Neste trabalho foram estudadas deposições químicas de ligas CuNixPy e foram fabricados termopares Cu/CuNixPy sobre superfícies de lâminas de silício. Inicialmente, as superfícies foram pré-ativadas em uma solução diluída de ácido fluorídrico contendo PdCl2. Em seguida, foi empregado um banho químico alcalino diluído em água deionizada contendo 15 g/l NiSO4.6H2O; 0,1 a 0,3 g/l CuSO4.5H2O; 15 g/l Na2HPO2.H2O e 60 g/l Na3C6H5O7.2H2O na temperatura de 80OC sendo que NH4OH foi adicionado até que o pH do banho atingisse o valor de 8,0. Verificamos que a concentração do sal de cobre na solução de deposição afeta substancialmente a quantidade de cobre nos depósitos de CuNixPy. As concentrações planares e as composições dos filmes depositados foram obtidas através da técnica de espectrometria de retroespalhamento de Rutherford (RBS) e a morfologia superficial foi caracterizada através da técnica de microscopia de força atômica (AFM). A solução: 15 g/l NiSO4.6H2O + 0,3 g/l CuSO4.5H2O + 15 g/l Na2HPO2.H2O + 60 g/l Na3C6H5O7.2H2O + NH4OH (pH 8.0) na temperatura de 80OC foi a escolhida na obtenção da liga CuNiP0,5 para a construção de termopares Cu/CuNiP0,5 os quais apresentaram potência termoelétrica de aproximadamente (866) V/oC semelhante aos valores típicos apresentados na literatura para Cu/CuNi. / In this work, it was studied chemical depositions of CuNixPy alloys and it was fabricated Cu/CuNixPy thermocouples onto silicon wafer surfaces. Initially, surfaces were pre-activated in a diluted hydrofluoric acid solution containing PdCl2. Following, it was used a de-ionizedwater- diluted alkaline chemical bath containing 15 g/l NiSO4.6H2O; 0,1-0,3 g/l CuSO4.5H2O; 15 g/l Na2HPO2.H2O and 60 g/l Na3C6H5O7.2H2O at temperature of 80OC where NH4OH was added until ph was 8.0. The concentration of copper salt in the deposition solution greatly affected the Cu content of the CuNixPy deposits. Areal concentration and composition were measured by Rutherford Backscattering Spectrometry (RBS) and surface morphology was characterized by Atomic Force Microscopy (AFM). The solution: 15 g/l NiSO4.6H2O; 0.3 g/l CuSO4.5H2O; 15 g/l Na2HPO2.H2O; 60 g/l Na3C6H5O7.2H2O; NH4OH (pH 8.0) at the temperature of 80OC was chosen to obtain the CuNiP0.5 alloy to fabricate Cu/CuNiP0.5 thermocouples with thermoelectric power of about (866) V/oC, which is similar to the typical values reported in literature for Cu/CuNi.

Neste trabalho foram estudadas deposições químicas de ligas CuNixPy e foram fabricados termopares Cu/CuNixPy sobre superfícies de lâminas de silício. Inicialmente, as superfícies foram pré-ativadas em uma solução diluída de ácido fluorídrico contendo PdCl2. Em seguida, foi empregado um banho químico alcalino diluído em água deionizada contendo 15 g/l NiSO4.6H2O; 0,1 a 0,3 g/l CuSO4.5H2O; 15 g/l Na2HPO2.H2O e 60 g/l Na3C6H5O7.2H2O na temperatura de 80OC sendo que NH4OH foi adicionado até que o pH do banho atingisse o valor de 8,0. Verificamos que a concentração do sal de cobre na solução de deposição afeta substancialmente a quantidade de cobre nos depósitos de CuNixPy. As concentrações planares e as composições dos filmes depositados foram obtidas através da técnica de espectrometria de retroespalhamento de Rutherford (RBS) e a morfologia superficial foi caracterizada através da técnica de microscopia de força atômica (AFM). A solução: 15 g/l NiSO4.6H2O + 0,3 g/l CuSO4.5H2O + 15 g/l Na2HPO2.H2O + 60 g/l Na3C6H5O7.2H2O + NH4OH (pH 8.0) na temperatura de 80OC foi a escolhida na obtenção da liga CuNiP0,5 para a construção de termopares Cu/CuNiP0,5 os quais apresentaram potência termoelétrica de aproximadamente (866) V/oC semelhante aos valores típicos apresentados na literatura para Cu/CuNi. / In this work, it was studied chemical depositions of CuNixPy alloys and it was fabricated Cu/CuNixPy thermocouples onto silicon wafer surfaces. Initially, surfaces were pre-activated in a diluted hydrofluoric acid solution containing PdCl2. Following, it was used a de-ionizedwater- diluted alkaline chemical bath containing 15 g/l NiSO4.6H2O; 0,1-0,3 g/l CuSO4.5H2O; 15 g/l Na2HPO2.H2O and 60 g/l Na3C6H5O7.2H2O at temperature of 80OC where NH4OH was added until ph was 8.0. The concentration of copper salt in the deposition solution greatly affected the Cu content of the CuNixPy deposits. Areal concentration and composition were measured by Rutherford Backscattering Spectrometry (RBS) and surface morphology was characterized by Atomic Force Microscopy (AFM). The solution: 15 g/l NiSO4.6H2O; 0.3 g/l CuSO4.5H2O; 15 g/l Na2HPO2.H2O; 60 g/l Na3C6H5O7.2H2O; NH4OH (pH 8.0) at the temperature of 80OC was chosen to obtain the CuNiP0.5 alloy to fabricate Cu/CuNiP0.5 thermocouples with thermoelectric power of about (866) V/oC, which is similar to the typical values reported in literature for Cu/CuNi.

Transition metals complexes have been involved in various catalytic, biomedical and industrial applications, but only lately they have been associated with nanomaterials to produce innovative and well-defined new hybrid systems. The introduction of transition metals into nanomaterials is important to bear the advantages of metals to nanoscale and also to raise the stability of nanomaterials. In this dissertation, we study two approaches of associating transition metals into nanomaterials. The first approach is via spontaneous self-organization based assembly of small molecule amphiphiles and bulky hydrophilic polymers to produce organic-inorganic hybrid materials that have nanoscale features and can be precisely controlled depending on the experimental conditions used. These hybrid materials can successfully act as templates to design new porous material with interesting architecture. The second approach studied is via electroless reduction of transition metals on the surface of nanocarbons (nanotubes and nanodiamonds) without using any reducing agents or catalysts. The synthesis of these systems is highly efficient and facile resulting in stable and mechanically robust new materials with promising applications in catalysis.

This work provides a detailed characterization study on H2S poisoning of Pd and Pd/Au alloy composite membranes to obtain fundamental understandings of sulfur poisoning phenomena and preparation of sulfur tolerant membranes. The enhancement of the sulfur tolerance by alloying Pd with Au has been confirmed by both permeation test and microstructure analysis (SEM and XRD). While pure Pd membranes exhibited the permeance decline in the presence of H2S due to both sulfur adsorption and bulk Pd4S formation, Pd/Au alloy membranes showed the permeance loss merely resulted from the surface sulfur adsorption without bulk sulfide formation up to 55 ppm H2S. The XPS study confirmed that the H2S adsorption on the Pd/Au alloy surfaces was dissociative, and both surface Au and Pd sulfides were formed with the preferential Au-S bonding. The adsorption type of sulfur on the Pd/Au alloy surfaces was monolayer with a limited coverage, which increased with decreasing temperature. The permeance loss of Pd/Au membranes was essentially fully recoverable in H2, and the integrity of the membranes remained unaltered after the poisoning/recovery tests. Increasing Au composition in the Pd/Au membranes increased the sulfur tolerance. A Pd/Au alloy membrane of 16.7 wt% Au exhibited a permeance over 50% of its original value in the presence of 5 ppm H2S at 400°C, while a Pd membrane showed 85% permeance loss. The Pd/Au alloy membranes were fabricated by the Au displacement deposition, which had an empirical reaction order of 3.2 determined by the AAS. The HT-XRD study verified that the formed Pd/Au alloy layers were thermally stable up to 500°C.

A process for micromachining of micro-mirror devices from silicon-on-insulator wafers was proposed and implemented. Test methods and force applicators for these devices were developed. Following successful fabrication of these devices, a novel process for fabrication of devices out of the plane of the silicon wafer was proposed, so that the devices could be actuated electrostatically. In particular, the process makes use of thick photoresist layers as a sacrificial mold into which an amorphous nickel-phosphorous alloy may be deposited. Ideal design of the electrostatically actuated micro-mirrors was investigated, and a final design was selected and modeled using FEA software, which found that serpentine-hinged devices require approximately 33% of the actuation force of their straight-beamed counterparts. An aqueous electroless plating solution composed of nickel acetate, sodium hypophosphite, citric acid, ammonium acetate, and Triton X-100 in was developed for use with the process, and bath operating parameters of 85°C and 4.5 pH were determined. However, this electroless solution failed to deposit in the presence of the photoresist. Several mechanisms proposed for deposition failure included leaching of organic solvents from the photoresist, oxidation of the nickel-titanium seed layer on which the deposition was intended to occur, and nonlinear diffusion of dissolved oxygen in the solution.

In this work, Poly (diallyldimethylammonium) chloride - (PDDA) was used as a base layer for developing colloid displacement lithography platforms for sensor applications. Previous work shows that glass coated with PDDA and exposed to gold acts as a good platform for colloid displacement lithography. However, for actual sensor applications, electrical isolation of individual sensor sections must be achieved. This is attempted by laying down a 40 μm stripe of PDDA on a cleaned substrate and coating that stripe with gold colloid. The size of 40 μm or less in width is set as the target to fit within the scan window of the AFM. Stripes wider than about 40 μm would be difficult to efficiently pattern with colloid displacement lithography. While the goal of 40 μm wide stripes was achieved with sufficiently diluted PDDA solution, it was found to be difficult to adsorb sufficient amounts of gold colloid on those stripes before the stripes were lost from the glass substrate. Further, electroless deposition was found to produce only a small amount of gold on the PDDA surface without colloid nucleation sites being present.

Avatrel 8000P's excellent photo-definition properties and mechanical strength make it an ideal polymer collar material. Avatrel 8000P is a high contrast, I-line sensitive mixture that can be developed in traditional aqueous-base developers. The great photolithographical performance of this photopolymer can be partly contributed to the minimal amount of light absorbed by the base norbornene polymer. The processing conditions noted in this work are an optimized version, which have been shown to give superior photolithographical performance. The simple baking procedures make Avatrel 8000P easier to process than SU-8. The ability to develop Avatrel 8000P in aqueous base can reduce chemical waste. As shown by SEM images, high fidelity structures with aspect ratios of 7:1 can be fabricated in thick films with vertical sidewalls. Bonding between two copper surfaces over various gap sizes was achieved by electroless deposition without the addition of surfactants or inhibitors in the bath. The effect of anneal temperature on the electroless bond formed was analyzed. The electroless bond strength increased with anneal temperature. However, the bond strength estimation for samples annealed at 80°C to 120°C is a minimum value due to the failure location of most of the pillars and the resulting area used in the calculation of bond strength. Grain growth from copper recrystallization and removal of small defects improve the bond strength. Large voids at the interface of the two pillars were related to rough starting surfaces for the electroplated pillars.

The subject of this diploma thesis is the preparation of conductive structures by electroless plating of an extruded precursor. The experimental part deals with the preparation of standard patterns based on the length of immersion time in a coppering bath. The precursor layers were applied with Fujifilm Dimatix to various receiver substrates. The individual substrates with the precursor layer were immersed in the copper solution within different time intervals. The structure of the layers of grown copper and their thickness was characterized by a profilometer.

No description available.

京都大学 / 0048 / 新制・課程博士 / 博士(工学) / 甲第19724号 / 工博第4179号 / 新制||工||1644(附属図書館) / 32760 / 京都大学大学院工学研究科材料化学専攻 / (主査)教授 平尾 一之, 教授 三浦 清貴, 教授 田中 勝久 / 学位規則第4条第1項該当 / Doctor of Philosophy (Engineering) / Kyoto University / DFAM