The mechanical and electrical properties of thin films have been become important and urgent in recent years, especially, the laminated structure made by films stacked over hundreds of layers. For example, the Multi-Layered Ceramic Capacitors (MLCCs) are such structures fabricated by one layer ceramic film interleaves with one layer electrode film repeatedly a hundred times. Thus, the advantages of MLCCs include small volume, mass product, and high capacity. That makes the MLCCs the necessary part of passive components. The Finite element method is adopted in the study. The model is built by the simulation program of ANSYS. After meshing and setting boundary conditions, the numerical process is performed. The numerical simulation was started first by applying a uniformly distributed pressure on the top of near hundred layers of MLCCs before sintering process with the bottom plate fixed. Then, the displacement and stress fields of MLCCs under five pressures were obtained and discussed. In order to visualize the results, the data of displacement and the stress fields were listed in Tables and plot in Figures. In addition to the MLCCs under vertically and uniformly distributed pressure, the slightly slant distributed pressure and gradient distributed pressure had been simulated. Next, the results of changing Young¡¦s modulus had also been received. It is found that the vertical distributed pressure and slant distributed pressure were not the main factor led to the side deformation. The lateral constraint of gradient distributed pressure would influence the deformation of the MLCCs significantly.

Thesis (Ph. D.)--Rutgers University, 2009. / "Graduate Program in Ceramic and Materials Science and Engineering." Includes bibliographical references.

Thesis (Ph. D.)--University of Texas at Austin, 2003. / Supervisor: Jacob Abraham and Shouli Yan. Vita. Includes bibliographical references. Available also from UMI Company.

Title from PDF of title page (University of Missouri--Columbia, viewed on Feb 18, 2010). The entire thesis text is included in the research.pdf file; the official abstract appears in the short.pdf file; a non-technical public abstract appears in the public.pdf file. Thesis advisor: Dr. Stephen Lombardo. Includes bibliographical references.

Not available / text

The advent of smart and wearable systems along with their Internet of Things (IoT) applications are driving unparalleled product miniaturization and multifunctional integration with computing, wireless communications, wireless healthcare, security, banking, entertainment, and navigation and others. This evolution is primarily enabled by the integration of multiple technologies such as RF, analog, digital, MEMS, sensors and optics in the same system. Integration of these heterogeneous technologies creates a new need for multiple power supply rails to provide device-specific voltage and current levels. Hence, multiple power converters, each requiring several passive components, are used to create stable power-supplies. However, state-of-art power supplies employ SMD passives that are relatively large, forcing these modules to be placed on the board far from the active IC. This leads to significantly sub-par frequency performance and poses a challenge for ultra-miniaturized and reliable power supplies. Hence, novel packaging technologies that can improve miniaturization, electrical performance and reliability at a relatively low-cost are required to address these challenges. Georgia Tech-PRC proposes 3D integration of passives and actives (3D IPAC) as doubleside thin components on ultra-thin glass substrates with through-package-vias (TPVs) to meet these requirements. This thesis focuses on a comprehensive methodology to demonstrate a 3D IPAC power module, starting with modeling, design, fabrication and characterization to validate 3D integrated ultra-thin inductors and capacitors in ultra-thin substrates. Another key focus of this thesis is to advance building block technologies such as thinfilm inductors and capacitors to achieve the target properties for 3D IPAC integration. As a first building block technology, advanced capacitor technologies were explored with high-k thinfilm barium strontium titanate dielectrics and lanthanum nickel oxide electrodes as an alternative to Cu, Ni and Pt electrodes for improved performance and cost. The BST capacitors with LNO electrodes resulted in a capacitance density of 20-30 nF/cm2 with leakage as low as nA/nF up to 3 V. A glass-compatible process was developed with crystallization temperatures less than 650 C. These capacitors with thinfilm electrodes and dielectrics can be integrated into ultra-thin interposers and packages. This can help improve the capacitor performance up to the GHz range. As a next build block, Si-nanowires were studied as high surface area electrodes for high-density capacitors. Analytical modeling was performed to understand the length of the nanowires based on the catalyst size. This modeling study was then extended to understand the cut-off frequency of the capacitors based on the RC time constant. The wires were fabricated using both chemical vapor deposition (CVD) and wet-etch processes. However, it was noticed that the wet-etch process provided more control on the geometry, density and orientation of the nanowires. Si-oxide was thermally grown on the surface of the wires. A capacitance density of 200 nF/mm2 was achieved. It was noticed that the cut-off frequency of such capacitors was limited to the lower kHz range. However, the operating frequency can be improved by simply using a highly conductive Si-substrate. The second part of the thesis focuses on inductor and capacitor integration on ultra-thin glass substrates for high-frequency power modules using the 3D IPAC approach. Analytical models were used to calculate the required passive component values based on the target frequency, ripple currents and voltages of the power module. Next, a SPICE model was used to optimize the value of the required passives based on the output parasitics. The L and C structures were then modeled using 2.5D method of moments (MOM) approach. The modeling results showed 7-8 X improvement in Q-factor when the structures were fabricated using the 3D IPAC approach relative to those fabricated on the same side of the substrate. A fabrication process flow was designed based on through-via and doubleside metallization with semi-additive patterning (SAP). The components were fabricated as thinfilms on either sides of the substrate and interconnected with through-vias. The LC network was characterized using a two-port vector network analyzer. The results showed low-pass filter response, which matched the design targets of cut-off frequencies upto 100 MHz. This study, therefore, demonstrates advanced thinfilm component technologies for ultra-high frequency power-supply. It also presents, for the first time, a 3D integrated passives and actives (3D IPAC) approach with integrated L and C for power modules.

No description available.

This dissertation report began as an investigation into an overcurrent relay protection operation on a shunt capacitor bank (SCB) at ESKOM’s Westgate substation. Westgate substation has two SCBs, both of which were in service at the time of the 2007 incident. However, only the overcurrent protection scheme applied on SCB No.2 operated due to an external feeder fault on the Eltro feeder at Westgate substation. In 2004, SCB No.2 had tripped also on an overcurrent relay protection operation for an external fault. The difference identified in the otherwise identical SCBs was the relay technology employed by the overcurrent protection schemes i.e. electromechanical and electronic overcurrent relays were utilised. Therefore an investigation was initiated to determine any difference in the performance and reliability of overcurrent relay technologies in the SCB environment. The purpose of this work is to present the performance of the different technologies of overcurrent relays (electromechanical, electronic and digital) as applied to an ESKOM SCB during system disturbances and to compare their operation and behaviour. MatLAB and DigSILENT simulation packages were used to conduct preliminary fault studies to determine overcurrent relay performance, for a definite time overcurrent setting. These simulation results indicated that the simple electromechanical and electronic overcurrent relay could operate incorrectly in the SCB environment, during system disturbances. Practical laboratory tests were also conducted. This comprised of injecting DigSILENT simulations, comprising of system switching events and external faults, into three technologies of overcurrent relays. These Omicron injection tests found that the Westgate electronic relay would operate incorrectly for certain fault events in the SCB environment. Due to the results observed, further frequency response tests were conducted. These results suggested that the electronic and electromechanical overcurrent relays were susceptible to harmonics i.e. harmonics impact both the pick-up current setting and operating time of electronic and electromechanical overcurrent relays. The digital relay did not exhibit this vulnerability. Finally, recommendations were made to address the incorrect operation of the Westgate electronic relay in its SCB application. These recommendations could be applied in other ESKOM SCB overcurrent protection schemes, to prevent incorrect operation for system disturbances. / Thesis (M.Sc.)-University of KwaZulu-Natal, Durban, 2009.

No description available.

Dissertation (Ph.D.)--Auburn University, 2006. / Abstract. Vita. Includes bibliographic references (p.111-116).