This thesis is devoted to development of techniques to quantify chemical and mechanical influences during chemical mechanical polishing (CMP) near the surface of a polymer film, poly (biphenyl dianhydride-p-phenylenediamine) (BPDA-PDA). To quantify chemical modifications during CMP, an iterative algorithm has been proposed to extract depth profiles based on Ficks second law of diffusion in a multi-element system from data supplied by angle resolved x-ray photoelectron spectroscopy. It has been demonstrated that the technique can be used to quantify the depth of chemical modification of BPDA-PDA surfaces treated with alkaline solutions. Polymer chains near the surface realign themselves during CMP and polarized infrared spectroscopy is chosen in this thesis to quantify chain orientations induced by CMP to evaluate the mechanical influence. A theoretical framework based on a 44 matrix method for spectral simulation together with an oscillator model for BPDA-PDA has been used to obtain quantitative chain orientation information on a post-CMP BPDA-PDA sample by fitting simulated polarized infrared spectra to experimentally generated spectra. Verification of the oscillator model was established from the complex refractive indices of BPDA-PDA films, which were determined using a new method (R/T ratio method) developed in this thesis to extract complex refractive indices of films with biaxial symmetry from polarized transmission and reflection spectra.

Diese Dissertation beschäftigt sich mit der Grenzflächenausbildung von dünnen Tantal- und Titan-basierenden Schichten zu den piezoelektrischen Substratmaterialien Lithiumniobat sowie Lithiumtantalat, als Teil eines Schichtstapels für die Metallisierung akustischer Oberflächenbauelemente. Ziel ist es das grundlegende Verständnis für die chemischen Wechselwirkungen beim Aufwachsen der Schichten, ihrer thermischen und zeitlichen Stabilität sowie ihrer Effekte auf das Schichtwachstum einer Deckschicht bestehend aus Aluminium zu gewinnen. Ein Schwerpunkt war die Präparation der Substratoberflächen hinsichtlich einer Oberflächenreinigung und -modifikation. Zu diesem Zweck wurden neben verschiedenen Standard-Verfahren auch eine eigens angefertigte plasmagestützte Oberflächenbehandlung systematisch analysiert. Auf derart präparierten Substraten fanden im Folgenden die Schichtabscheidung und die Analyse des Schichtwachstums, hauptsächlich mit winkelaufgelöster Photoelektronenspektroskopie, statt. Anhand von thermischen Belastungen sowie zeitlicher Veränderungen der Schichten im Vakuum konnten grundlegende Aussagen zur Stabilität der Grenzflächen gewonnen werden. Zur Komplettierung des Schichtstapels wurden auf ausgewählten Substrat-Schicht Kombinationen das Wachstum von Aluminiumschichten hinsichtlich ihrer unterschiedlicher Texturbildung analysiert und Aussagen zur Relevanz chemischer Ursachen getroffen. / This dissertation addresses the interface formation between thin Tantalum and Titanium based layers onto the piezoelectric substrate materials Lithiumniobate and Lithiumtantalate as part of a metallisation stack for surface acoustic wave devices. The goal is to extend the fundamental knowledge of chemical interactions during layer growth, its thermal and temporal stability plus its effects on the layer growth of an Aluminium cover layer. One focus lies on the preparation of the substrate surfaces for cleaning and modification purpose. For this, besides standard procedures a specially built plasma-based device was systematically evaluated for surface treatment. The following layer deposition was then implemented onto these prepared substrate surfaces and mainly analysed by angle-resolved photoelectron spectroscopy. By the means of thermal load and temporal alteration of the layers in vacuum essential knowledge about the interface stability was gained. For the completion of a whole layer stack selected substrate-layer combinations were covered with Aluminum and its layer growth was analysed with respect to the different formation of texture and its potential chemical cause.

As feature sizes in semiconductor devices become smaller and newer materials are incorporated, current methods for photoresist and post plasma etch residue removal face several challenges. A cleaning process should be environmentally benign, compatible with dielectric materials and copper, and provide residue removal from narrow and high aspect ratio features. In this work, sub-critical CO2 based mixtures have been developed to remove the etch residues; these mixtures satisfy the above requirements and can potentially replace the two step residue removal process currently used in the integrated circuit (IC) industry. Based on the chemical nature of the residue being removed, additives or co-solvents to CO2 have been identified that can remove the residues without damaging the dielectric layers. Using the phase behavior of these additives as a guide, the composition of the co-solvent was altered to achieve a single liquid phase at moderate pressures without compromising cleaning ability. The extent of residue removal has been analyzed primarily by x-ray photoelectron spectroscopy (XPS) and scanning electron microscopy (SEM). Various techniques such as attenuated total reflection - Fourier transform infrared (ATR-FTIR) spectroscopy, angle-resolved XPS (ARXPS), and interferometry were used to probe the interaction of cleaning fluids with residues. Model films of photoresists and plasma deposited residues were used to assist in understanding the mechanism of residue removal. From these studies, it was concluded that residue removal takes place primarily by attack of the interface between the residue and the substrate; a solvent rinse then lifts these residues from the wafer. It has been shown that transport of the additives to the interface is enhanced in the presence of CO2. From positronium annihilation lifetime spectroscopy (PALS) studies on a porous dielectric film, it has been shown that these high pressure fluids do not cause significant changes to the pore sizes or the bonding structure of the film. Hence, this method can be used to remove post etch residues from low-k dielectric films.

Diese Dissertation beschäftigt sich mit der Grenzflächenausbildung von dünnen Tantal- und Titan-basierenden Schichten zu den piezoelektrischen Substratmaterialien Lithiumniobat sowie Lithiumtantalat, als Teil eines Schichtstapels für die Metallisierung akustischer Oberflächenbauelemente. Ziel ist es das grundlegende Verständnis für die chemischen Wechselwirkungen beim Aufwachsen der Schichten, ihrer thermischen und zeitlichen Stabilität sowie ihrer Effekte auf das Schichtwachstum einer Deckschicht bestehend aus Aluminium zu gewinnen. Ein Schwerpunkt war die Präparation der Substratoberflächen hinsichtlich einer Oberflächenreinigung und -modifikation. Zu diesem Zweck wurden neben verschiedenen Standard-Verfahren auch eine eigens angefertigte plasmagestützte Oberflächenbehandlung systematisch analysiert. Auf derart präparierten Substraten fanden im Folgenden die Schichtabscheidung und die Analyse des Schichtwachstums, hauptsächlich mit winkelaufgelöster Photoelektronenspektroskopie, statt. Anhand von thermischen Belastungen sowie zeitlicher Veränderungen der Schichten im Vakuum konnten grundlegende Aussagen zur Stabilität der Grenzflächen gewonnen werden. Zur Komplettierung des Schichtstapels wurden auf ausgewählten Substrat-Schicht Kombinationen das Wachstum von Aluminiumschichten hinsichtlich ihrer unterschiedlicher Texturbildung analysiert und Aussagen zur Relevanz chemischer Ursachen getroffen. / This dissertation addresses the interface formation between thin Tantalum and Titanium based layers onto the piezoelectric substrate materials Lithiumniobate and Lithiumtantalate as part of a metallisation stack for surface acoustic wave devices. The goal is to extend the fundamental knowledge of chemical interactions during layer growth, its thermal and temporal stability plus its effects on the layer growth of an Aluminium cover layer. One focus lies on the preparation of the substrate surfaces for cleaning and modification purpose. For this, besides standard procedures a specially built plasma-based device was systematically evaluated for surface treatment. The following layer deposition was then implemented onto these prepared substrate surfaces and mainly analysed by angle-resolved photoelectron spectroscopy. By the means of thermal load and temporal alteration of the layers in vacuum essential knowledge about the interface stability was gained. For the completion of a whole layer stack selected substrate-layer combinations were covered with Aluminum and its layer growth was analysed with respect to the different formation of texture and its potential chemical cause.