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The deterministic microasperities play a vital role in reducing the coefficient of friction and wear of thrust surfaces and improve the tribological properties of the surfaces. Deterministic microasperities have a specific pattern in terms of size, shape and spacing. These specified geometries are controllable and repeatable. The microasperities are micron scaled asperities and cavities on a surface that form the surface roughness. The present thesis shows the detailed process to fabricate the deterministic microasperities on thrust surfaces, i.e. stainless substrate, using micro-fabrication processes such as lapping and ultra-violet photolithography in combination with an electroplating (nickel) process. A Novel alignment technique is used to align the photomask with the substrate to get repeatable and aligned patterns on the thrust surface. Deterministic microasperities are characterized by using precision instruments such as an Optical profilometer, Scanning Electron Microscope (SEM) and Optical microscope to study the various surface parameters such as Average roughness (Ra), Root mean square value (rms) and Peak value (PV) of the thrust surface.

The objective of this research is the development of an electrically active microneedle array that can deliver biomolecules such as DNA and drugs to epidermal cells by means of electroporation. Properly metallized microneedles could serve as microelectrodes essential for electroporation. Furthermore, the close needle-to-needle spacing of microneedle electrodes provides the advantage of utilizing reduced voltage, which is essential for safety as well as portable applications, while maintaining the large electric fields required for electroporation. Therefore, microneedle arrays can potentially be used as part of a minimally invasive, highly-localized electroporation system for cells in the epidermis layer of the skin. This research consists of three parts: development of the 3-D microfabrication technology to create the microneedle array, fabrication and characterization of the microneedle array, and the electroporation studies performed with the microneedle array. A 3-D fabrication process was developed to produce a microneedle array using an inclined UV exposure technique combined with micromolding technology, potentially enabling low cost mass-manufacture. The developed technology is also capable of fabricating 3-D microstructures of various heights using a single mask. The fabricated microneedle array was then tested to demonstrate its feasibility for through-skin electrical and mechanical functionality using a skin insertion test. It was found that the microneedles were able to penetrate skin without breakage. To study the electrical properties of the array, a finite element simulation was performed to examine the electric field distribution. From these simulation results, a predictive model was constructed to estimate the effective volume for electroporation. Finally, studies to determine hemoglobin release from bovine red blood cells (RBC) and the delivery of molecules such as calcein and bovine serum albumin (BSA) into human prostate cancer cells were used to verify the electrical functionality of this device. This work established that this device can be used to lyse RBC and to deliver molecules, e.g. calcein, into cells, thus supporting our contention that this metallized microneedle array can be used to perform electroporation at reduced voltage. Further studies to show efficacy in skin should now be performed.

In past studies, several techniques have been employed to create microscopic features on relatively simple surfaces. Of these, lithography-based techniques have proven effective at manufacturing large fields of deterministic microasperities and microcavities on planar and cylindrical substrates. The present study focuses on adapting UV-lithography to a more complex substrate. Machined from stainless steel, a conical mold insert introduces an interesting geometry designed for the injection molding of radial lip seal elastomer. The distinct shape of this mold insert poises unique challenges to a conventional lithography procedure. Spray application is investigated as a feasible means to deposit layers of photoresist on the surface. An appropriate masking element is designed and created to facilitate transfer of a particular pattern via UV exposure. A clamping technique is implemented to align and secure the photomask. These techniques are incorporated into a three-day process, and results are obtained through optical microscopy and light interferometry. By applying Design of Experiments (DOE) and Analysis of Variance (ANOVA), significant process variables are indentified. Based on these findings, refinements to the process are enabled and future considerations are made evident.

This paper describes technology and process development for a hybrid lithography approach pairing UV-lithography for planar single mode waveguides with 2-photon-polymerization direct-laser-writing for out-of-plane coupling mirrors. Improvements to multi-layer direct patterning of OrmoCore/-Clad material system using UV-lithography are presented. Near square core cross sections are achieved. Minimum alignment accuracy at ≈ 3 μm is observed. Cut-back measurement on single mode waveguides shows attenuation of 0.64 dB cm −1 and 1.5 dB cm −1 at 1310 nm and 1550 nm respectively. Up to 2.5-times increase of shear-strength after thermal exposure up to 300 ◦ C is found using shear tests and compared for various surface treatments. Mechanical compatibility to reflow soldering is derived. An extensive study on the pattering of ORMOCER® using 2-photon-polymerization is performed. Flat 45 ◦ -micro mirrors with sub-10 μm dimensions are 3D-printed both in OrmoCore and OrmoComp. Outlook to further research on hybrid lithography integration approach is given.

This paper describes design and advances in process development for UV-lithography of planar single mode waveguides with openings for out-of-plane coupling µ-mirrors. Improvements to multi-layer direct patterning of OrmoCore/-Clad material system using UV-lithography are presented. Near square core cross sections are achieved. However, non uniformity across 4” wafer is shown due to varying proximity and UV-intensity. Openings in full stack with steep sidewalls without residual layer are patterned. Reduction in stack thickness for very small exposure doses due to inhibition even under inert atmosphere is shown. 45° -µ-mirrors are integrated in these openings to manufacture a U-link via a single mode waveguide and two adjacent micro-mirrors. Optical characterization of U-link demonstrates the feasibility of hybrid lithography approach. However, non-uniformity of core cross-section leads to cross coupling of planar waveguides. Outlook to further research on UV-lithography of multi-layer waveguide stack and alignment with µ-mirror printing is given.

This paper describes advances in hybrid-lithography process, combining UV-lithography for planar, single mode redistribution layer (RDL) and 2-photon-polymerization direct-laser-writing (2PP-DLW) for micro-mirrors inside RDL-opening. Improvements to multi-layer direct patterning of OrmoCore/-Clad material system using UV-lithography and need for broadband UV-LED source are presented. Near square core cross sections and smooth sidewalls are achieved. Openings in full stack with steep sidewalls without residual layer are patterned. To optimize 2PP-DLW-process processing window for both OrmoComp and IP-DIP is thoroughly characterized. Roughness measurements prove feasibility even of coarsely printed structure as reflective μ-mirror for 1550 nm wavelength. Finally these results are applied to periscope probe for wafer-level-testing of edge emitting lasers and proof of concept is shown. Outlook to further research on UV-lithography of multi-layer waveguide stack and alignment with μ-mirror printing is given.