Cooling of electronic equipments has become an important issue as the advances in technology enabled the fabrication of very small devices. The main challenge in cooling is the space limitation. The use of miniature refrigerators seems to be a solution alternative for the cooling problem. The objective of this study is to design and simulate a vapor compression refrigeration cycle for a micro-scale refrigerator. A MATLAB code is developed for the simulations. The four components of the refrigerator, namely, the condenser, evaporator, compressor and the capillary tube are designed separately. The cycle is successfully completed nearly at the same point where it begins. The cold space temperature, ambient air temperature, condensation and evaporation temperatures, and the evaporator heat load are the predetermined parameters. A fan is used to cool the condenser, and the compressor is selected as isentropic. R-134A is selected as the refrigerant and a simple interpolation code is developed to obtain the thermophysical properties of R-134A. The original design is carried out with an isentropic compressor. For the purpose of comparison, a cycle with a polytropic compressor is also considered. Similarly, two alternative designs for the evaporator are developed and simulated. A second law analysis is performed at the end of the study.

Thermal management challenges for microelectronics are a major issue for future integrated circuits, thanks to the continued exponential growth in component density described by Moore¡¯s Law. Current projections from the International Technology Roadmap for Semiconductors predict that local heat fluxes will exceed 1 kW/cm2 within a decade. There is thus an urgent need to develop new compact, high heat flux forced-liquid and evaporative cooling technologies. Thermometry techniques that can measure temperature fields with micron-scale resolution without disturbing the flow of coolant would be valuable in developing and evaluating new thermal management technologies. Specifically, the ability to estimate local convective heat transfer coefficients, which are proportional to the difference between the bulk coolant and wall surface temperatures, would be useful in developing computationally efficient reduced-order models of thermal transport in microscale heat exchangers. The objective of this doctoral thesis is therefore to develop and evaluate non-intrusive optical thermometry techniques to measure wall surface and bulk liquid temperatures with O(1-10 micronmeter) spatial resolution. Intensity-based fluorescence thermometry (FT), where the temperature distribution of an aqueous fluorescent dye solution is estimated from variations in the fluorescent emission intensity, was used to measure temperatures in steady Poiseuille flow at Reynolds numbers less than 10. The flow was driven through 1 mm square channels heated on one side to create temperature gradients exceeding 8 ¡ÆC/mm along both dimensions of the channel cross-section. In the evanescent-wave fluorescence thermometry (EFT) experiments, a solution of fluorescein was illuminated by evanescent waves to estimate the solution temperature within about 300 nm of the wall. In the dual-tracer FT (DFT) studies, a solution of two fluorophores with opposite temperature sensitivities was volumetrically illuminated over most of the `cross-section of the channel to determine solution temperatures in the bulk flow. The accuracy of both types of FT is determined by comparing the temperature data with numerical predictions obtained with commercial computational fluid dynamics software. The results indicate that EFT can measure wall surface temperatures with an average accuracy of about 0.3 ¡ÆC at a spatial resolution of 10 micronmeter, and that DFT can measure bulk water temperature fields with an average accuracy of about 0.3 ¡ÆC at a spatial resolution of 50 micronmeter in the image plane. The results also suggest that the spatial resolution of the DFT data along the optical axis (i.e., normal to the image plane) is at least an order of magnitude greater than the depth of focus of the imaging system.

A stacked microchannel heat sink was developed to provide efficient cooling for microelectronics devices at a relatively low pressure drop while maintaining chip temperature uniformity. Microfabrication techniques were employed to fabricate the stacked microchannel structure, and experiments were conducted to study its thermal performance. A total thermal resistance of less than 0.1 K/W was demonstrated for both counter flow and parallel flow configurations. The effects of flow direction and interlayer flow rate ratio were investigated. It was found that for the low flow rate range the parallel flow arrangement results in a better overall thermal performance than the counter flow arrangement; whereas, for the large flow rate range, the total thermal resistances for both the counter flow and parallel flow configurations are indistinguishable. On the other hand, the counter flow arrangement provides better temperature uniformity for the entire flow rate range tested. The effects of localized heating on the overall thermal performance were examined by selectively applying electrical power to the heaters. Numerical simulations were conducted to study the conjugate heat transfer inside the stacked microchannels. Negative heat flux conditions were found near the outlets of the microchannels for the counter flow arrangement. This is particularly evident for small flow rates. The numerical results clearly explain why the total thermal resistance for counter flow arrangement is larger than that for the parallel flow at low flow rates. In addition, laminar flow inside the microchannels were characterized using Micro-PIV techniques. Microchannels of different width were fabricated in silicon, the smallest channel measuring 34 mm in width. Measurements were conducted at various channel depths. Measured velocity profiles at these depths were found to be in reasonable agreement with laminar flow theory. Micro-PIV measurement found that the maximum velocity is shifted significantly towards the top of the microchannels due to the sidewall slope, a common issue faced with DRIE etching. Numerical simulations were conducted to investigate the effects of the sidewall slope on the flow and heat transfer. The results show that the effects of large sidewall slope on heat transfer are significant; whereas, the effects on pressure drop are not as pronounced.

The work reported in this thesis is an attempt to enhance heat transfer in electronic devices with the use of impinging air jets on pin-finned heat sinks. The cooling per-formance of electronic devices has attracted increased attention owing to the demand of compact size, higher power densities and demands on system performance and re-liability. Although the technology of cooling has greatly advanced, the main cause of malfunction of the electronic devices remains overheating. The problem arises due to restriction of space and also due to high heat dissipation rates, which have increased from a fraction of a W/cm2to 100s of W /cm2. Although several researchers have at-tempted to address this at the design stage, unfortunately the speed of invention of cooling mechanism has not kept pace with the ever-increasing requirement of heat re- moval from electronic chips. As a result, efficient cooling of electronic chip remains a challenge in thermal engineering. Heat transfer can be enhanced by several ways like air cooling, liquid cooling, phase change cooling etc. However, in certain applications due to limitations on cost and weight, eg. air borne application, air cooling is imperative. The heat transfer can be increased by two ways. First, increasing the heat transfer coefficient (forced convec- tion), and second, increasing the surface area of heat transfer (finned heat sinks). From previous literature it was established that for a given volumetric air flow rate, jet im-pingement is the best option for enhancing heat transfer coefficient and for a given volume of heat sink material pin-finned heat sinks are the best option because of their high surface area to volume ratio. There are certain applications where very high jet velocities cannot be used because of limitations of noise and presence of delicate components. This process can further be improved by pulsating the jet. A steady jet often stabilizes the boundary layer on the surface to be cooled. Enhancement in the convective heat transfer can be achieved if the boundary layer is broken. Disruptions in the boundary layer can be caused by pulsating the impinging jet, i.e., making the jet unsteady. Besides, the pulsations lead to chaotic mixing, i.e., the fluid particles no more follow well defined streamlines but move unpredictably through the stagnation region. Thus the flow mimics turbulence at low Reynolds number. The pulsation should be done in such a way that the boundary layer can be disturbed periodically and yet adequate coolant is made available. So, that there is not much variation in temperature during one pulse cycle. From previous literature it was found that square waveform is most effective in enhancing heat transfer. In the present study the combined effect of pin-finned heat sink and impinging slot jet, both steady and unsteady, has been investigated for both laminar and turbulent flows. The effect of fin height and height of impingement has been studied. The jets have been pulsated in square waveform to study the effect of frequency and duty cycle. This thesis attempts to increase our understanding of the slot jet impingement on pin-finned heat sinks through numerical investigations. A systematic study is carried out using the finite-volume code FLUENT (Version 6.2) to solve the thermal and flow fields. The standard k-ε model for turbulence equations and two layer zonal model in wall function are used in the problem Pressure-velocity coupling is handled using the SIMPLE algorithm with a staggered grid. The parameters that affect the heat transfer coefficient are: height of the fins, total height of impingement, jet exit Reynolds number, frequency of the jet and duty cycle (percentage time the jet is flowing during one complete cycle of the pulse). From the studies carried out it was found that: a) beyond a certain height of the fin the rate of enhancement of heat transfer becomes very low with further increase in height, b) the heat transfer enhancement is much more sensitive to any changes at low Reynolds number than compared to high Reynolds number, c) for a given total height of impingement the use of fins and pulsated jet, increases the effective heat transfer coefficient by almost 200% for the same average Reynolds number, d) for all the cases it was observed that the optimum frequency of impingement is around 50 − 100 Hz and optimum duty cycle around 25-33.33%, e) in the case of turbulent jets the enhancement in heat transfer due to pulsations is very less compared to the enhancement in case of laminar jets.

Orientador: Amarildo Tabone Paschoalini / Banca: Luiz de Paula do Nascimento / Banca: Marcelo Moreira Ganzarolli / Resumo: Os objetivos deste trabalho são determinar a potência térmica dissipada dos componentes eletrônicos de forma experimental e verificar a eficácia do método através de simulações numéricas computacionais utilizando o software comercial ANSYS. O Software ANSYS foi usado como ferramenta de Dinâmica de Fluidos Computacional neste trabalho. Para a realização deste trabalho um ensaio experimental foi executado a fim de obter alguns dados para o cálculo da potência térmica dissipada, outros foram fornecidos pelo CPqD e Trópico. Foi montado um Laboratório Computacional com o apoio da Trópico e do CPqD na UNESP, campus de Ilha Solteira para a simulações numéricas. O método de cálculo de potência apresentou-se eficaz, de modo na melhor situação os resultados apresentaram um erro relativo médio de 1,94%. / Abstract: The purpose of this study is to determine the thermal power dissipation of electronic components through an experimental test and verify the effectiveness of the method through numerical simulations using the computational software ANSYS commercial. Software ANSYS was used as a tool for Computational Fluid Dynamics for this work. For this work an experimental test was done to obtain some data to calculate the thermal power dissipation, others were supplied by CPqD, Nilko and Trópico. It was dubbed a Computer Laboratory with the support of the Trópico, CPqD and at UNESP, campus de Ilha Solteira for the numerical simulations. The method of calculation of power proved to be effective, that the better the results showed a mean relative error is 1.94%. / Mestre

Made available in DSpace on 2014-06-11T19:27:14Z (GMT). No. of bitstreams: 0 Previous issue date: 2008-11-28Bitstream added on 2014-06-13T19:55:37Z : No. of bitstreams: 1 sousa_rr_me_ilha.pdf: 2111422 bytes, checksum: 55ec661a37c8225f8f3075712c8ec225 (MD5) / Fundação de Ensino Pesquisa e Extensão de Ilha Solteira (FEPISA) / Os objetivos deste trabalho são determinar a potência térmica dissipada dos componentes eletrônicos de forma experimental e verificar a eficácia do método através de simulações numéricas computacionais utilizando o software comercial ANSYS. O Software ANSYS foi usado como ferramenta de Dinâmica de Fluidos Computacional neste trabalho. Para a realização deste trabalho um ensaio experimental foi executado a fim de obter alguns dados para o cálculo da potência térmica dissipada, outros foram fornecidos pelo CPqD e Trópico. Foi montado um Laboratório Computacional com o apoio da Trópico e do CPqD na UNESP, campus de Ilha Solteira para a simulações numéricas. O método de cálculo de potência apresentou-se eficaz, de modo na melhor situação os resultados apresentaram um erro relativo médio de 1,94%. / The purpose of this study is to determine the thermal power dissipation of electronic components through an experimental test and verify the effectiveness of the method through numerical simulations using the computational software ANSYS commercial. Software ANSYS was used as a tool for Computational Fluid Dynamics for this work. For this work an experimental test was done to obtain some data to calculate the thermal power dissipation, others were supplied by CPqD, Nilko and Trópico. It was dubbed a Computer Laboratory with the support of the Trópico, CPqD and at UNESP, campus de Ilha Solteira for the numerical simulations. The method of calculation of power proved to be effective, that the better the results showed a mean relative error is 1.94%.

With the demand of computing power from electronic chips on a constant rise, innovative methods are needed for effective and efficient thermal management. Forced convection cooling through an array of micro pin-fins acts not only as a heat sink, but also allows for the electrical interconnection between stacked layers of integrated circuits. This work performs a multi-objective optimization of three shapes of pin-fins to maximize the efficiency of this cooling system. An inverse design approach that allows for the design of cooling configurations without prior knowledge of thermal mapping was proposed and validated. The optimization study showed that pin-fin configurations are capable of containing heat flux levels of next generation electronic chips. It was also shown that even under these high heat fluxes the structural integrity is not compromised. The inverse approach showed that configurations exist that are capable of cooling heat fluxes beyond those of next generation chips. Thin film heat spreaders made of diamond and graphene nano-platelets were also investigated and showed that further reduction in maximum temperature, increase in temperature uniformity and reduction in thermal stresses are possible.

No description available.

The demand for more power and performance from electronic equipment has constantly been growing resulting in an increased amount of heat dissipation from these devices. Thermal management of high-density power control units for hybrid electric vehicles is one such application. Over the last few years, the performance of this power control unit has been improved and size has been reduced to attain higher efficiency and performance causing the heat dissipation as well as heat density to increase significantly. However, the overall cooling system has remained unchanged and only the heat exchanger corresponding to the power control unit (PCU) has been improved. This has allowed the manufacturing costs to go down. Efforts are constantly being made to reduce the PCU size even further and also to reduce manufacturing costs. As a consequence, heat density will go up (~ 200 – 250 W/cm2) and thus, a better high performance cooler/heat exchanger is required that can operate under the existing cooling system design and at the same time, maintain active devices temperature within optimum range (<120 – 125 °C) for higher reliability. The aim of this dissertation was to study the various cooling options based on jet impingement, mini-channel, ribbed mini-channel, phase change material and double sided cooling configurations for application in hybrid electric vehicle and other similar consumer products and perform parametric and optimization study on selected designs. Detailed experimental and computational analysis was performed on different cooling designs to evaluate overall performance. Severe constraints such as choice of coolant, coolant flow-rate, pressure drop, minimum geometrical size and operating temperature were required for the overall design. High performance jet impingement based cooler design with incorporated fin-like structures induced swirl and provided enhanced local heat transfer compared to traditional cooling designs. However, the cooling scheme could manage only 97.4% of the target effectiveness. Tapered/nozzle-shaped jets based designs showed promising results (~40% reduction in overall pressure drop) but were not sufficient to meet the overall operating temperature requirement. Various schemes of mini-channel arrangement, which were based on utilizing conduction and convection heat transfer in a conjugate mode, demonstrated improved performance over that of impingement cooling schemes. Impingement and mini-channel based designs were combined to show high heat transfer rates but at the expense of higher pressure drops (~5 times). As an alternate, mini-channel based coolers with ~1.5 mm size channels having trip strips or ribs were studied to accommodate the design constraints and to enhance local as well as overall heat transfer rates and achieve the target operating temperature. A step by step approach to the development of the heat exchanger is provided with an emphasis on system level design. The computational based optimization methodology is confirmed by a fabricated test bed to evaluate overall performance and compare the predicted results with actual performance. Additionally, one of the impingement based configuration (Swirl-Impingement-Fin) developed during the course of this work was applied to the internal cooling of a turbine blade trailing edge and was shown to enhance the thermal performance by at least a factor of 2 in comparison to the existing pin-fin technology for the conditions studied in this work. / Ph. D.

Cette thèse de doctorat s’intéresse aux mécanismes d’amélioration des transferts dans des géométries de dissipateurs thermiques à plaques et ailettes. Une première partie est consacrée à l’étude d’une configuration académique à l’aide de simulations numériques visant à obtenir une amélioration du transfert de chaleur conjugué en modifiant uniquement par des découpes la forme géométrique des ailettes planes conductrices. Une analyse locale approfondie de l’écoulement et des champs thermiques a été effectuée avec notamment le principe de synergie locale, des champs de vitesse et de gradients thermiques, pour comprendre l’effet des modifications géométriques. Ce mémoire présente également le développement de dissipateurs aux performances thermo-aérauliques augmentées pour des applications de refroidissement de coffrets électronique embarqués. L’intensification des transferts thermiques est obtenue par la génération d’écoulements secondaires qui provoquent un brassage de fluide et réduisent la résistance thermique à la paroi en perturbant le développement de la couche limite thermique. Différentes configurations de dissipateurs avec deux types de générateurs d’écoulements secondaires, paires d’ailettes Delta et protrusions, ont été étudiées numériquement, en employant une modélisation de type « RANS ». Les performances thermo-aérauliques des géométries munies de générateurs de vorticité ont été comparées à celle d’un dissipateur thermique de référence « lisse ». Des prototypes ont également été fabriqués et testés sur un banc expérimental spécifiquement développé pour réaliser des mesures des performances globales en termes de puissance thermique et de pertes de charge. Les résultats expérimentaux et numériques ont été confrontés afin de qualifier les simulations réalisées. Par la suite, une étude d’optimisation employant l’analyse factorielle Taguchi a été utilisée afin d’optimiser les paramètres géométriques des dissipateurs retenus. Deux fonctions objectif ont été considérées : la maximisation du facteur de performance thermique à iso puissance de ventilation (PEC) et la réduction de la température moyenne de paroi du dissipateur par rapport au cas de référence. L’analyse des performances thermo-aérauliques globales des géométries étudiées a été complétée par une analyse qualitative locale des champs thermiques et d’écoulement notamment avec le principe de synergie. / This doctoral thesis focuses on mechanisms of heat transfer enhancement in plate and fin heat sink geometries. First part of the thesis is dedicated to study an academic configuration using numerical simulations to achieve an improvement in conjugate heat transfer by modifying only the geometrical shape (through punching) of the conductive plane fins. An in-depth local analysis of the flow and thermal fields was carried out with the local synergy principle, velocity and thermal gradients, to understand the effect of geometric modifications. This thesis also presents the development of heat sinks with increased thermo-hydraulic performance for on-board electronic box cooling applications. The intensification of the heat transfer is obtained by the generation of secondary flows which cause an intensive mixing of fluid and reduces the thermal resistance to the wall by disrupting the development of the thermal boundary layer. Different heat sink geometries with two types of secondary flow generators : delta winglet pair and protrusions were numerically studied using RANS approach. The thermo-hydraulic performances of the geometries equipped with vortex generators were compared with that of a smooth reference heat sink. The prototypes were also manufactured and tested on an experimental bench specifically designed to perform global performance measurements in terms of thermal power and pressure drops. Experimental and numerical results were compared to qualify the simulations performed. Subsequently, an optimization study using Taguchi factorial analysis was used to optimize the geometrical parameters of the chosen dissipaters. Two objective functions were considered : maximization of either iso-pumping power performance criteria (PEC) or average wall temperature of the dissipaters compared to the reference case. The global thermo-hydraulic performance analysis of the studied geometries was completed by a qualitative analysis of local flow and thermal fields, in particular with the local field synergy principle.