Optical devices based on planar lightwave circuit (PLC) technology have the advantages of small size, high reliability, possibility for large scale production, and potential integration with electronics. These devices are widely employed in optical telecommunications, sensing, data storage, imaging, and signal processing. This thesis focuses on some selected PLC based devices, such as power splitters, demultiplexers, triplexers and polarization beam splitters. First, the basic principle of the waveguides and the simulation methods for PLC devices are discussed. A novel effective index method is introduced to reduce a two-dimensional structure to a one-dimensional one, and can be implemented for arbitrarily shaped waveguides. Numerical methods, such as finite-difference mode solver, beam propagation method, finite-difference time-domain method are introduced to analysis the mode profile of the waveguides, and the propagation properties of light in PLC devices. Multimode interference (MMI) couplers are widely used in many PLCs, such as power splitters, ring lasers, optical switches, and wavelength division multiplexers/demultiplexers. In this work, concepts for improving the self-imaging quality of MMI couplers are analyzed and new designs are proposed. A significant improvement in performance together with compact sizes were obtained with taper sections at the input/output of MMI couplers based on SOI, and deeply etched ridges in MMI couplers based on SiO2. A polarization insensitive dual wavelength demultiplexer based on sandwiched MMI waveguides was presented. Novel devices including triplexers and polarization beam splitters were realized by using photonic crystal (PhC) structures. Two stages of directional couplers based on PhC waveguides are cascaded to form an ultracompact triplexer. The special decoupling property of the PhC waveguide based directional coupler was utilized in the design. A novel polarization beam splitter was realized by combining a MMI coupler and a PhC which works as a polarization sensitive reflector. Finally, fabrication and optical characterization of an ultra-compact directional coupler and PhC structures in InP are presented. In a single etching step, by using the lag-effect in inductively coupled plasma reactive ion etching, a compact directional coupler (55 μm) is demonstrated. Carrier life times in PhC structures etched by chemically assisted ion beam etching were investigated, for emitter and switching applications. / QC 20100909

This thesis treats about semiconducting silicon structures. It describes the characteristics of the element and creation of P and N type of semiconductor and discusses about different types of faults in the crystal lattice. It deals with the description of methods for monitoring faults in semiconductor ie. determining the properties of semiconductors via EBIC, EBIV and CC methods, which are used for analysis of semiconductor devices and materials. Determining the properties of silicon components is being done by generation of charge carriers in the sample loaded in chamber of the scanning electron microscope by high energy electrons. Bellow the sample surface is being generated an electric charge which is being collected by probes. Using this data obtained by EBIC and CC were evaluated diffusion length and lifetime of electrons.

III-V nanostructures have attracted substantial research effort due to their interesting physical properties and their applications in new generation of ultrafast and high efficiency nanoscale electronic and photonic components. The advances in nanofabrication methods including growth/synthesis have opened up new possibilities of realizing one dimensional (1D) nanostructures as building blocks of future nanoscale devices. For processing of semiconductor nanostructure devices, simplicity, cost effectiveness, and device efficiency are key factors. A number of methods are being pursued to fabricate high quality III-V nanopillar/nanowires, quantum dots and nano disks. Further, high optical quality nanostructures in these materials together with precise control of shapes, sizes and array geometries make them attractive for a wide range of optoelectronic/photonic devices. This thesis work is focused on top-down approaches for fabrication of high optical quality nanostructures in III-V materials. Dense and uniform arrays of nanopillars are fabricated by dry etching using self-assembly of colloidal SiO2 particles for masking. The physico-chemistry of etching and the effect of etch-mask parameters are investigated to control the shape, aspect ratios and spatial coverage of the nanopillar arrays. The optimization of etch parameters and the utilization of erosion of etch masks is evaluated to obtain desired pillar shapes from cylindrical to conical. Using this fabrication method, high quality nanopillar arrays were realized in several InP-based and GaAs-based structures, including quantum wells and multilayer heterostructures. Optical properties of these pillars are investigated using different optical spectroscopic techniques. These nanopillars, single and in arrays, show excellent photoluminescence (PL) at room temperature and the measured PL line-widths are comparable to the as-grown wafer, indicating the high quality of the fabricated nanostructures. The substrate-free InP nanopillars have carrier life times similar to reference epitaxial layers, yet an another indicator of high material quality. InGaAs layer, beneath the pillars is shown to provide several useful functions. It effectively blocks the PL from the InP substrate, serves as a sacrificial layer for generation of free pillars, and as a “detector” in cathodoluminescence (CL) measurements. Diffusion lengths independently determined by time resolved photoluminescence (TRPL) and CL measurements are consistent, and carrier feeding to low bandgap InGaAs layer is evidenced by CL data. Total reflectivity measurements show that nanopillar arrays provide broadband antireflection making them good candidates for photovoltaic applications.  A novel post etch, sulfur-oleylamine (S-OA) based chemical process is developed to etch III-V materials with monolayer precision, in an inverse epitaxial manner along with simultaneous surface passivation. The process is applied to push the limits of top-down fabrication and InP-based high optical quality nanowires with aspect ratios more than 50, and nanostructures with new topologies (nanowire meshes and in-plane wires) are demonstrated.  The optimized process technique is used to fabricate nanopillars in InP-based multilayers (InP/InGaAsP/InP and InP/InGaAs/InP). Such multilayer nanopillars are not only attractive for broad-band absorption in solar cells, but are also ideal to generate high optical quality nanodisks of these materials. Finally, the utility of a soft stamping technique to transfer free nanopillars/wires and nanodisks onto Si substrate is demonstrated. These nanostructures transferred onto Si with controlled densities, from low to high, could provide a new route for material integration on Si. / <p>QC 20130205</p>