• Refine Query
  • Source
  • Publication year
  • to
  • Language
  • 28
  • 6
  • 3
  • 2
  • 1
  • 1
  • 1
  • 1
  • 1
  • 1
  • 1
  • Tagged with
  • 59
  • 59
  • 10
  • 10
  • 10
  • 9
  • 9
  • 9
  • 8
  • 7
  • 6
  • 6
  • 5
  • 5
  • 5
  • About
  • The Global ETD Search service is a free service for researchers to find electronic theses and dissertations. This service is provided by the Networked Digital Library of Theses and Dissertations.
    Our metadata is collected from universities around the world. If you manage a university/consortium/country archive and want to be added, details can be found on the NDLTD website.
31

All-copper chip-to-substrate interconnections for flip-chip packages

Lightsey, Charles Hunter 09 July 2010 (has links)
Avatrel 8000P's excellent photo-definition properties and mechanical strength make it an ideal polymer collar material. Avatrel 8000P is a high contrast, I-line sensitive mixture that can be developed in traditional aqueous-base developers. The great photolithographical performance of this photopolymer can be partly contributed to the minimal amount of light absorbed by the base norbornene polymer. The processing conditions noted in this work are an optimized version, which have been shown to give superior photolithographical performance. The simple baking procedures make Avatrel 8000P easier to process than SU-8. The ability to develop Avatrel 8000P in aqueous base can reduce chemical waste. As shown by SEM images, high fidelity structures with aspect ratios of 7:1 can be fabricated in thick films with vertical sidewalls. Bonding between two copper surfaces over various gap sizes was achieved by electroless deposition without the addition of surfactants or inhibitors in the bath. The effect of anneal temperature on the electroless bond formed was analyzed. The electroless bond strength increased with anneal temperature. However, the bond strength estimation for samples annealed at 80°C to 120°C is a minimum value due to the failure location of most of the pillars and the resulting area used in the calculation of bond strength. Grain growth from copper recrystallization and removal of small defects improve the bond strength. Large voids at the interface of the two pillars were related to rough starting surfaces for the electroplated pillars.
32

Ion track modification of polyimide film for development of palladium composite membrane for hydrogen separation and purification

Adeniyi, Olushola Rotimi January 2011 (has links)
<p>South Africa s coal and platinum mineral resources are crucial resources towards creating an alternative and environmentally sustainable energy system. The beneficiation of these natural resources can help to enhance a sustainable and effective clean energy base infrastructure and further promote their exploration and exportation for economics gains. By diversification of these resources, coal and the platinum group metals (PGMs) especially palladium market can be further harnessed in the foreseeable future hence SA energy security can be guaranteed from the technological point of view. The South Africa power industry is a critical sector, and has served as a major platform in the South African socio-economic development. This sector has also been identified as a route towards an independent energy base, with global relevance through the development of membrane technologies to effectively and economically separate and purify hydrogen from the gas mixtures released during coal gasification. The South Africa power industry is a critical sector, and has served as a major platform in the SA&rsquo / s socio-economic development. This sector has also been identified as a route towards an independent energy base, with global relevance through the development of membrane technologies to effectively and economically separate and purify hydrogen from the gas mixtures released during coal gasification. Coal gasification is considered as a source of hydrogen gas and the effluent gases released during this process include hydrogen sulphide, oxides of carbon and nitrogen, hydrogen and other particulates. In developing an alternative hydrogen gas separating method, composite membrane based on organic-inorganic system is being considered since the other available methods of hydrogen separation are relatively expensive.<br /> &nbsp / </p>
33

Development of low viscosity, high dielectric constant polymers for integral passive applications

Troutman, Tia Shawana January 1999 (has links)
No description available.
34

Slotted and circular pore surface microfiltration

Bromley, Alan J. January 2002 (has links)
The work described by this thesis is a comparison of pore opening geometry for true surface microfilters. True surface microfilters can be thought of as very fine sieves, with pore sizes less than 10 microns. All other types of so-called microfiltration membranes do not rely on sieving, but obtain their pore retention rating by particle collection mechanisms similar to depth filters. Particle deposition within such microfilters results in permeate flow rate dechne, for a fixed pressure filtration, or pressure drop rise, for a fixed rate filtration. The true surface microfilter pore geometnes considered were circular and slotted, and microfilters with filtering dimension of less than 10 microns were used. The slotted pore microfilters are not commercially available and had to be made in the laboratory as part of this study. The technique used was to plate nickel onto an existing substrate, thereby reducing the pore dimension until It was within the microfiltration range. The plating was by electroless nickel solution and not by galvanic means. Significant development of the electroless platmg technique led ultimately to the successful manufacture of process scale slotted surface microfilters.
35

Enhanced Adhesion Between Electroless Copper and Advanced Substrates

Hayden, Harley T. 11 April 2008 (has links)
In this work, adhesion between electrolessly deposited copper and dielectric materials for use in microelectronic devices is investigated. The microelectronics industry requires continuous advances due to ever-evolving technology and the corresponding need for higher density substrates with smaller features. At the same time, adhesion must be maintained in order to preserve package reliability and mechanical performance. In order to meet these requirements two approaches were taken: smoothing the surface of traditional epoxy dielectric materials while maintaining adhesion, and increasing adhesion on advanced dielectric materials through chemical bonding and mechanical anchoring. It was found that NH3 plasma treatments can be effective for increasing both catalyst adsorption and adhesion across a range of materials. This adhesion is achieved through increased nitrogen content on the polymer surface, specifically N=C. This nitrogen interacts with the palladium catalyst particles to form chemical anchors between the polymer surface and the electroless copper layer without the need for roughness. Chemical bonding alone, however, did not enable sufficient adhesion but needed to be supplemented with mechanical anchoring. Traditional epoxy materials were treated with a swell and etch process to roughen the surface and create mechanical anchoring. This same process was found to be ineffective when used on advanced dielectric materials. In order to create controlled roughness on these surfaces a novel method was developed that utilized blends of traditional epoxy with the advanced materials. Finally, combined treatments of surface roughening followed by plasma treatments were utilized to create optimum interfaces between traditional or advanced dielectric materials and electroless copper. In these systems adhesion was measured over 0.5 N/mm with root-mean-square surface roughness as low as 15 nm. In addition, the individual contributions of chemical bonding and mechanical anchoring were identified. The plasma treatment conditions used in these experiments contributed up to 0.25 N/mm to adhesion through purely chemical bonding with minimal roughness generation. Mechanical anchoring accounted for the remainder of adhesion, 0.2-0.8 N/mm depending on the level of roughness created on the surface. Thus, optimized surfaces with very low surface roughness and adequate adhesion were achieved by sequential combination of roughness formation and chemical modifications.
36

Metody a technologie vytváření kovových kontaktů pro struktury křemíkových solárních článků / Preparation and evaluation of metallic contacts for crystalline

Frodl, Miroslav January 2008 (has links)
This work deals with the advanced methods of contact’s fabrication for monocrystalline solar cells and the appropriate methods for the analysis of their properties with a focus on the study and realization the contact’s structures with low contact and sheet resistance fabricated by galvanic and electroless processes. In the first part of the work is discussed the theory of solar cells and buried contacts and in the second part of the work is an evaluation of practical realization.
37

Methane and Solid Carbon Based Solid Oxide Fuel Cells

Chien, Chang-Yin 07 April 2011 (has links)
No description available.
38

Fabrication and Characterization of DNA Templated Electronic Nanomaterials and Their Directed Placement by Self-Assembly of Block Copolymers

Ranasinghe Weerakkodige, Dulashani Ruwanthika 01 August 2022 (has links)
Bottom-up self-assembly has the potential to fabricate nanostructures with advanced electrical features. DNA templates have been used to enable such self-assembling methods due to their versatility and compatibility with various nanomaterials. This dissertation describes research to advance several different steps of biotemplated nanofabrication, from DNA assembly to characterization. I assembled different nanomaterials including surfactant-coated Au nanorods, DNA-linked Au nanorods and Pd nanoparticles on DNA nanotubes ~10 micrometer long, and on ~400 nm long bar-shaped DNA origami templates. I optimized seeding by changing the surfactant and magnesium ion concentrations in the seeding solution. After successful seeding, I performed electroless plating on those nanostructures to fabricate continuous nanowires. Using the four-point probe technique, I performed resistivity measurements for Au nanowires on DNA nanotubes and obtained values between 9.3 x 10-6 and 1.2 x 10-3 ohm meter. Finally, I demonstrated the directed placement of DNA origami using block copolymer self-assembly. I created a gold nanodot array using block copolymer patterning and metal evaporation followed by lift-off. Then, I used different ligand groups and DNA hybridization to attach DNA origami to the nanodots. The DNA hybridization approach showed greater DNA attachment to Au nanodots than localization by electrostatic interaction. These results represent vital progress in understanding DNA-templated components, nanomaterials, and block copolymer nanolithography. The work in this dissertation shows potential for creating DNA-templated nanodevices and their placement in an ordered array in future nanoelectronics. Each of the described materials and techniques further has potential for addressing the need for increased complexity and integration for future applications.
39

Macro Porous Graphene from Hollow Ni Templates via Polymer Templates with Bi-Continuous

Liu, Kewei January 2014 (has links)
No description available.
40

Effects of Transport and Additives on Electroless Copper Plating

Zeszut, Ronald Anthony, Jr. 07 September 2017 (has links)
No description available.

Page generated in 0.1104 seconds