Localized heating leads to generation of thermal Hotspots that affect performance and reliability of an Integrated Circuit(IC). Functional workloads determine the locations and temperature of hotspots on a die. Programs are classified into phases based on program execution profile. During a phase, spatial power dissipation pattern of an application remains unchanged. In this thesis, we present a systematic approach for developing a synthetic workload from a functional workload to create worst case temperature of a target hotspot in 2D and 3D IC. These synthetic workload are designed to create thermal stress patterns, which would help in characterizing the thermal characteristics of micro architecture to worst case temperature transient which is an important problem in Industry. Our approach is based on the observation that, worst case temperature at a particular location in 2 D IC is determined not only by the current activity in that region, but also by the past activities in the surrounding regions. Therefore, if the surrounding areas were “pre-heated” with a different workload, then the target region may become hotter due to slower rate of lateral heat dissipation Similarly in case of 3D IC, the workload applied to each of the dies in 3D IC keeps on changing continuously, thus the hotspot could be found in any of the stacked layers. Thus the creation of localized hotspot at a particular location in a stacked 3D IC layer depends not only on the present activity at that location but also on the previous activity in the surrounding region and also on the activity of layers below it. Accordingly, (i) we develop a wavelet-based canonical spatio-temporal heat dissipation model for program traces, and use (ii) a novel Integer Linear Programming (ILP) formulation to rearrange program phases to generate target worst case hotspot temperature in 2D and 3D IC. We apply this formulation to target another well-known problem of (iii) maximizing temperature between a pair of co-ordinates in an IC. Experimental results show that by taking the spatio-temporal effect into account and with dynamic phase change behavior, we could raise temperature of a hotspot higher than what is possible otherwise. ICs are often tested at worst-case system operating conditions to assure that, all ICs shipped will function properly in the end system. Thus hotspot temperature maximization is an important in design verification and testing.

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In order to make gas chromatography (GC) more widely accessible, considerable effort has been made in developing miniaturized GC systems. Thermal gradient gas chromatograpy (TGGC), one of the heating methods used in GC, has recieved attention over the years due to it's ability to enhance analyte focusing. The present work seeks to develop high performance miniaturized GC systems by combining miniaturized GC technology with thermal gradient control methods, creating miniaturized thermal gradient gas chromatography (µTGGC) systems. To aid in this development a thermal control system was developed and shown to successfully control various µTGGC systems. DAQ functionality was also included which allowed for the recording of temperature and power data for use in modeling applications. Thermal models of the various µTGGC systems were developed and validated against the recorded experiemental data. Thermal models were also used to aid in decisions required for the development of new µTGGC system designs. The results from the thermal models were then used to calibrate and validate a stochastic GC transport model. This transport model was then used to evaluate the effect of thermal gradient shape on GC separation performance.

Cette thèse présente les résultats d'une étude du Haut Zagros, la partie la plus interne du Zagros plissé. Sur les cartes, le Haut Zagros est présent dans deux régions séparées l'une de l'autre, le Haut Zagros Occidental et Oriental respectivement, et partiellement masqué comme un domaine sous-plaqué sous la Zone de Sanandaj-Sirjan. Le Haut Zagros est l'unique endroit du Zagros où les roches paléozoïques affleurent largement.Un premier objectif était de réévaluer le style tectonique et l'évolution cinématique du Haut Zagros. Il est montré que la caractéristique structurale principale de cette zone est l'existence de plis de décollement faillés, associés à un réseau complexe de chevauchements et de failles décrochantes. Ce travail suggère que l'existence de niveaux de décollement au sein des couches ordoviciennes et/ou silurienne a permis le développement de duplex aux cœurs des anticlinaux. Un scénario tectonique en deux étapes, identique à celui proposé ailleurs dans la chaîne, est mis en avant. Une première phase en tectonique de couverture a permis la formation d'un train de plis de décollement au dessus du sel précambrien d'Hormuz. Le socle est impliqué dans la déformation dans un second tempspermettant l'exhumation des roches du Paléozoïque Inférieur. Après cette présentation du contexte tectonique du Haut Zagros, la thèse se concentre sur la signification tectonique de la discordance pré-permienne dont la manifestation la plus évidente est l'existence d'un très important hiatus sédimentaire allant du Cambro-Ordovicien au Permien dans le Zagros Occidental et du Dévonien terminal au Permien dans le Zagros Oriental. Il est montré que : (1) le Haut Zagros présente sous la discordance une géométrie générale en Arche et Bassin et que (2) seules des structures extensives comme des failles normales et des blocs basculés sont présentes sous la discordance, sans aucune trace de structures compressives. Un soulèvement thermique d'âge possible fini-dévonien est proposé comme mécanisme expliquant à la fois le mouvement vertical et l'extension diffuse. Cette hypothèse modifie considérablement l'interprétation classique associant le hiatus pré-permien à un effet lointain de l'orogenèse varisque.Des modélisations thermiques basées sur des données de maturité de la matière organique provenant des roches-mères potentielles du Haut Zagros ont été réalisé. Le modèle le plus probable suggère un flux de chaleur important pendant le Dévonien et l'érosion de ~3900m de sédiments avant le dépôt du Permien. Ce résultat est en accord avec l'hypothèse d'un soulèvement thermique évoqué plus haut. Par ailleurs, des mesures d'âges (U-Th)/He sur zircon montrent une remise à zéro partielle. Ces deux gammes de résultats sont en accord avec les données publiées suggérant l'existence d'un événement thermo-mécanique majeur au cours du Dévonien terminal et du Carbonifère Inférieur dans l'Arche du Levant (Israël, Jordanie). Un mécanisme commun est suggéré à l'échelle de la Plaque Arabe. / This Thesis presents the results of a study of the “High Zagros”, the most internal part of the Zagros-Fold-Thrust-Belt (ZFTB). On map view, the High Zagros is exposed in two separated domains (Western and Eastern High Zagros respectively) and partly hidden as an under-plated region beneath the Sanandaj-Sirjan Domain. The High Zagros is the only place in the ZFTB where the Paleozoic rocks are widely exposed.A primary objective was to reevaluate the structural style and kinematic evolution of the High Zagros. It is shown that the most significant geological elements within this area are large scale faulted detachment folds, associated with a complex system of thrust faults segmented by strike-slip faults. This work suggests that the existence of active Ordovician and/or Silurian décollements led to the development of duplex structures which are confined in the core of the anticlines. A two-step kinematic scenario, similar to the one already proposed elsewhere in the belt, is proposed for the High Zagros. Firstly, a thin-skinned phase led to establish detachment folding over the basal Hormuz salt. Then, a thick-skinned phase resulted in the basement thrusting and allowed the exhumation of Lower Paleozoic succession.After this presentation of the tectonic context of the High Zagros, the thesis focuses on the tectonic significance of the pre-Permian unconformity, which was known through a major hiatus between Cambro-Ordovicien to Early Permian and between Devonian to Permian rocks in the western and eastern High Zagros respectively. It is shown that (1) the High Zagros presents below the unconformity a large “Arch-and-Basin” geometry; and that (2) only extensional features such as normal faults and rotated blocks, without evidence of contractional deformation, can be observed below the unconformity. Thermal uplift of possible Late Devonian is proposed as a probable mechanism explaining both the uplift and the diffuse extensional deformation. This proposal strongly modifies the “classical” interpretation of the pre-Permian hiatus as a far effect of the Variscan Orogeny.Thermal modeling based on maturity data from potential source rocks cropping out in the High Zagros has been performed. The most probable modeled scenario suggests an important heat flow during the Devonian and the erosion of ~3900m of the sedimentary pile prior to the deposition of Permian sequence. This outcome reinforces our interpretation of a thermal uplift scenario responsible for pre-Permian vertical movements. On the other hand, a set of new (U-Th)/He ages obtained from the Lower Paleozoic, Devonian and early Permian clastic rocks show a partial reset of zircon grains. These two results are fairly consistent with the published data describing a major thermo-tectonic event during Late Devonian-Early Carboniferous in the Levant Arch (Israel, Jordan) and suggest a common mechanism at the scale of the Arabian Plate.

A ocorrência de uma grande reorganização de placas durante o Neógeno reflete a comlpexa interação entre as placas do Caribe, Farallon, e América do Sul, e o arco intra-oceânico de Panamá. Isto, tem influenciado o registro tectono-estratigráfico dos Andes nor-ocidentais da Colômbia, o qual tem sido escassamente estudado perto da sutura entre os domínios de Panamá o da América do Sul. Novos dados de petrografia de arenitos, análises de minerais densos, geocronologia detrítica em zircão, geoquímica de rocha total, e modelamento termal inverso de múltiplos termocronômetros, realizados em um transepto de 50 km com direção SE-NW, permitem reconstruir a história de deformação e exumação/erosão das rochas do Cretáceo Superior ao Plioceno do flanco ocidental da Cordilheira Ocidental. O início da exumação das rochas do Cretáceo Superior associadas com a margem continental Sul-americana, ocorreu entre 45 e 20 Ma, o qual é sugerido pelo resfriamento inicial desde temperaturas dentro da zona de retenção parcial do hélio em zircão (~180-200°C). Essas rochas, também sofreram um pulso de exumação considerável durante o Mioceno Médio, o qual caracteriza-se por taxas moderadamente rápidas entre 0.3 km/my e 0.7 km/my. Adicionalmente, um período de resfriamento rápido também é documentado com taxas máximas de exumação ~1.3 km/my. As rochas do Eoceno Médio do arco oceânico de Panamá, as quais estão separadas das rochas do Cretáceo Superior da Cordilheira Ocidental por uma faixa de deformação, registram um resfriamento inicial em ~15 Ma desde a zona de retenção parcial de hélio em apatita (APRZ, ~80-60°C, com taxas perto de 0.6 km/my. Termocronologia detrítica em secuências pós-colisionais e sedimentos modernos, também registram estes períodos de exumação. Os novos resultados podem ser relacionados com processos tectônicos de escala regional, que incluem: Convergência rápida e frontal no Oligoceno Superior, entre a recentemente formada placa de Nazca e a placa continental Sul-americana, depois da fragmentação da antiga placa de Farallon, a colisão do Arco de Panamá do Cretáceo Superior-Eoceneo durante o Mioceno Médio, o qual resultou exumação geral ao longo do segmento NW da placa Sul-americana, é o início da subducção da placa de Nazca é a instalação de um segmento plano ao norte durante o Mioceno Superior-Plioceno. Este é provavelmente o mecanismo responsável pelo soerguimento da superfície recente na Colômbia nor-oriental e a contínua deformação-soerguimento das serras costeiras ocidentais e das bacias orientais de foreland ao norte de 5°N. / The occurrence of major plate reorganization during the Neogene, reflects the complex interactions between the Caribbean, Farallon and South-American plates, and the Panama Arc. These, have influenceed the tectono-stratigraphic record of the northwestern Colombian Andes, which has been scarcely studied neart the suture between the Panama and South-American domains. New sandstone petrography, heavy minerals analyses, U-Pb detrital zircon geochronology, whole-rock geochemical data, and thermal inverse modeling of multiple thermochronometers, carried along a 50 km southeast-northwest transect, allow to reconstruct the deformation and exhumation/erosional history of the Late Cretaceous to Pliocene rocks from the western flank of the Western Cordillera. The onset of exhumation of Late Cretaceous sedimentary rocks, associated with the South-American margin, occurred between 45-20 Ma, as suggested by the initial cooling from temperatures within the zircon helium partial retention zone (ZPRZ, ~180-200°C). These rocks also experienced a substantial pulse of exhumation during the Middle Miocene, which is characterized by moderately rapid rates between ~0.3 km/my and 0.7 km/my. Moreover, a Pliocene period of rapid cooling is also documented with maximum exhumation rates of ~1.3 km/my. The Middle Eocene rocks from the intra-oceanic Panama Arc, which are separated by a highly-deformed zone from the Late Cretaceous rocks of the Western Cordillera, record an initial cooling at ca. 15 Ma from the apatite partial retention zone (APRZ, ~80-60°C) at rates around 0.6 km/my. Detrital thermochronology of post-collisional sequences and modern river sediments also record these exhumation events. The we results can be related to more regional-scale tectonic processes including: the Late Oligocene rapid and frontal convergence between the newly formed Nazca plate and the continental South-American plate following the fragmentation of the former Farallon plate, the Middle Miocene collision of the Cretaceous-Eocene Panama Arc that triggered generalized exhumation-deformation widespread in the upper NW South-American plate, and the Middle to Late Miocene initiation of the Nazca subduction and installation of a Late Miocene-Pliocene flat-slab to the north. The latter is likely to represent the mechanism that triggered surface uplift in eastern Colombia and ongoing uplift-deformation of western coastal ranges and eastern foreland basins north of 5°N

Future generation of all-electric ships will be highly dependent on electric power, since every single system aboard such as the drive propulsion, the weapon system, the communication and navigation systems will be electrically powered. Power conversion modules (PCM) will be used to transform and distribute the power as desired in various zone within the ships. As power densities increase at both components and systems-levels, high-fidelity thermal models of those PCMs are indispensable to reach high performance and energy efficient designs. Efficient systems-level thermal management requires modeling and analysis of complex turbulent fluid flow and heat transfer processes across several decades of length scales. In this thesis, a methodology for thermal modeling of complex PCM cabinets used in naval applications is offered. High fidelity computational fluid dynamics and heat transfer (CFD/HT) models are created in order to analyze the heat dissipation from the chip to the multi-cabinet level and optimize turbulent convection cooling inside the cabinet enclosure. Conventional CFD/HT modeling techniques for such complex and multi-scale systems are severely limited as a design or optimization tool. The large size of such models and the complex physics involved result in extremely slow processing time. A multi-scale approach has been developed to predict accurately the overall airflow conditions at the cabinet level as well as the airflow around components which dictates the chip temperature in details. Various models of different length scales are linked together by matching the boundary conditions. The advantage is that it allows high fidelity models at each length scale and more detailed simulations are obtained than what could have been accomplished with a single model methodology. It was found that the power cabinets under the prescribed design parameters, experience operating point airflow rates that are much lower than the design requirements. The flow is unevenly distributed through the various bays. Approximately 90 % of the cold plenum inlet flow rate goes exclusively through Bay 1 and Bay 2. Re-circulation and reverse flow are observed in regions experiencing a lack of flow motion. As a result high temperature of the air flow and consequently high component temperatures are also experienced in the upper bays of the cabinet. A proper orthogonal decomposition (POD) methodology has been performed to develop reduced-order compact models of the PCM cabinets. The reduced-order modeling approach based on POD reduces the numerical models containing 35 x 109 DOF down to less than 20 DOF, while still retaining a great accuracy. The reduced-order models developed yields prediction of the full-field 3-D cabinet within 30 seconds as opposed to the CFD/HT simulations that take more than 3 hours using a high power computer cluster. The reduced-order modeling methodology developed could be a useful tool to quickly and accurately characterize the thermal behavior of any electronics system and provides a good basis for thermal design and optimization purposes.

This dissertation is focused on developing a new passband behavioral model in order to account for asymmetric intermodulation distortion resulted from memory effect. First, a measurement setup is prepared to measure the AM/AM, AM/PM distortion, magnitudes and the phases of intermodulation (IMD) and fundamental (FUND) components which are created by the amplifier where phase is calculated only by measuring magnitudes. Then, responses of a sample amplifier are measured for different excitation situations (center frequency and tone spacing are swept). A new modeling technique, namely Odd Order Modeling (OOM), is proposed which has unequal time delay terms. The reason of unequal time delay addition is the change of effective channel length according to the average power passing through that channel. These unequal delays create asymmetry in the IMD components. General Power Series Expansion (GPSE) model is also extracted, OOM and GPSE model performances are compared by using NMSE metric. In order to improve model performance, even order terms with envelope of input are added. It is mathematically proven that even order terms with envelope of the input have contribution to IMD and FUND components&rsquo / . This improved version of modeling is named as Even Order modeling (EOM). EOM model performance is compared with the others&rsquo / performance for two-tone excitation measurement results. It is shown that EOM gives the most accurate result. Model performance is checked for unequal four-tone signal as well. EOM model is applied to baseband DPD circuit after making some modifications. Model linearization performance is compared with the performances of the other memory polynomial modeling techniques.

Gallium nitride (GaN) has been targeted for use in high power (>30 W/mm) and high frequency (>160 GHz) application due to its wide band gap and its large break down field. One of the most significant advances in GaN devices has evolved from the AlGaN/GaN high electron mobility transistor (HEMT). As a result of the large power densities being applied to these devices there can develop intense hot spots near areas of highest electric field. The hot spot phenomenon has been linked to a decrease in device reliability through a range of degradation mechanisms. In order to minimize the effect that hot spot temperatures have on device reliability a detailed understanding of relevant transport mechanisms must be developed. This study focuses on two main aspects of phonon transport within GaN devices. The first area of focus was to establish an understanding of phonon relaxation times within bulk GaN. These relaxation times were calculated from an application of Fermi's Golden Rule and explicitly conserve energy and crystal momentum. This analysis gives insight into the details behind the macroscopic thermal conductivity parameter. Once relaxation times for GaN were established a multiscale phonon transport modeling methodology was developed that allowed the Boltzmann Transport Equation to be coupled to the energy equation. This coupling overcomes some computational limits and allows for nanoscale phenomena to be resolved within a macroscopic domain. Results of the transport modeling were focused on benchmarking the coupling method as well as calculating the temperature distribution within an operating 6 finger HEMT.

Data centers are computing infrastructure facilities that house arrays of electronic racks containing high power dissipation data processing and storage equipment whose temperature must be maintained within allowable limits. In this research, the sustainable and reliable operations of the electronic equipment in data centers are shown to be possible through the Open Engineering Systems paradigm. A design approach is developed to bring adaptability and robustness, two main features of open systems, in multi-scale convective systems such as data centers. The presented approach is centered on the integration of three constructs: a) Proper Orthogonal Decomposition (POD) based multi-scale modeling, b) compromise Decision Support Problem (cDSP), and c) robust design to overcome the challenges in thermal-fluid modeling, having multiple objectives, and inherent variability management, respectively. Two new POD based reduced order thermal modeling methods are presented to simulate multi-parameter dependent temperature field in multi-scale thermal/fluid systems such as data centers. The methods are verified to achieve an adaptable, robust, and energy efficient thermal design of an air-cooled data center cell with an annual increase in the power consumption for the next ten years. Also, a simpler reduced order modeling approach centered on POD technique with modal coefficient interpolation is validated against experimental measurements in an operational data center facility.

Thermal characterization of electronic cabinets is becoming increasingly important, due to growing power dissipation and compact packaging. Usually, multiple length scales of interest and modes of heat transfer are simultaneously present. A steady reduced order thermal modeling framework for electronic cabinets was developed to provide an efficient method to model thermal transport across multiple length scales. This methodology takes advantage of compact modeling at the chip or component level and reduced order modeling at subsystem and cabinet levels. Compact models, which were incorporated into system level simulation, were created for components, and reduced order models (ROMs) were developed using proper orthogonal decomposition (POD) for subsystems and system. An efficient interfacial coupling scheme was developed using the concept of flow network modeling to couple the heat and mass flow rates and pressure at each interface, when interconnecting ROMs together to simulate the entire system. Thermal information was then subsequently extracted from the global modeling and applied to the component model for detailed simulation. A boundary profile-matching scheme for ROM of each subsystem was developed to broaden the applicability of the multi-scale thermal modeling methodology. The output profiles of the subsystem upstream can be transferred to the input profiles of the subsystems downstream by adding necessary flow straightening ducts during the snapshots generation process. A general method to create dynamic multi-layer compact models for components and modules was developed. These dynamic compact models were incorporated into enclosure level simulation. The dynamic reduced order model for the enclosure was developed using POD. The transient multi-scale thermal modeling approach was illustrated through an electronic enclosure with insulated gate bipolar transistor (IGBT) module. The multiscale thermal modeling methodology presented here was validated through experiments conducted on a simulated electronic cabinet and the test vehicle with hybrid cooling technique. The latter incorporated double-sided cooling with hybrid forced air convection, thermoelectric cooling, and micro-channel liquid cooling. The overall multi-scale modeling framework was able to reduced numerical models containing 107 DOF down to around 102, while still retaining an approximation accuracy of around 90% in prediction of chip junction temperature rises, compared to measurements.