 (IJTAG) is proposed to add more exibility|compared with IEEE 1149.1 JTAG|for accessing on-chip embedded test features called instruments. This exibility makes it possible to include and exclude instruments from the scan path. To reach a minimal test time, all instruments should be accessed concurrently. However, constraints such as power and resource constraints might limit concurrency. There is a need to consider power and resource constraints while developing the test schedule. This thesis consists of two parts. In the rst part, three test time calculation approaches, namely session-based test schedule with a xed scan path, session-based test schedule with a recongurable scan path, and session-less test schedule with a recongurable scan path are proposed. In the second part, three test scheduling approaches, namely session-based test scheduling, optimized session-based test scheduling, and optimized session-less test scheduling are studied and three algorithms are presented for each of the test scheduling approaches. Experiments are carried out using the test scheduling approaches and the results show that optimized sessionless test scheduling can signicantly reduce the test time compared with session-based test scheduling.

Multi-criteria scheduling provides the opportunity to create mathematical optimization models that are applicable to a diverse set of problem domains in the business world. This research addresses two different employee scheduling applications using multi-criteria objectives that present decision makers with trade-offs between global optimality and the level of disruption to current operating resources. Additionally, it investigates a scheduling problem from the product testing domain and proposes a heuristic solution technique for the problem that is shown to produce very high-quality solutions in short amounts of time. Chapter 2 addresses a grant administration workload-to-staff assignment problem that occurs in the Office of Research and Sponsored Programs at land-grant universities. We identify the optimal workload assignment plan which differs considerably due to multiple reassignments from the current state. To achieve the optimal workload reassignment plan we demonstrate a technique to identify the n best reassignments from the current state that provides the greatest progress toward the utopian solution. Solving this problem over several values of n and plotting the results allows the decision maker to visualize the reassignments and the progress achieved toward the utopian balanced workload solution. Chapter 3 identifies a weekly schedule that seeks the most cost-effective set of coach-to-program assignments in a gymnastics facility. We identify the optimal assignment plan using an integer linear programming model. The optimal assignment plan differs greatly from the status quo; therefore, we utilize a similar approach from Chapter 2 and use a multiple objective optimization technique to identify the n best staff reassignments. Again, the decision maker can visualize the trade-off between the number of reassignments and the resulting progress toward the utopian staffing cost solution and make an informed decision about the best number of reassignments. Chapter 4 focuses on product test scheduling in the presence of in-process and at-completion inspection constraints. Such testing arises in the context of the manufacture of products that must perform reliably in extreme environmental conditions. Each product receives a certification at the successful completion of a predetermined series of tests. Operational efficiency is enhanced by determining the optimal order and start times of tests so as to minimize the make span while ensuring that technicians are available when needed to complete in-process and at-completion inspections We first formulate a mixed-integer programming model (MILP) to identify the optimal solution to this problem using IBM ILOG CPLEX Interactive Optimizer 12.7. We also present a genetic algorithm (GA) solution that is implemented and solved in Microsoft Excel. Computational results are presented demonstrating the relative merits of the MILP and GA solution approaches across a number of scenarios. / Ph. D.

Com o avanço da tecnologia de fabricação de chips o atraso em fios globais será maior que o atraso em portas lógicas. Além disso, fios globais longos são mais suscetíveis a problemas de integridade como crosstalk. Uma proposta recente de interconnecção global chamada redes intra-chip reduz essas limitações referentes a fios longos. Além dessas vantagens, redes intra-chip permitem desacoplar comunicação e computação, dividindo um sistema em sub tarefas independentes. Devido as essas vantagens é possível integrar mais lógica em um chip que usa redes intra-chip. Entretanto, o acréscimo de lógica no chip aumenta o custo de teste. Os módulos do chip precisam de mecanismos para transportar dados de teste, que são tipicamente barramentos usados exclusivamente para teste. Entretanto, como mencionado anteriormente, fios globais são caros e acrescentar barramentos de teste pode não ser possível em um futuro próximo. Por outro lado, uma rede intra-chip tem acesso a maioria dos módulos do chip. Esta rede pode ser usada para transportar dados de teste, evitando o acréscimo de barramentos dedicados ao teste. O objetivo dessa tese é estudar o uso de redes intra-chip para o transporte de dados de teste, enfatizando uma abordagem genérica que possa ser aplicada a uma dada rede. Para tanto, essa tese foi divida em três partes: modelos, projeto, e otimização. A tese propõe um modelo funcional de rede que é compatível com a maioria das recém propostas redes intra-chip. O modelo de teste, baseado no modelo funcional da rede, compreende o conjunto de informações necessárias para otimizar a arquitetura de teste. A arquitetura de teste, por sua vez, consiste de lógica para teste e algoritmo de otimização. A lógica de teste compreende lógica para ATE interface e lógica envoltória para módulos de hardware. Os algoritmos otimizam o tempo de teste e a área de lógica de teste no nível dos módulos e no nível do chip. Uma arquitetura convencional de teste de SoCs baseada em barramento de teste dedicado foi comparada com a arquitetura proposta para SoCs baseados em redes intra-chip. Os resultados apontam que o tempo de teste do SoC com a arquitetura proposta aumenta em média 5%. Os resultados também mostram que a lógica de teste da arquitetura proposta é cerca de 20% maior que na arquitetura de teste convencional. Por outro lado, o fluxo de projeto baseado na arquitetura de teste proposta é mais simples que a convencional. Além disso, a arquitetura proposta reduz o nÚmero de fios globais em torno de 20% a 50% para SoCs complexos. Estes resultados demonstram que a arquitetura proposta é melhor para sistemas complexos com um grande nÚmero de módulos. / With the advance of microchip technology, global and long wires will cost more in terms of delay than in terms of logic gates. ln addition, long wires are more susceptible to signal integrity problems such as crosstalk. A recently proposed global interconnect called network-on-chip alleviates the limitation of long wires. Moreover, on-chip networks allow decoupling communication and computation to divide a complete system into manageable and independent sub tasks. Thus, it is possible to integrate more logic into the chip using network-on-chip. However, the complexity growth of cores also increases the test costs since more logic is embedded into a single chip. These embedded cores need a test access mechanism for test data transportation, typically implemented as test-dedicated buses. As mentioned before, global wires are expensive, then, adding test buses may not be feasible in the near future. On the other hand, the on-chip network has access to most cores of the chip. This network could be used also for test data transportation, avoiding additional test-dedicated buses. The goal of this thesis is to study the reuse of on-chip networks for test data transportation, looking for a general reuse approach that can be easily used in a given network. To reach this goal, the thesis is divided in three parts: models, design, and optimization. This thesis proposes a functional model of a network, compatible with most recently proposed best-effort on-chip networks. Based on this functional model, a test model is devised. The test model comprises of a set of necessary and sufficient information required to optimize the test architecture. The test architecture consists of DfT logic and scheduling algorithm. The design of DfT logic comprises adaptation logic for the external tester and test wrappers for the modules. The optimization procedure, focused on mesh-based best-effort NoCs, schedules test data such that the chip test length and DfT silicon are a are minimized. A conventional SoC test architecture based on test-dedicated buses is compared to the proposed approach for best-effort NoCs. The experimental results show that SoC test length has increased 5% on average. The results have also shown that the are a overhead for proposed DfT is around +20% compared to the silicon area to implement the DfT of a convehtional test architecture. On the other hand, we have also presented a simpler design fiow and 20% to 50% of global wiring savings due to the use of NoC for test data transportation. The results corroborate with the conclusion that the proposed NoC reuse is a good approach for complex systems based on a large number of cores and routers.

Com o avanço da tecnologia de fabricação de chips o atraso em fios globais será maior que o atraso em portas lógicas. Além disso, fios globais longos são mais suscetíveis a problemas de integridade como crosstalk. Uma proposta recente de interconnecção global chamada redes intra-chip reduz essas limitações referentes a fios longos. Além dessas vantagens, redes intra-chip permitem desacoplar comunicação e computação, dividindo um sistema em sub tarefas independentes. Devido as essas vantagens é possível integrar mais lógica em um chip que usa redes intra-chip. Entretanto, o acréscimo de lógica no chip aumenta o custo de teste. Os módulos do chip precisam de mecanismos para transportar dados de teste, que são tipicamente barramentos usados exclusivamente para teste. Entretanto, como mencionado anteriormente, fios globais são caros e acrescentar barramentos de teste pode não ser possível em um futuro próximo. Por outro lado, uma rede intra-chip tem acesso a maioria dos módulos do chip. Esta rede pode ser usada para transportar dados de teste, evitando o acréscimo de barramentos dedicados ao teste. O objetivo dessa tese é estudar o uso de redes intra-chip para o transporte de dados de teste, enfatizando uma abordagem genérica que possa ser aplicada a uma dada rede. Para tanto, essa tese foi divida em três partes: modelos, projeto, e otimização. A tese propõe um modelo funcional de rede que é compatível com a maioria das recém propostas redes intra-chip. O modelo de teste, baseado no modelo funcional da rede, compreende o conjunto de informações necessárias para otimizar a arquitetura de teste. A arquitetura de teste, por sua vez, consiste de lógica para teste e algoritmo de otimização. A lógica de teste compreende lógica para ATE interface e lógica envoltória para módulos de hardware. Os algoritmos otimizam o tempo de teste e a área de lógica de teste no nível dos módulos e no nível do chip. Uma arquitetura convencional de teste de SoCs baseada em barramento de teste dedicado foi comparada com a arquitetura proposta para SoCs baseados em redes intra-chip. Os resultados apontam que o tempo de teste do SoC com a arquitetura proposta aumenta em média 5%. Os resultados também mostram que a lógica de teste da arquitetura proposta é cerca de 20% maior que na arquitetura de teste convencional. Por outro lado, o fluxo de projeto baseado na arquitetura de teste proposta é mais simples que a convencional. Além disso, a arquitetura proposta reduz o nÚmero de fios globais em torno de 20% a 50% para SoCs complexos. Estes resultados demonstram que a arquitetura proposta é melhor para sistemas complexos com um grande nÚmero de módulos. / With the advance of microchip technology, global and long wires will cost more in terms of delay than in terms of logic gates. ln addition, long wires are more susceptible to signal integrity problems such as crosstalk. A recently proposed global interconnect called network-on-chip alleviates the limitation of long wires. Moreover, on-chip networks allow decoupling communication and computation to divide a complete system into manageable and independent sub tasks. Thus, it is possible to integrate more logic into the chip using network-on-chip. However, the complexity growth of cores also increases the test costs since more logic is embedded into a single chip. These embedded cores need a test access mechanism for test data transportation, typically implemented as test-dedicated buses. As mentioned before, global wires are expensive, then, adding test buses may not be feasible in the near future. On the other hand, the on-chip network has access to most cores of the chip. This network could be used also for test data transportation, avoiding additional test-dedicated buses. The goal of this thesis is to study the reuse of on-chip networks for test data transportation, looking for a general reuse approach that can be easily used in a given network. To reach this goal, the thesis is divided in three parts: models, design, and optimization. This thesis proposes a functional model of a network, compatible with most recently proposed best-effort on-chip networks. Based on this functional model, a test model is devised. The test model comprises of a set of necessary and sufficient information required to optimize the test architecture. The test architecture consists of DfT logic and scheduling algorithm. The design of DfT logic comprises adaptation logic for the external tester and test wrappers for the modules. The optimization procedure, focused on mesh-based best-effort NoCs, schedules test data such that the chip test length and DfT silicon are a are minimized. A conventional SoC test architecture based on test-dedicated buses is compared to the proposed approach for best-effort NoCs. The experimental results show that SoC test length has increased 5% on average. The results have also shown that the are a overhead for proposed DfT is around +20% compared to the silicon area to implement the DfT of a convehtional test architecture. On the other hand, we have also presented a simpler design fiow and 20% to 50% of global wiring savings due to the use of NoC for test data transportation. The results corroborate with the conclusion that the proposed NoC reuse is a good approach for complex systems based on a large number of cores and routers.

Com o avanço da tecnologia de fabricação de chips o atraso em fios globais será maior que o atraso em portas lógicas. Além disso, fios globais longos são mais suscetíveis a problemas de integridade como crosstalk. Uma proposta recente de interconnecção global chamada redes intra-chip reduz essas limitações referentes a fios longos. Além dessas vantagens, redes intra-chip permitem desacoplar comunicação e computação, dividindo um sistema em sub tarefas independentes. Devido as essas vantagens é possível integrar mais lógica em um chip que usa redes intra-chip. Entretanto, o acréscimo de lógica no chip aumenta o custo de teste. Os módulos do chip precisam de mecanismos para transportar dados de teste, que são tipicamente barramentos usados exclusivamente para teste. Entretanto, como mencionado anteriormente, fios globais são caros e acrescentar barramentos de teste pode não ser possível em um futuro próximo. Por outro lado, uma rede intra-chip tem acesso a maioria dos módulos do chip. Esta rede pode ser usada para transportar dados de teste, evitando o acréscimo de barramentos dedicados ao teste. O objetivo dessa tese é estudar o uso de redes intra-chip para o transporte de dados de teste, enfatizando uma abordagem genérica que possa ser aplicada a uma dada rede. Para tanto, essa tese foi divida em três partes: modelos, projeto, e otimização. A tese propõe um modelo funcional de rede que é compatível com a maioria das recém propostas redes intra-chip. O modelo de teste, baseado no modelo funcional da rede, compreende o conjunto de informações necessárias para otimizar a arquitetura de teste. A arquitetura de teste, por sua vez, consiste de lógica para teste e algoritmo de otimização. A lógica de teste compreende lógica para ATE interface e lógica envoltória para módulos de hardware. Os algoritmos otimizam o tempo de teste e a área de lógica de teste no nível dos módulos e no nível do chip. Uma arquitetura convencional de teste de SoCs baseada em barramento de teste dedicado foi comparada com a arquitetura proposta para SoCs baseados em redes intra-chip. Os resultados apontam que o tempo de teste do SoC com a arquitetura proposta aumenta em média 5%. Os resultados também mostram que a lógica de teste da arquitetura proposta é cerca de 20% maior que na arquitetura de teste convencional. Por outro lado, o fluxo de projeto baseado na arquitetura de teste proposta é mais simples que a convencional. Além disso, a arquitetura proposta reduz o nÚmero de fios globais em torno de 20% a 50% para SoCs complexos. Estes resultados demonstram que a arquitetura proposta é melhor para sistemas complexos com um grande nÚmero de módulos. / With the advance of microchip technology, global and long wires will cost more in terms of delay than in terms of logic gates. ln addition, long wires are more susceptible to signal integrity problems such as crosstalk. A recently proposed global interconnect called network-on-chip alleviates the limitation of long wires. Moreover, on-chip networks allow decoupling communication and computation to divide a complete system into manageable and independent sub tasks. Thus, it is possible to integrate more logic into the chip using network-on-chip. However, the complexity growth of cores also increases the test costs since more logic is embedded into a single chip. These embedded cores need a test access mechanism for test data transportation, typically implemented as test-dedicated buses. As mentioned before, global wires are expensive, then, adding test buses may not be feasible in the near future. On the other hand, the on-chip network has access to most cores of the chip. This network could be used also for test data transportation, avoiding additional test-dedicated buses. The goal of this thesis is to study the reuse of on-chip networks for test data transportation, looking for a general reuse approach that can be easily used in a given network. To reach this goal, the thesis is divided in three parts: models, design, and optimization. This thesis proposes a functional model of a network, compatible with most recently proposed best-effort on-chip networks. Based on this functional model, a test model is devised. The test model comprises of a set of necessary and sufficient information required to optimize the test architecture. The test architecture consists of DfT logic and scheduling algorithm. The design of DfT logic comprises adaptation logic for the external tester and test wrappers for the modules. The optimization procedure, focused on mesh-based best-effort NoCs, schedules test data such that the chip test length and DfT silicon are a are minimized. A conventional SoC test architecture based on test-dedicated buses is compared to the proposed approach for best-effort NoCs. The experimental results show that SoC test length has increased 5% on average. The results have also shown that the are a overhead for proposed DfT is around +20% compared to the silicon area to implement the DfT of a convehtional test architecture. On the other hand, we have also presented a simpler design fiow and 20% to 50% of global wiring savings due to the use of NoC for test data transportation. The results corroborate with the conclusion that the proposed NoC reuse is a good approach for complex systems based on a large number of cores and routers.

Many cutting-edge computer and electronic products are powered by advanced Systems-on-Chip (SoC). Advanced SoCs encompass superb performance together with large number of functions. This is achieved by efficient integration of huge number of transistors. Such very large scale integration is enabled by a core-based design paradigm as well as deep-submicron and 3D-stacked-IC technologies. These technologies are susceptible to reliability and testing complications caused by thermal issues. Three crucial thermal issues related to temperature variations, temperature gradients, and temperature cycling are addressed in this thesis. Existing test scheduling techniques rely on temperature simulations to generate schedules that meet thermal constraints such as overheating prevention. The difference between the simulated temperatures and the actual temperatures is called temperature error. This error, for past technologies, is negligible. However, advanced SoCs experience large errors due to large process variations. Such large errors have costly consequences, such as overheating, and must be taken care of. This thesis presents an adaptive approach to generate test schedules that handle such temperature errors. Advanced SoCs manufactured as 3D stacked ICs experience large temperature gradients. Temperature gradients accelerate certain early-life defect mechanisms. These mechanisms can be artificially accelerated using gradient-based, burn-in like, operations so that the defects are detected before shipping. Moreover, temperature gradients exacerbate some delay-related defects. In order to detect such defects, testing must be performed when appropriate temperature-gradients are enforced. A schedule-based technique that enforces the temperature-gradients for burn-in like operations is proposed in this thesis. This technique is further developed to support testing for delay-related defects while appropriate gradients are enforced. The last thermal issue addressed by this thesis is related to temperature cycling. Temperature cycling test procedures are usually applied to safety-critical applications to detect cycling-related early-life failures. Such failures affect advanced SoCs, particularly through-silicon-via structures in 3D-stacked-ICs. An efficient schedule-based cycling-test technique that combines cycling acceleration with testing is proposed in this thesis. The proposed technique fits into existing 3D testing procedures and does not require temperature chambers. Therefore, the overall cycling acceleration and testing cost can be drastically reduced. All the proposed techniques have been implemented and evaluated with extensive experiments based on ITC’02 benchmarks as well as a number of 3D stacked ICs. Experiments show that the proposed techniques work effectively and reduce the costs, in particular the costs related to addressing thermal issues and early-life failures. We have also developed a fast temperature simulation technique based on a closed-form solution for the temperature equations. Experiments demonstrate that the proposed simulation technique reduces the schedule generation time by more than half.

Ο όγκος των δεδομένων που απαιτούνται για τον έλεγχο της ορθής λειτουργίας ενός συστήματος που υλοποιείται σε ένα ολοκληρωμένο κύκλωμα είναι πάρα πολύ μεγάλος. Αυτό συνεπάγεται ότι ο χρόνος που απαιτείται για τον έλεγχο της ορθής λειτουργίας του ολοκληρωμένου κυκλώματος μπορεί να είναι απαγορευτικά μεγάλος. Για τη μείωση του απαιτούμενου χρόνου χρησιμοποιούνται διάφορες τεχνικές συμπίεσης των δεδομένων δοκιμής. Κάποιες από αυτές τις τεχνικές βασίζονται στην αποστολή κοινών δεδομένων δοκιμής ταυτόχρονα σε περισσότερες από μία μονάδες του ολοκληρωμένου κυκλώματος. Στην εργασία αυτή υλοποιούμε μια από αυτές τις τεχνικές που βασίζεται στην ύπαρξη μονοπατιών ολίσθησης (scan paths) στις μονάδες του ολοκληρωμένου κυκλώματος. Για την περαιτέρω μείωση του χρόνου που απαιτείται για τον έλεγχο της ορθής λειτουργίας του ολοκληρωμένου κυκλώματος γίνεται χρονοπρογραμματισμός της σειράς με την οποία θα ελεγχθεί η ορθή λειτουργία των διαφόρων μονάδων του ολοκληρωμένου κυκλώματος. / The volume of data that is required to test a SoC is too much big. This means that the time that is required for testing can be prohibitorily big. For the reduction of required time are used various techniques of data compaction.Some of these techniques are based on broadcasting the same value to all of the cores on a SoC.In this work we use one of these techniques that are based on the existence of scan chains in the core (broadcast scan).For further reduction of time that is required for testing a circuit we use a core testing schedule algorithm.