With development and advancement of notebook, at the same time it brings its cooling problem, it is very important that use outside surface cooling except inside. The main in study is simulate of electronic cooling in Notebook outside surface, design force convection models and placed them under the Notebook, force convection has immediate effect on the surface and produce heat dissipation. The simulation uses software FLUENT 6.0 to analysis the result of heat dissipation, the models are constructed and described by use turbulent field of three dimensions. The study has two main parameters¡GThe form of force convection models and controlled airflow. The result of numerical analysis use Nusselt number to determine the effect of heat dissipation. According to the result of numerical analysis to increase effect of heat dissipation for the following methods¡G1. Increase airflow across the designed models, 2. Decrease the angle of elevation when using notebook, 3. Airflow enter the designed models by one entrance and leave by the side exports, 4. When airflow pass through the designed models smoothly, 5. Airflow can influence the notebook surface immediately.

The study considered development of a finite-element numerical simulation model for the analysis of fluid flow and conjugate heat transfer in a zero boil-off (ZBO) cryogenic storage system. A spherical tank was considered for the investigation. The tank wall is made of aluminum and a multi-layered blanket of cryogenic insulation (MLI) has been attached on the top of the aluminum. The tank is connected to a cryocooler to dissipate the heat leak through the insulation and tank wall into the fluid within the tank. The cryocooler has not been modeled; only the flow in and out of the tank to the cryocooler system has been included. The primary emphasis of this research has been the fluid circulation within the tank for different fluid distribution scenario and for different level of gravity to simulate all the potential earth and space based applications. The steady-state velocity, temperature, and pressure distributions were calculated for different inlet positions, inlet velocities, and for different gravity values. The simulations were carried out for constant heat flux and constant wall temperature cases. It was observed that a good flow circulation could be obtained when the cold entering fluid was made to flow in radial direction and the inlet opening was placed close to the tank wall. The transient and steady state heat transfer for laminar flow inside a circular microtube within a rectangular substrate during start up of power has also been investigated. Silicon, Silicon Carbide and Stainless Steel were the substrates used and Water and FC-72 were the coolants employed. Equations governing the conservation of mass, momentum, and energy were solved in the fluid region. Within the solid wafer, the heat conduction was solved. The Reynolds number, Prandtl number, thermal conductivity ratio, and diameter ranges were: 1000--1900, 6.78--12.68, 27--2658, and 300 µ m--1000 µ m respectively. It was found that a higher aspect ratio or larger diameter tube and higher thermal conductivity ratio combination of substrate and coolant requires lesser amount of time to attain steady state. It was seen that enlarging the tube from 300 µ m to 1000 µ m results in lowering of the fluid mean temperature at the exit. Nusselt number decreased with time and finally reached the steady state condition. It was also found that a higher Prandtl number fluid attains higher maximum substrate temperature and Nusselt number. A correlation for peripheral average Nusselt number was developed by curve-fitting the computed results with an average error of 6.5%. This correlation will be very useful for the design of circular microtube heat exchangers.

Spray cooling has proven to be efficient in managing thermal load in high power applications. Reliability of electronic products relies on the thermal management and understanding of heat transfer mechanisms including those related to spray cooling. However, to date, several of the key heat transfer mechanisms are still not well understood. An alternative approach for improving the heat transfer performance is to change the film dynamics through surface modification. The main goal of this study is to understand the effects of nano-scale features on flat heater surfaces subjected to spray cooling and to determine the major factors in droplet impingement cooling to estimate their effects in the spray cooling system. Single droplet stream and simultaneous triple droplet stream with two different stream spacings (500 μm and 2000 μm), experiments have been performed to understand the droplet-surface interactions relevant to spray cooling systems. Experiments have been conducted on nano-structured surfaces as well as on flat (smooth) surfaces. It is observed that nano-structured surfaces result in lower minimum wall temperatures, better heat transfer performance, and more uniform temperature distribution. A new variable, effective thermal diameter (de), was defined based on the radial temperature profiles inside the impact zone to quantify the effects of the nano-structured surface in droplet cooling. Results indicate that larger effective cooling area can be achieved using nano-structured surface in the single droplet stream experiments. In triple stream experiments, nano-structured surface also showed an enhanced heat transfer. In single stream experiments, larger outer ring structures (i.e. larger outer diameters) in the impact crater were observed on the nano-structured surfaces which can be used to explain enhanced heat transfer performance. Smaller stream spacing in triple stream experiments reveal that the outer ring structure is disrupted resulting in lower heat transfer. Lower static contact angle on the nano-structured surface has been observed, which implies that changes in surface properties result in enhanced film dynamics and better heat transfer behavior. The results and conclusions of this study should be useful for understanding the physics of spray cooling and in the design of better spray cooling systems.

A novel complementary metal oxide semiconductor (CMOS) compatible microchannel heat sink is designed, fabricated, and tested for electronic cooling applications. The proposed microchannel heat sink requires no design change of the electronic circuitry underneath. Therefore, microchannels can be fabricated on top of the finished CMOS wafers by just adding a few more steps to the fabrication flow. Combining polymer (parylene C) and metal (copper) structures, a high performance microchannel heat sink can be easily manufactured on top of the electronic circuits, forming a monolithic cooling system. In the design stage, computer simulations of the microchannels with several different dimensions have been performed. Microchannels made of only parylene showed poor heat transfer performance as expected since the thermal conductivity of parylene C is very low. Therefore an alternative design comprising structural parylene layer and embedded metal layers has been modeled. Copper is selected as the metal due to its simple fabrication and very good thermal properties. The results showed that the higher the copper surface area the better the thermal performance of the heat sinks. Based on the modeling results, the final test structures are designed with full copper sidewalls with a parylene top wall. Several different microchannel test chips have been fabricated in METU-MEMS Research &amp / Application Center cleanroom facilities. The devices are tested with different flow rates and heat loads. During the tests, it was shown that the test devices can remove about 126 W/cm2 heat flux from the chip surface while keeping the chip temperature at around 90&deg / C with a coolant flow rate of 500 &mu / l/min per channel.

This project studied the effect of different parameters on the conjugate heat transfer in tube-in-block heat exchangers for various engineering applications. These included magnetic coolers (or heaters) associated with a magnetic refrigeration system, high heat flux coolers for electronic equipment, and hydronic snow melting system embedded in concrete slabs. The results of this research will help in designing the cooling/heating systems and select their appropriate geometrical dimensions and material for specific applications. Types of problems studied in this project are: steady state circular microchannels with heat source in the gadolinium substrate, transient heat transfer in circular microchannels with time varying heat source in a gadolinium substrate, transient heat transfer in composite trapezoidal microchannels of silicon and gadolinium with constant and time varying heat source, steady state heat transfer in microchannels using fluids suspended with nanoparticl es, and analysis of steady state and transient heat transfer in a hydronic snow melting system. For each of these problems a numerical simulation model was developed. The mass, momentum, and energy conservation equations were solved in the fluid region and energy conservation in the solid region of the heat exchanger to arrive at the velocity and temperature distributions. Detailed parametric study was carried out for each problem. Parameters were Reynolds number, heat source value, channel diameter or channel height, solid materials and working fluids. Results are presented in terms of solid-fluid interface temperature, heat flow rate, heat transfer coefficient, and Nusselt number along the length of the channel and with the progression of time. The results showed that an increase in Reynolds number decreases the interface temperature but increases the heat flow rate and Nusselt number. When the heat source varied with time, by applying and removing the magnetic field, the interface temperature, heat flow rate, and Nusselt number attained a periodic variation with time. The decrease in the diameter at constant Reynolds number decreases the interface temperature and increases the heat flow rate at the fluid-solid interface.

Orientador: Marcelo Moreira Ganzarolli / Dissertação (mestrado) - Universidade Estadual de Campinas, Faculdade de Engenharia Mecanica / Made available in DSpace on 2018-08-06T22:57:02Z (GMT). No. of bitstreams: 1 Rocha_AndreDamiani_M.pdf: 4938161 bytes, checksum: e139ea372e776b57e12d4e6c9bb02645 (MD5) Previous issue date: 2005 / Resumo: No presente trabalho o resfriamento por convecção natural de uma placa plana, disposta em um meio infinito, contendo elementos protuberantes aquecidos e distribuídos uniformemente sobre uma das paredes da placa é analisado experimentalmente sob a condição de aquecimento uniforme. A parede oposta da placa de teste é isolada utilizando um aquecedor de proteção que possui as mesmas dimensões da placa de teste. Os testes experimentais utilizam um aparato com placa de fibra de vidro contendo elementos protuberantes de alumínio de seção quadrada, em cujo interior passa uma resistência. A placa de teste é posicionada em uma estrutura de ferro que foi projetada para permitir a variação da inclinação da placa. As trocas de calor por condução, através da placa de fixação dos elementos protuberantes, e por radiação, entre as superfícies das protuberâncias foram consideradas. Testes experimentais foram realizados variando a potência entre 30 e 70W para uma variação angular entre 0° e 60° a partir da posição vertical. Do presente trabalho concluiu-se que foi possível avaliar o número de Nusselt em função do número de Rayleigh para placa protuberante e inclinada através de uma única correlação, desde que a componente da aceleração gravitacional paralela à placa seja utilizada no cálculo do número de Rayleigh modificado / Abstract: In the present work, cooling with natural convection of a plate, disposed in an infinite middle, containing protruding heated elements and distributed evenly on one of the walls of the plate it is analyzed experimentally about the condition of uniform heating. The opposite wall of the test plate is considered isolated using a guard heater that possesses the same dimensions that the test plate. Experimental tests are performed in a apparatus containing fiberglass plates with protruding, square section, aluminum elements. The test plate is positioned in a structure of iron that was projected to allow the angular variation of the plate. The conduction heat transfer through the plate and radiation heat transfer among the surfaces of the protruding were considered. Tests were accomplished varying the power between 30 and 70W for an angular variation between 0° and 60° starting from the vertical position. The investigation shows that it is possible to evaluate Nusselt number as a function of the modified Rayleigh number for inclined and protruding plate through an only correlation, since to component of the gravitational acceleration parallel to the plate it is used in the calculation ofthe modified Rayleigh number / Mestrado / Termica e Fluidos / Mestre em Engenharia Mecânica

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Yes / The ever-increasing demand for high-processing electronic systems has unequivocally called for improved microprocessor performance. However, increasing microprocessor performance requires increasing power and on-chip power density, both of which are associated with increased heat dissipation. Electronic cooling using fins have been identified as a reliable cooling approach. However, an investigation into the thermal behaviour of fin would help in the design of miniaturized, effective heatsinks for reliable microprocessor cooling. The aim of this paper is to investigates the simultaneous effects of surface roughness, porosity and magnetic field on the performance of a porous micro-fin under a convective-radiative heat transfer mechanism. The developed thermal model considers variable thermal properties according to linear, exponential and power laws, and are solved using Chebychev spectral collocation method. Parametric studies are carried using the numerical solutions to establish the influences of porosity, surface roughness, and magnetic field on the microfin thermal behaviour. Following the results of the simulation, it is established that the thermal efficiency of the micro-fin is significantly affected by the porosity, magnetic field, geometric ratio, nonlinear thermal conductivity parameter, thermogeometric parameter and the surface roughness of the micro-fin. However, the performance of the micro-fin decreases when it operates only in a convective environment. In addition, we establish that the fin efficiency ratio which is the ratio of the efficiency of the rough fin to the efficiency of the smooth fin is found to be greater than unity when the rough and smooth fins of equal geometrical, physical, thermal and material properties are subjected to the same operating condition. The investigation establishes that improved thermal management of electronic systems would be achieved using rough surface fins with porosity under the influences of the magnetic field. / Supported in part by the Tertiary Education Trust Fund of Federal Government of Nigeria, and the European Union’s Horizon 2020 research and innovation programme under grant agreement H2020-MSCA-ITN- 2016SECRET-722424.

Submitted by Fabricia Fialho Reginato (fabriciar) on 2015-08-27T23:08:49Z No. of bitstreams: 1 MarcosWOYCIEKOSKI.pdf: 2220255 bytes, checksum: 001c865faf4b29be82c72c3341fa51a4 (MD5) / Made available in DSpace on 2015-08-27T23:08:49Z (GMT). No. of bitstreams: 1 MarcosWOYCIEKOSKI.pdf: 2220255 bytes, checksum: 001c865faf4b29be82c72c3341fa51a4 (MD5) Previous issue date: 2012-03 / CAPES - Coordenação de Aperfeiçoamento de Pessoal de Nível Superior / Com a rápida evolução da tecnologia, os dispositivos eletrônicos tornaram-se compactos e com o alto poder de processamento, aumentando a geração de calor. Mas devido à baixa eficiência de ventiladores e dissipadores utilizados atualmente, há a necessidade de desenvolver novas formas de resfriamento. O uso de jatos sintéticos no resfriamento de dispositivos eletrônicos ainda é incipiente. Estudos monstram que este método pode ser uma alternativa eficaz. Assim, neste trabalho foi desenvolvido um estudo experimental com jatos sintéticos onde foram analisadas diferentes configurações de jatos com orifício retangular. Um alto-falante foi utilizado como diafragma e excitado através de um gerador de sinais senoidais para produzir o jato. A frequência de ressonância era desconhecida e foi necessário analisá-la antes de iniciar o experimento. O sistema foi montado em um suporte móvel para que fosse possível variar a posição vertical do gerador de jatos. Foram analisadas as dimensões do orifício para diferentes diâmetros hidráulicos (4 – 8 mm) e razões de aspecto (2 – 4), como também a profundidade da cavidade (2 – 8 mm). Também se analisou a transferência de calor através do impacto de jatos sobre uma placa aquecida. Dentre os estudos, verificaram-se outros parâmetros como o número de Reynolds e o número de Strouhal a fim de calcular a frequência mais adequada para a produção de vórtices. Os resultados demonstraram que para orifícios retangulares, as configurações com diâmetro hidráulico maior e razão de aspecto menor, são as melhores opções para resfriamento dos dispositivos eletrônicos. / With the rapid evolution of technology, electronics have become more compact and with higher processing power, increasing heat generation. Thus, there is a need to develop new forms of cooling, due to the low efficiency of cooling fans and heatsinks used currently. Using synthetic jets for cooling electronic device is still incipient but studies show that this method is an effective alternative. Thus, this work was developed an experimental study with synthetic jets where different configurations were tested with rectangular orifice. A loudspeaker was used as diaphragm and it was excited by a sinusoidal signal generator to produce the jet. The previously unknown ressonant frequency was determined experimentaly as part of this study. The system was mounted on a vertical traverse to allow changes in the vertical position of the synthetic jet generator. Orifice dimensions were analyzed covering variations in hydraulic diameter (4-8 mm) and aspect ratio (2-4), as well as the depth of the cavity (2-8 mm). Also the heat transfer was examined through the jet impingement on a hot plate. Other parameters such as Reynolds and Strouhal number were also examined in order to calculate the best frequency for jet performance. Results show that for rectangular orifice, geometries with larger hydraulic diameter and aspect ratio smaller are the best options for electronic cooling devices.

Advancements in the networking and routing industry have created higher power electronic systems which dissipate large amounts of heat while cooling technology for these electronic systems has remained relatively unchanged. This report illustrates the development and testing of a hybrid liquid-air cooling system prototype implemented on Cisco’s 7609s router. Water was the working fluid through cold plates removing heat from line card components. The water was cooled by a compact liquid-air heat exchanger and circulated by two pumps. The testing results show that junction temperatures were maintained well below the 105°C limit for ambient conditions around 30°C at sea level. The estimated junction temperatures for Cisco’s standard ambient conditions of 50°C at 6,000 feet and 40°C at 10,000 feet were 104°C and 96°C respectively. Adjustments to the test data for Cisco’s two standard ambient conditions with expected device characteristics suggested the hybrid liquid-air cooling design could meet the projected heat load.