Switch mode power supplies are widely used in different applications. High efficiency and high power density are two driving forces for power supply systems. However, high dv/dt and di/dt in switch mode power supplies will cause severe EMI noise issue. In a typical front-end converter, the EMI filter usually occupies 1/3 to 1/4 volume of total converter. Hence, reducing the EMI noise of power converter can help reduce the volume of EMI filter and improving the total power density of the converter. The EMI noise can be separated as differential mode (DM) noise and common mode (CM) noise. For off-line switch mode power supplies, DM noise is dominated by PFC converter. CM noise is a more complicated issue. It is contributed by both PFC converter and DC/DC converter. The DM noise is contributed by input current ripple. Therefore, one method to reduce DM noise is interleaving. There are three methods to reduce CM noise: symmetry, balance and shielding. The idea of symmetry concept is generating another dv/dt source to cancel the original dv/dt source. However, this method is very difficult to achieve and usually has more loss. The balance technique forms a Wheatstone bridge circuit to minimize the CM noise. However, the balance technique cannot achieve very good attenuation at high frequency due to parasitics. Shielding technique is very popular in isolated DC-DC converters to reduce CM noise. However, the previous shielding method requires precise control of parasitic capacitance and dv/dt. It is very difficult to achieve good CM noise attenuation in mass production. In this dissertation, a novel one-layer shielding method for PCB winding transformer is provided. This shielding technique can block CM noise from primary side and also cancel the CM noise from secondary side. In addition, shielding does not increase the loss of converter too much. Furthermore, this shielding technique can be applied to matrix transformer structure. For matrix transformer LLC converter, the inter-winding capacitor is very large and will cause severe CM noise problem. By adding shielding layer, CM noise has been greatly reduced. Although flyback and LLC resonant converter are used as examples to demonstrate the concept, the novel shielding technique can also be applied to other topologies that have similar transformer structure. With Wide-band-gap power devices, the switching frequency of power converter can be pushed 10 times higher than traditional Si based converters. This provides an opportunity to use PCB winding magnetics. In order to reduce the switching loss, critical conduction mode is used in PFC converter. Because of high AC current in the inductor winding, litz wire was used to build the inductor. However, with coupled inductor concept and the proposed winding structure, CRM inductor is integrate into PCB winding for the first time. Furthermore, balance technique is applied to reduce CM noise for PFC converter. With PCB winding, the balance technique has better high frequency performance. The PCB winding inductor can achieve high power density, high efficiency and automated manufacture. Traditionally, two-stage EMI filter was utilized to achieve required EMI noise attenuation. With the developed high frequency, low EMI noise converter, single-stage EMI filter can be applied. However, there are self-parasitic and mutual parasitic components to impact the filter performance on high frequency. The near-field measurement is utilized to visualize the magnetic flux near those filter components. Thus, a better filter design and layout can be achieved to have better high frequency performance. / Ph. D. / Switch mode power supplies are widely used in different applications. High efficiency and high power density are two driving forces for power supply systems. In a world full of electronic devices, it is very important that these devices can work properly in a complicated electromagnetic environment. Thus, electromagnetic compatibility (EMC) is a significant characteristic of electronic devices. However, high dv/dt and di/dt in switch mode power supplies will cause severe EMI noise issue. In a typical front-end converter, the EMI filter usually occupies 1/3 to 1/4 volume of total converter. Hence, reducing the EMI noise of power converter can help reduce the volume of EMI filter and improving the total power density of the converter. In this dissertation, several methods to reduce EMI noise are proposed and analyzed. First, the shielding method for PCB winding transformer is proposed. It can effectively reduce EMI noise at wide frequency range. Second, balance technique is applied to reduce EMI noise of PFC converter. Traditionally, two-stage EMI filter was utilized to achieve required EMI noise attenuation. With the developed high frequency, low EMI noise converter, single-stage EMI filter can be applied. However, there are self-parasitic and mutual parasitic components to impact the filter performance on high frequency. The near-field measurement is utilized to visualize the magnetic flux near those filter components. Thus, a better filter design and layout can be achieved to have better high frequency performance.

De nos jours, les énergies renouvelables remplacent les énergies fossiles. Pour assurer une l’interconnexion entre toutes ces installations électriques, l’électronique de puissance est nécessaire. Les principales spécifications de la prochaine génération de convertisseur de puissances sont un rendement et une densité de puissance élevés, fiabilité et faibles coûts. L’intégration PCB des composants actifs et/ou passifs est perçue comme une approche prometteuse, peu onéreuse et efficace. Les délais ainsi que les coûts de fabrication des convertisseurs de puissance peuvent considérablement réduits. L’intégration permet également d’améliorer les performances des convertisseurs. Dans ce but, un concept original d’inductance 3D pliable utilisant la technologie PCB est présenté. Il permet un coût faible pour une production en série, ainsi qu’une excellente reproductibilité. Un usinage partiel de la carte PCB est utilisé, permettant le pliage et la conception des enroulements de l’inductance. Différents prototypes sont développés par le biais d’une procédure d’optimisation. Des tests électriques et thermiques sont réalisés pour valider l’applicabilité du concept au sein de convertisseurs de puissance.Le développement d’une procédure d’optimisation appliqué aux convertisseurs hautement intégrés utilisant l’enterrement PCB est présenté. Tous les choix importants, facilitant l’intégration PCB, e.g. réduction des composants passifs, sont présentés. Cela inclut la sélection de la topologie adéquate avec la modulation associée. La procédure de design et les modèles analytiques sont introduits. Il en résulte un convertisseur comprenant quatre pont-complet entrelacés avec des bras fonctionnant à basse (50 Hz) et haute (180 kHz) fréquences. Cette configuration autorise une variation de courant importante dans les inductances, assurant ainsi la commutation des semi-conducteurs à zéro de tension (ZVS), et ceux sur une période complète du réseau. L’impact de la forte variation de courant sur le filtre CEM est compensé par l’entrelacement. Deux prototypes d’un convertisseur AC/DC bidirectionnel de 3.3 kW sont présentés, les résultats théorique et pratique sont analysés.Pour augmenter la densité de puissance du system, un filtre actif de type “Buck” est étudié. La procédure d’optimisation est adaptée à partir de la procédure implémentée pour le convertisseur AC/DC. L’approche utilisée, mène à un convertisseur opérant également en ZVS durant une période compète du réseau, et ce, à fréquence de commutation fixe. Les technologies sélectionnées, condensateur céramique et inductance compatible avec la technologie PCB sont favorable à l’intégration et sont implémenté sur le prototype. / Nowadays, the green energy sources are replacing fossil energies. To assure proper interconnections between all these different electrical facilities, power electronics is mandatory. The main requirements of next generation converters are high efficiency, high power density, high reliability and low-cost. The Printed Circuit Board (PCB) integration of dies and/or passives is foreseen as a promising, low-cost and efficient approach. The manufacturing time and cost of power converters can be drastically reduced. Moreover, integration allows the converter performances to be improved. For this purpose, an original 3D folded power inductor concept using PCB technology is introduced. It is low cost for mass production and presents good reproducibility. A partial milling of the PCB is used to allow bending and building the inductor winding. Prototypes are designed through an optimisation procedure. Electrical and thermal tests are performed to validate the applicability in power converters. The development of an optimisation procedure for highly integrated converters, using PCB embedding, is presented. All important choices, facilitating the PCB integration, e.g. reduction of passive components, are presented. It includes the selection of the suitable converter topology with the associated modulation. The design procedure and implemented analytical models are introduced. It results in four interleaved full-bridges operating with low (50 Hz) and high (180 kHz) frequency legs. The configuration allows high current ripple in the input inductors inducing zero voltage switching (ZVS) for all the semiconductors, and for a complete grid period. The impact of high current ripple on the EMI filter is compensated by the interleaving. Two prototypes of a 3.3 kW bidirectional AC/DC converters are presented, theoretical and practical results are discussed. To further increase the power density of the overall system, a Buck power pulsating buffer is investigated. The optimisation procedure is derived from the procedure implemented for the AC/DC converter. The result favours an original approach, where the converter also operates with ZVS along the entire main period at a fixed switching frequency. The selected technologies for prototyping are integration friendly as ceramic capacitors and PCB based inductors are implemented in the final prototype.

Les composants de puissance grand gap présentent d'ores et déjà des caractéristiques statiques et dynamiques supérieures à leurs homologues en silicium. Mais ces composants d'un nouvel ordre s'accompagnent de différences susceptibles de modifier le fonctionnement de la cellule de commutation. Les travaux qui furent menés au cours de cette thèse se sont intéressés aux composants grand gap et à leur commande au sein d'un convertisseur de puissance synchrone robuste, haut rendement et haute densité de puissance. En particulier deux points critiques ont été identifiés et étudiés. Le premier est la grande sensibilité des composants grand gap aux composants parasites. Le second est l'absence de diode parasite interne entre le drain et la source de nombreux transistors grand gap. Pour répondre aux exigences de ces nouveaux composants et en tirer le meilleur profit, nous proposons des solutions innovantes, robustes, efficaces et directement intégrables aux circuits de commande. Des circuits de commande entièrement intégrés ont ainsi été conçus spécifiquement pour les composants grand gap. Ceux-ci permettent entre autres le contrôle précis des formes de commutation par l'adaptation de l'impédance de grille, et l'amélioration de l'efficacité énergétique et de la robustesse d'un convertisseur de puissance à base de composants grand sans diodes par une gestion dynamique et locale de temps morts très courts. / Wide band gap devices already demonstrate static and dynamic performances better than silicon transistors. Compared to conventional silicon devices these new wide band gap transistors have some different characteristics that may affect power converter operations. The work presented in this PhD manuscript deals with a specific gate drive circuit for a robust, high power density and high efficiency wide band gap devices-based power converter. Two critical points have been especially studied. The first point is the higher sensitivity of wide band gap transistors to parasitic components. The second point is the lack of parasitic body diode between drain and source of HEMT GaN and JFET SiC. In order to drive these new power devices in the best way we propose innovative, robust and efficient solutions. Fully integrated gate drive circuits have been specifically developed for wide band gap devices. An adaptive output impedance gate driver provides an accurate control of wide band gap device switching waveforms directly on its gate side. Another gate drive circuit improves efficiency and reliability of diode-less wide band gap devices-based power converters thanks to an auto-adaptive and local dead-time management.