The current work focuses on three aspects of laser formed Ti-6Al-4V: an evaluation of the as-deposited and heat treated macro and microstructures and preliminary results obtained from a model developed to calculate the temperature profile resultant of the laser forming process. A "solution treat and age" heat treatment with a variable cooling rate was performed on the Laser Formed Ti-6Al-4V single line builds. Increasing the cooling rate decreases the acicular alpha grain size in the basketweave Widmanstätten alpha plus untransformed beta microstructure. Distinct features of the as-deposited macrostructure include: large columnar prior-beta grains that have grown epitaxially through multiple deposited layers; a well defined heat affected zone in the substrate; and the presence of "layer bands," a macroscopic banding present at the top of every layer except for the last three layers to be deposited. The nominal microstructure between the layer bands consists of acicular basketweave Widmanstätten alpha outlined in untransformed beta. The alpha grain width is smaller just above a layer band and larger just below a layer band. The microstructure of the layer band consists of larger colonies of acicular alpha outlined in untransformed beta. The gradient in the alpha grain size and presence of the layer band is due to thermal cycling as opposed to segregation effects which were ruled out using quantitative compositional analyses. Through analysis of the microstructural results the gradient in the nominal microstructure and formation of the layer band in layer n was caused by the deposition of layer n+2, and n+3, respectively. A thermal model has been developed to assist in the prediction and interpretation of the as-processed microstructure. The model is used to explain that the microstructural evolution of the layer bands and gradient microstructure in layer n is due to the deposition of layer n+2. The difference in the two analyses of microstructural evolution based on microstructural observations and thermal model results are due to differences in the parameter sets used to build and model the deposit. / Master of Science

The thesis presents a modeling framework for simulating three dimensional effects in lithium-ion batteries. This is particularly important for understanding the performance of large scale batteries used under high power conditions such as in hybrid electric vehicle applications. While 1D approximations may be sufficient for the smaller scale batteries used in cell phones and laptops, they are severely limited when scaled up to larger batteries, where significant 3D gradients can develop in concentration, current, temperature, and voltage. Understanding these 3D effects is critical for designing lithium-ion batteries for improved safety and long term durability, as well as for conducting effective design optimization studies. The model couples an electrochemical battery model with a thermal model to understand how thermal effects will influence electrochemical behavior and to determine temperature distributions throughout the battery. Several modeling example results are presented including thermal influences on current distribution, design optimization of current collector thickness and current collector tab placement, and investigation of lithium plating risk in three dimensions. / text

This thesis presents the design of a working and testable satellite with particular emphasis on the electrical, mechanical, and thermal modelling and performance issues for the ECOSat project in the framework of the Canadian Satellite Design Competition. In order of importance, based on the design challenges for the satellite structure were the dynamics modelling and analysis, thermal modeling and analysis, and assembly and integration modeling. Both the dynamics and thermal modeling of the satellite were completed using Finite Element Analysis (FEA) in NX with the NASTRAN solver. The dynamic analysis study was performed first since it has the primary design driver for the structure. These frequencies are of concern due to the 90 Hz or greater fundamental frequency requirement for each axis. The dynamic modes of the satellite structure had the largest influence not only on the design of the structure but also its interface to the electronic systems as these had to meet the required testing qualification levels. It was found that the first fundamental frequency appeared near 200 Hz in the XY plane of the structure. The second study performed was on the thermal modeling of the satellite both for extreme operating conditions in “Hot” and “Cold” cases. Operational limiting cases were identified for the batteries in the cold and hot case study, and the power amplifier for the transmitter was identified for the hot case study. For the batteries to perform satisfactorily for the cold and hot case problem, a metal bracket with an electric heater was added to the design. The heaters were added to the design as a resistive heating element, the additional thermal coupling from the bracket improved heat transfer during the hot case. A trade study analysis was conducted for the power amplifier. Here, a bi directional heat spreader made of pyrolytic graphite attached to a frame member with high thermal inertia was chosen as the optimal solution. Finally, the third study performed tested the interface and clearance requirements of the satellite. The synergistic integration of the electrical and mechanical systems required significant attention in order to ensure the successful assembly, integration, and testing of the two systems. The investigation focused on the cabling assemblies of the satellite. Several design iterations were required for the power regulation, transmitter, receiver, modem, and onboard computer systems. Detailed assembly drawings were created for the cabling assembly fabrication prior to the final integration of the electrical and mechanical systems. The performance simulations show that the satellite systems meet or exceed the required launch qualification tests as well as the thermal cycling requirements for all systems and their components to operate within the manufacturer specified values. Once completely assembled and launched into orbit, the satellite should be able to perform and within its operational and mission requirements in both a sun synchronous or polar orbit at a range of altitudes. / Graduate / 0538 / 0544 / 0548 / jtcurran@uvic.ca

Dans la chambre de combustion, les températures auxquelles les parois sont soumises sont supérieures aux températures de fusion des matériaux. Afin de protéger les parois, une partie de l'air froid provenant du compresseur est injectée par des milliers de perforations (multiperforation). Cependant, face à l'enjeu de la pollution, les motoristes considèrent des solutions qui limitent la quantité d'air disponible pour le refroidissement. Son optimisation s'avère donc capital. Néanmoins, la très petite taille des perforations rend les simulations numériques coûteuses, et des modèles homogènes permettant de s'affranchir du maillage des trous ont gagné de l'importance. De plus, des études récentes ont mis en évidence l'intérêt d'une injection d'air de refroidissement non-alignée avec l'écoulement chaud (solution baptisée dilution giratoire). Cette thèse se propose, d'une part de développer un modèle homogène adapté à ce type nouveau d'injection et d'autre part de contribuer à la compréhension de la multiperforation giratoire. / Ln the combustion chamber, temperatures up to 2000K are reached, which exceeds by far the melting point of the liner materials. ln order to protect the liner, cool air from the combustion chamber outer casing is injected into the combustor through a large number of sub-millimeter closely-spaced holes (effusion cooling). However, strict environmental legislation has led jet-engine manufacturers to consider techniques that reduce the quantity of air available for cooling. Therefore, cooling system must be carefully designed. However, the size of the holes makes detailed numerical simulations unaffordable. Aerothermal models that mimic effusion cooling behavior are a promising solution. On the Other hand, up to now, far too little attention has been paid to a novel effusion cooling technique (compound angle effusion cooling), where cold air injection is not aligned With the hot air flow direction. The aim of this dissertation is twofold: to establish an effusion cooling model and to investigate the flow field of compound angle effusion cooling.

This Thesis presents the results of a study of the "High Zagros", the most internal part of the Zagros-Fold-Thrust-Belt (ZFTB). On map view, the High Zagros is exposed in two separated domains (Western and Eastern High Zagros respectively) and partly hidden as an under-plated region beneath the Sanandaj-Sirjan Domain. The High Zagros is the only place in the ZFTB where the Paleozoic rocks are widely exposed.A primary objective was to reevaluate the structural style and kinematic evolution of the High Zagros. It is shown that the most significant geological elements within this area are large scale faulted detachment folds, associated with a complex system of thrust faults segmented by strike-slip faults. This work suggests that the existence of active Ordovician and/or Silurian décollements led to the development of duplex structures which are confined in the core of the anticlines. A two-step kinematic scenario, similar to the one already proposed elsewhere in the belt, is proposed for the High Zagros. Firstly, a thin-skinned phase led to establish detachment folding over the basal Hormuz salt. Then, a thick-skinned phase resulted in the basement thrusting and allowed the exhumation of Lower Paleozoic succession.After this presentation of the tectonic context of the High Zagros, the thesis focuses on the tectonic significance of the pre-Permian unconformity, which was known through a major hiatus between Cambro-Ordovicien to Early Permian and between Devonian to Permian rocks in the western and eastern High Zagros respectively. It is shown that (1) the High Zagros presents below the unconformity a large "Arch-and-Basin" geometry; and that (2) only extensional features such as normal faults and rotated blocks, without evidence of contractional deformation, can be observed below the unconformity. Thermal uplift of possible Late Devonian is proposed as a probable mechanism explaining both the uplift and the diffuse extensional deformation. This proposal strongly modifies the "classical" interpretation of the pre-Permian hiatus as a far effect of the Variscan Orogeny.Thermal modeling based on maturity data from potential source rocks cropping out in the High Zagros has been performed. The most probable modeled scenario suggests an important heat flow during the Devonian and the erosion of ~3900m of the sedimentary pile prior to the deposition of Permian sequence. This outcome reinforces our interpretation of a thermal uplift scenario responsible for pre-Permian vertical movements. On the other hand, a set of new (U-Th)/He ages obtained from the Lower Paleozoic, Devonian and early Permian clastic rocks show a partial reset of zircon grains. These two results are fairly consistent with the published data describing a major thermo-tectonic event during Late Devonian-Early Carboniferous in the Levant Arch (Israel, Jordan) and suggest a common mechanism at the scale of the Arabian Plate.

The thesis investigates the temperature distribution in the chip of an infrared camera caused by its read out integrated circuit. The heat from the read out circuits can cause distortions to the thermal image. Knowing the temperature gradient caused by internal heating, it will later be possible to correct the image by implementing algorithms subtracting temperature contribution from the read out integrated circuit. The simulated temperature distribution shows a temperature gradient along the edges of the matrix of active bolometers. There are also three hot spots at both the left and right edge of the matrix, caused by heat from the chip temperaturesensors and I/O pads. Heat from the chip temperature sensors also causes an uneven temperature profile in the column of reference pixels, possibly causing imperfections in the image at the levels of the sensors. Simulations of bolometer row biasing are carried out to get information about how biasing affects temperatures in neighbouring rows. The simulations show some row-to-row interference, but the thermal model suffers from having biasing heat inserted directly onto the top surface of the chip, as opposed to having heat originate from the bolometers. To get better simulation results describing the row biasing, a thermal model of the bolometers needs to be included. The results indicate a very small temperature increase in the active pixel array, with temperatures not exceeding ten millikelvin. Through comparisons with another similar simulation of the chip, there is reason to believe the simulated temperature increase is a bit low. The other simulation cannot be used to draw any conclusions about the distribution of temperature. / Examensarbetet undersöker den temperaturdistribution som uppkommer i ett chip till en IR-kamera till följd av värmeutvecklingen i dess egna utläsningskretsar. Genom att ha information om temperaturdistributionen är det möjligt att längre fram i utvecklingsprocessen skapa algoritmer som subtraherar bort chippets interna värmetillskott från den termiska bilden. Den simulerade temperaturdistributionen visar att de största temperaturgradienterna uppkommer längs den aktiva pixelmatrisens sidor. Det är även möjligt att se tre varmare områden vid både den vänstra och högra sidan av matrisen skapade av värme från chippets temperatursensorer och I/O-kretsar. Värme från temperatursensorerna påverkar även temperaturen i kolumnen med referenspixlar, vilket kan ge upphov till avvikelser i den termiska bilden i höjd med dessa temperatursensorer. Simuleringar av radvis basering av bolometrar utförs för att få information om hur bolometerbiaseringen påverkar temperaturen i angränsade rader. Simuleringarna visar att det finns störningar mellan rader, men simuleringsmodellen lider av avsaknaden av en termisk bolometermodell och tvingas applicera värme direkt på chipytan istället för att låta värme utvecklas i bolometrarna. För bättre simuleringsresultat innefattande bolometerbiasering bör en termisk bolometermodell inkluderas i simuleringen. Resultaten visar på en mycket liten temperaturökning inom den värmekänsliga aktiva pixelmatrisen, med temperaturökningar inom detta område som inte överstiger tio millikelvin. Genom jämförelser med en liknande simulering av samma chip är det inte omöjligt att dra slutsatsen att temperaturökningen är något låg. Det går inte att dra några slutsatser om temperaturens distribution genom denna jämförelse av simuleringar.

Infrared (IR) imaging is a key technology in a variety of military and civilian applications, especially for night vision and remote sensing. Compared with cryogenically cooled IR sensors, uncooled infrared imaging devices have the advantages of being low cost, light weight, and superior reliability. The electro-thermal analysis of a microbolometer pixel is critical to determine both device performance and reliability. To date, most microbolometer analysis research has focused on performance optimization and computation of thermal conductance directly from the geometry. However, modeling of the thermal distribution across the microbolometer pixel is critical for the comprehensive analysis of system performance and reliability. Therefore, this thesis investigates the electro-thermo-mechanical characteristics of a microbolometer pixel considering the effects of joule heating and incoming IR energy. The contributions of the present research include the electro-thermal models for microbolometer and methods of validating thermal distribution using experimental results. The electro-thermal models explain the effect of microbolometer material properties and geometry on device performance and reliability. The research also contributes methods of estimating the thermal conductivity of microbolometer, which take into account different heat transfer mechanisms, including radiation and convection. Previous approaches for estimating the thermal conductance of uncooled microbolometer consider heat conduction via legs from the geometry of the pixel structure and material properties [2]. This approach assumes linear temperature distribution in the pixel legs structure. It also leaves out the various electro-thermal effects existing for multilayer structures. In the present research, a different approach is used to develop the thermal conductance of microbolometer pixel structure. The temperature distribution in the pixel is computed from an electro-thermal model. Then, the average temperature in the pixel microplate and the total heat energy generated by joule heating is utilized to compute the thermal conductance of the structure. The thesis discusses electro-thermal and thermo-mechanical modeling, simulation and testing of Polysilicon Multi-User MEMS Process (PolyMUMPs®) test devices as the groundwork for the investigation of microbolometer performance and reliability in space applications. An electro-thermal analytical and numerical model was developed to predict the temperature distribution across the microbolometer pixel by solving the second order differential heat equation. To provide a qualitative insight of the effect of different parameters in the thermal distribution, including material properties and device geometry, first an explicit formulation for the solution of the electro-thermal coupling is obtained using the analytical method. In addition, the electro-thermal model, which accounts for the effect of IR energy and radiation heat transfer, spreading resistance and transient conditions, was studied using numerical methods. In addition, an analytical model has been developed to compute the IR absorption coefficient of a Thin Single Stage (TSS) microbolometer pixel. The simulation result of this model was used to compute absorbed IR energy for the numerical model. Subsequently, the temperature distribution calculated from the analytical model is used to obtain the deflections that the structure undergoes, which will be fundamental for the reliability analysis of the device. Finite element analysis (FEA) has been simulated for the selected device using commercial software, ANSYS® multiphysics. Finite element simulation shows that the electro-thermal models predict the temperature distribution across a microbolometer pixel at steady-state conditions within 2.3% difference from the analytical model. The analytical and numerical models are also simulated and results for a temperature distribution within 1.6% difference. In addition, to validate the analytical and numerical electro-thermal and thermo-mechanical models, a PolyMUMPs® test device has been used. The test results showed a close agreement with the FEM simulation deflection of the test device.

The primary goal of this research was to develop the laser chemical vapor deposition (LCVD) process to be able to directly deposit carbon nanotubes onto substrates selectively. LCVD has traditionally been used to directly deposit complex geometries of other materials, including many metals and ceramics. Carbon nanotube deposits were formed using codeposition and other techniques. Multiwall carbon nanotubes as small as 7 nm were synthesized. Utilizing electron microscopy, deposits were characterized to determine the effects of laser power, catalyst and hydrocarbon concentration, time, pressure, and other variables on the number of nanotubes formed, their size, and their spatial location. The most important variables were shown to be hydrocarbon and catalyst concentration and laser power. These results were analyzed and statistics based models were developed to express these trends. Additionally, the process was also used successfully to deposit linear patterns of carbon nanotubes. Carbon nanotube deposits were also carried out in the presence of an electric field. It was demonstrated that a field of sufficient strength could be used to orient tube growth. LCVD is a thermally driven process and a thermal feedback and control system is typically employed to allow for real time control of the reaction zone temperatures. The current thermal imaging system installed on the LCVD reactor is limited to operation at temperatures above which nanotube deposition occurs. A heat and mass transport model was therefore developed to simulate deposition temperatures and provide an estimate of the desired laser power needed to achieve a desired reaction temperature. This model included all significant modes of heat transport including conduction, natural convection and radiation. Temperature dependant material properties were also employed to help achieve greater accuracy. Additionally, the model was designed to be able to simulate a scanning laser beam which was used to deposit linear patterns of carbon nanotubes. Modeling calculations of laser heating compared favorably with experimental data. The results of this work show that LCVD has potential for use in the commercial market for selective direct deposition of patterns of aligned carbon nanotubes on multiple substrate materials.

Temperature rise due to Joule heating of on-chip interconnects can severely affect performance and reliability of next generation microprocessors. Thermal predictions become difficult due to large number of features, and the impact of electron size effects on electrical and thermal transport. It is thus necessary to develop efficient numerical approaches, and accurate metal and dielectric thermal characterization techniques. In this research, analytical, numerical, and experimental techniques were developed to enable accurate and efficient predictions of interconnect temperature rise. A finite element based compact thermal model was developed to obtain temperature rise with fewer elements and acceptable accuracy. Temperature drop across the interconnect cross-section was ignored. The compact model performed better than standard finite element model in two and three-dimensional case studies, and the predictions for a real world structure agreed closely with experimentally measured temperature rise. A numerical solution was developed for electron transport based on the Boltzmann Transport Equation (BTE). This deterministic technique, based on the path integral solution of BTE within the relaxation time approximation, free electron model, and linear response, was applied to a constriction in a finite size thin metallic film. A correlation for effective conductance was obtained for different constriction sizes. The Atomic Force Microscope (AFM) based Scanning Joule Expansion Microscopy (SJEM) was used to develop a new technique to measure thermal conductivity of thin metallic films in the size effect regime. This technique does not require suspended metal structures, and thus preserves the original electron interface scattering characteristics. The thermal conductivities of 43 nm and 131 nm gold films were extracted to be 82 W/mK and 162 W/mK respectively. These measurements were close to Wiedemann-Franz Law predictions and are significantly smaller than the bulk value of 318 W/mK due to electron size effects. The technique can potentially be applied to interconnects in the sub-100 nm regime. A semi-analytical solution for the 3-omega method was derived to account for thermal conduction within the metallic heater. It is shown that significant errors can result when the previous solution is applied for anisotropic thermal conductivity measurements.

Conduction based compact thermal modeling of DC/DC converters, which are electronic components commonly used in military applications, are investigated. Three carefully designed numerical case studies are carried out at component, board and system levels using ICEPAK software. Experiments are conducted to gather temperature data that can be used to study compact thermal models (CTMs) with different levels of simplification. In the first (component level) problem a series of conduction based CTMs are generated and used to study the thermal behavior of a Thin-Shrink Small Outline Package (TSSOP) type DC/DC converter under free convection conditions. In the second (board level) case study, CTM alternatives are produced and investigated for module type DC/DC converter components using a printed circuit board (PCB) of an electro-optic system. In the last case study, performance of the CTM alternatives generated for the first case are assessed at the system level using them on a PCB placed inside a realistic avionic box. v Detailed comparison of accuracy of simulations obtained using CTMs with various levels of simplification is made based on experimentally obtained temperature data. Effects of grid size and quality, choice of turbulence modeling and space discretization schemes on numerical solutions are discussed in detail. It is seen that simulations provide results that are in agreement with measurements when appropriate CTMs are used. It is also showed that remarkable reductions in modeling and simulation times can be achieved by the use of CTMs, especially in system level analysis.