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Une nouvelle méthode de test pour les convertisseurs ADC et DAC embarqués dans un système complexe a été développée en prenant en compte les nouvelles contraintes affectant le test. Ces contraintes, dues aux tendances de design de systèmes, sont un nombre réduit de point d'accès aux entrées/sorties des blocs analogiques du système et une augmentation galopante du nombre et des performances des convertisseurs intégrés. La méthode proposée consiste à connecter les convertisseurs DAC et ADC dans le domaine analogique pour n'avoir besoin que d'instruments de test numériques pour générer et capturer les signaux de test. Un algorithme de traitement du signal a été développé pour discriminer les erreurs des DACs et ADCs. Cet algorithme a été validé par simulation et par expérimentation sur des produits commercialisés par NXP. La dernière partie de la thèse a consisté à développer de nouvelles applications pour l'algorithme.

This master’s thesis deals with the issue of digital to analog conversion and possibility of its realization in digital circuits. Goal of this project is to design sigma-delta digital to analog converter with resolution of 14 bits and frequency band (0 ÷ 20) kHz. Main functional blocks: interpolator and modulator sigma-delta will be realized like digital structures. Reconstruction filter will be realized like an analog structure. For design a check of parameters of designed converter programs MATLAB and Simulink are used. Designed digital structures will be described by VHDL language.

Description of construction of analog-to-digital and digital-to-analog convertors for audio signal and distribution via wireless channel, are the objectives of my master's thesis. There are descriptions of DPS construction, design of panels and measurement of system parameters in the project, above all sampling and reconstruction of audio signal, power consumption and signal range of wireless modules. At the end is discussed real usage and suggestions for further developement.

The diploma thesis deals with the design of a programmable load. As first, the research of available commercial devices was made in the theoretical part. Based on this research, the design possibilities of programmable load were discussed. As next, the design of resistor network was made, using a computer program that was developed for this purpose. Practical part deals with a realization of module of load, control board and software development. Proposed system consists of control board and ten modules. Modules have floating input terminals. This approach facilitate to arbitrary combination of their inputs. Modules are designed to work with DC and AC power supplies.

Diplom work describes a proposal and the design of the device for controlling the temperature test in a climatic chamber Heraeus and the creation of software for operating equipment. Work describes in detail the design and construction interface for the climate chamber, with which will be able to run automated test sequences and the development of the firmware and the operating software to start the temperature test.

Silicon carbide (SiC) integrated circuits (ICs) can enable the emergence of robust and reliable systems, including data acquisition and on-site control for extreme environments with high temperature and high radiation such as deep earth drilling, space and aviation, electric and hybrid vehicles, and combustion engines. In particular, SiC ICs provide significant benefit by reducing power dissipation and leakage current at temperatures above 300 °C compared to the Si counterpart. In fact, Si-based ICs have a limited maximum operating temperature which is around 300 °C for silicon on insulator (SOI). Owing to its superior material properties such as wide bandgap, three times larger than Silicon, and low intrinsic carrier concentration, SiC is an excellent candidate for high-temperature applications. In this thesis, analog and mixed-signal circuits have been implemented using SiC bipolar technology, including bandgap references, amplifiers, a master-slave comparator, an 8-bit R-2R ladder-based digital-to-analog converter (DAC), a 4-bit flash analog-to-digital converter (ADC), and a 10-bit successive-approximation-register (SAR) ADC. Spice models were developed at binned temperature points from room temperature to 500 °C, to simulate and predict the circuits’ behavior with temperature variation. The high-temperature performance of the fabricated chips has been investigated and verified over a wide temperature range from 25 °C to 500 °C. A stable gain of 39 dB was measured in the temperature range from 25 °C up to 500 °C for the inverting operational amplifier with ideal closed-loop gain of 40 dB. Although the circuit design in an immature SiC bipolar technology is challenging due to the low current gain of the transistors and lack of complete AC models, various circuit techniques have been applied to mitigate these problems. This thesis details the challenges faced and methods employed for device modeling, integrated circuit design, layout implementation and finally performance verification using on-wafer characterization of the fabricated SiC ICs over a wide temperature range. / <p>QC 20170905</p>