Since the initial breakthroughs in structural quality and p-type conductivity in GaN during the late 1980s, the group-III nitride material system has attracted an enormous amount of interest because of its properties and applications in both electronics and optoelectronics. Although blue light-emitting diodes have been commercialized based on this success, much less progress has been made in ultraviolet emitters, green emitters, and photovoltaics. This lack of development has been attributed to insufficient structural and electrical material quality, which is directly linked to the growth of the material. The objective of this work is to expand the understanding of III-nitride growth towards the improvement of current device capabilities and the facilitation of novel device designs. Group-III nitride thin films are grown by molecular-beam epitaxy in a pulsed, metal-rich environment. The growths of nitride binaries and ternaries are observed in situ by transient reflection high-energy electron diffraction (RHEED) intensities, which respond to the behavior of atoms on the growing surface. By analyzing and interpreting these RHEED signatures, a comprehensive understanding of nitride thin film growth is obtained. The growth kinetics of unintentionally doped GaN by metal-rich MBE are elucidated, and a novel method of in situ growth rate measurement is discovered. This technique is expanded to InN, highlighting the similarity in molecular-beam epitaxy growth kinetics between III-nitride binaries. The growth of Mg-doped GaN is then explored to increase Mg incorporation and electrical activation. The growth of InxGa1-xN alloys are investigated with the goal of eliminating phase separation, which enables single-phase material for use in photovoltaics. Finally, the growth of unintentionally doped and Mg-doped AlGaN is investigated towards higher efficiency light emitting diodes. These advancements in the understanding of III-nitride growth will address several critical problems and enable devices relying on consistent growth in production, single-phase material, and practical hole concentrations in materials with high carrier activation energies.

This work presents the development of a GaN-based dilute magnetic semiconductor (DMS) by metal organic chemical vapor deposition (MOCVD) that is ferromagnetic at room temperature (RT), electrically conductive, and possesses magnetic properties that can be tuned by n- and p-doping. The transition metal series (TM: Cr, Mn, and Fe) along with the rare earth (RE) element, Gd, was investigated in this work as the magnetic ion source for the DMS. Single- phase and strain-free GaTMN films were obtained. Optical measurements revealed that Mn is a deep acceptor in GaN, while Hall measurements showed that these GaTMN films were semi-insulating, making carrier mediated exchange unlikely. Hysteresis curves were obtained for all the GaTMN films, and by analyzing the effect of n- and p-dopants on the magnetic properties of these films it was determined that the magnetization is due to magnetic clusters. These findings are supported by the investigation of the effect of TM dopants in GaN nanostructures which reveal that TMs enhance nucleation resulting in superparamagnetic nanostructures. Additionally, this work presents the first report on the development of GaGdN by MOCVD providing an alternate route to developing a RT DMS. Room temperature magnetization results revealed that the magnetization strength increases with Gd concentration and can be enhanced by n- and p-doping, with holes being more efficient at stabilizing the ferromagnetic signal. The GaGdN films obtained in this work are single-phase, unstrained, and conductive making them suitable for the development of multifunctional devices that integrate electrical, optical, and magnetic properties.

GaN-based light emitting diodes (LEDs) face several challenges if the technology is to make a significant impact on the solid state lighting market. The two most pressing of these challenges are cost and efficiency. The development of alternative substrate technologies shows promise toward addressing both of these challenges, as both GaN-based device technology and the associated metalorganic chemical vapor deposition (MOCVD) technology are already relatively mature. Zinc oxide (ZnO) and silicon (Si) are among the most promising alternative substrates for GaN epitaxy. This work focuses on the development of MOCVD growth processes to yield high quality GaN-based materials and devices on ZnO and Si. ZnO, because of its similar lattice constant and thermal expansion coefficient, is a promising substrate for growth of low defect-density GaN. The major hurdles for GaN growth on ZnO are the instability of ZnO in a hydrogen atmosphere and out-diffusion of zinc and oxygen from the substrate. A process was developed for the MOCVD growth of wurtzite GaN and InxGa1-xN on ZnO, and the structural and optical properties of these films were studied. High zinc and oxygen concentrations remained an issue, however, and the diffusion of zinc and oxygen into the subsequent GaN layer was studied more closely. Silicon is the most promising material for the development of an inexpensive, large-area substrate technology. The challenge in GaN growth on Si is the tensile strain induced by the lattice and thermal mismatch between GaN and Si. A thin atomic layer deposition (ALD)-grown Al2O3 interlayer was employed to relieve strain while also simplifying the growth process. While some strain was still observed, the oxide interlayer leads to an improvement in thin film quality and a reduction in both crack density and screw dislocation density in the GaN films. A comparison of GaN-based LEDs grown on sapphire and Al2O3/Si shows similar performance characteristics for both devices. IQE of the devices on silicon is ~32%, compared to ~37% on sapphire. These results show great promise toward an inexpensive, large-area, silicon-based substrate technology for MOCVD growth of GaN-based optoelectronic devices.

This work targeted the growth of gadolinium (Gd)-doped gallium nitride (GaN) thin films (Ga₁₋ₓGdₓN) by metal organic chemical vapor deposition (MOCVD). Characterization and evaluation of these Ga₁₋ₓGdₓN thin films for application in spintronics/optoelectronics devices also formed part of this work. This work presents: (1) the first report of stable, reproducible n- and p-type Ga₁₋ₓGdₓN thin films by MOCVD; (2) the first Ga₁₋ₓGdₓN p-n diode structure; and (3) the first report of a room temperature spin-polarized LED using a Ga₁₋ₓGdₓN spin injection layer. The Ga₁₋ₓGdₓN thin films grown in this work were electrically conductive, and co-doping them with Silicon (Si) or Magnesium (Mg) resulted in n-type and p-type materials, respectively. All the materials and structures grown in this work, including the Ga₁₋ₓGdₓN-based p-n diode and spin polarized LED, were characterized for their structural, optical, electrical and magnetic properties. The spin-polarized LED gave spin polarization ratio of 22% and systematic variation of this ratio at room temperature with external magnetic field was observed.

Possessing a wide band gap and large break down field, gallium nitride (GaN) is of interest for a host of high power, high frequency applications including next generation cellular base stations, advanced military radar, and WiMAX networks. Much of this interest stems from the continued development of the AlGaN/GaN high electron mobility transistor (HEMT) that is capable of operating at sizable power densities and switching speeds. The same fields responsible for this performance, however, also elicit acute device heating and elastic loads. These induced thermomechanical loads limit both performance and reliability thus necessitating continued improvement in the management and characterization of the coupled environments. In response, this study establishes a new implementation of Raman spectroscopy capable of simultaneously measuring the operational temperature and stress in a HEMT using only the Stokes response. First, the linewidth (FWHM) of the Stokes signal is utilized to quantify the operating temperature of a HEMT independent to the influences of stress. Second, a new method, incorporating the use of the linewidth and peak position in tandem, is developed to estimate the biaxial thermoelastic stress that arises during device operation. With this capability, the HEMT's resultant load is assessed, highlighting the large role of the residual stress on the total mechanical state of the device. Subsequently, this same linewidth is leveraged to identify the distinct effect that electrical carriers have on the thermally relevant decay of longitudinal optical phonon modes. Further investigation of the lattice transport then concludes the study by way of an analytical treatment describing the significant influence of interfacial disorder on the energy transport at GaN/substrate boundaries.

Main objective of the present work is to develop wide-band gap InGaN solar cells in the 2.4 - 2.9 eV range that can be an integral component of photovoltaic devices to achieve efficiencies greater than 50%. In the present work, various challenges in the novel III-nitride technology are identified and overcome individually to build basic design blocks, and later, optimized comprehensively to develop high-performance InGaN solar cells. Due to the unavailability of a suitable modeling program for InGaN solar cells, PC1D is modified up to a source-code level to incorporate spontaneous and piezoelectric polarization in order to accurately model III-nitride solar cells. On the technological front, InGaN with indium compositions up to 30% (2.5 eV band gap) are developed for photovoltaic applications by controlling defects and phase separation using metal-organic chemical vapor deposition. InGaN with band gap of 2.5 eV is also successfully doped to achieve acceptor carrier concentration of 1e18 cm-3. A robust fabrication scheme for III-nitride solar cells is established to increase reliability and yield; various schemes including interdigitated grid contact and current spreading contacts are developed to yield low-resistance Ohmic contacts for InGaN solar cells. Preliminary solar cells are developed using a standard design to optimize the InGaN material, where the band gap of InGaN is progressively lowered. Subsequent generations of solar cell designs involve an evolutionary approach to enhance the open-circuit voltage and internal quantum efficiency of the solar cell. The suitability of p-type InGaN with band gaps as low as 2.5 eV is established by incorporating in a solar cell and measuring an open-circuit voltage of 2.1 V. Second generation InGaN solar cell design involving a 2.9 eV InGaN p-n junction sandwiched between p- and n-GaN layers yields internal quantum efficiencies as high as 50%; while sixth generation devices utilizing the novel n-GaN strained window-layer enhance the open circuit voltage of a 2.9 eV InGaN solar cell to 2 V. Finally, key aspects to further InGaN solar cell research, including integration of various designs, are recommended to improve the efficiency of InGaN solar cells. These results establish the potential of III-nitrides in ultra-high efficiency photovoltaics.

Thesis (Ph. D.)--Ohio State University, 2006. / Title from first page of PDF file. Includes bibliographical references (p. 191-206).

Le travail de la thèse s’articule sur le développement d’un nouveau type de capteurs de gaz à base des matériaux semi-conducteurs III-Nitrure (Les nitrures de gallium). Ces matériaux présentent de nombreux avantages qui pourraient être utilisées pour concevoir des capteurs NOx sensibles et sélectifs pour le contrôle des pollutions émises par la ligne d’échappement Diesel. Afin de limiter et déduire les gaz polluants émis par les moteurs à explosion en générale et les moteurs Diesel en particuliers (NO, NO2, NH3, CO, …), différentes normes européennes ont été établies. Pour respecter ces normes, plusieurs modifications sur les moteurs et les lignes d’échappement des véhicules ont été effectuées (filtres à particules, catalyseurs, capteurs NOx, …). Les capteurs NOx utilisés actuellement sont à base d’électrolyte solide. Ils sont basés dans leur fonctionnement sur la mesure de la concentration d’oxygène présente dans le gaz d’échappement qui permet de son tour l’estimation de la concentration totale des gaz NOx (mesure indirecte). Ces capteurs ne détectent pas le NH3 à la sortie de la ligne d’échappement, et ne donnent pas une information précise sur le rapport entre NO et NO2 (manque de sélectivité) qui est un facteur important pour le bon fonctionnement de catalyseur sélectif SCR (amélioration de rendement) ; d’où la nécessité d’un capteur de gaz plus performant et en particulier sélectif afin d’améliorer les systèmes de contrôle, de post-traitement et de diagnostic. Notre approche consiste à utiliser un transistor HEMT (High Electron Mobility Transistor) à gaz bidimensionnel d’électrons à base de nitrure de Gallium avec l’association d’une couche fonctionnelle à la place de la grille. L’interaction des molécules de gaz avec cette couche fonctionnelle donne une signature (variation de signal de sortie) spécifique pour chaque type de gaz qui aide à l’amélioration de la sélectivité. Le projet contient deux parties : l’optimisation de la structure choisie et l’optimisation de la couche fonctionnelle afin d’obtenir une détection sélective entre les différents gaz polluants. Cette technologie est intéressante pour développer des capteurs de gaz grâce aux possibilités de détecter des faibles variations de tensions et aux possibilités de fonctionnement dans des environnements sévères. La thèse de doctorat s’inscrit dans le cadre de l’OpenLab materials and processes en collaboration entre le laboratoire Georgia-Tech lorraine et l’entreprise Peugeot-Citroën PSA / The work of the thesis focuses on the development of a new type of gas sensors based III-Nitride semiconductor materials (gallium nitrides). These materials have many advantages that could be used to develop sensitive and selective NOx sensors for the control of pollution emitted by diesel exhaust line. To limit the polluting gases emitted by internal combustion engines in general and diesel in particular (NO, NO2, NH3, CO, ...), different European standards have been established. To meet these standards, anti-pollution systems (consisting of particle filters, catalysts, NOx sensors, ... etc) are used. NOx sensors currently used in automobiles are based on a solid electrolyte. Their operation is based on the measurement of the oxygen concentration. This enables an estimate of the total concentration of NOx gas (indirect measurement) after filtering NOx from O2 and decomposing NOx into O2. These sensors do not detect NH3 at the outlet of the exhaust line, and do not give accurate information on the relationship between NO and NO2 (lack of selectivity) which is important factor for an optimal functioning of selective catalyst (SCR performance improvement). Hence there exists a need for a more efficient and selective in particular gas sensor to improve the control systems, post-treatment and diagnosis. Our approach is to use a HEMT (High Electron Mobility Transistor) transistor based on gallium nitride with a combination of a functional layer instead of the gate. The interaction of the gas molecules with the functional layer gives a signature (output signal variation) specific for each type of gas that helps to improve the selectivity. The project contains two parts: the optimization of the chosen structure and the optimization of the functional layer in order to achieve selective detection between various gaseous pollutants. This technology is interesting for development of gas sensors through the possibility of detection low voltage variations and the possibility of operating in harsh environments. The thesis is part of OpenLab "Materials and Processes" in a collaboration between Georgia Tech-CNRS laboratory and the PSA Peugeot-Citroen Group

Cette thèse s’inscrit dans le cadre du développement d’une filière de transistors de puissance à base de nitrure de Gallium au CEA-LETI. Ces transistors, en particulier les HEMT utilisant l’hétérostructure AlGaN/GaN, présentent des propriétés très utiles pour les applications de puissance. L’essor de cette technologie passe notamment par le développement de contacts ohmiques peu résistifs. Cette thèse a pour objectif d’approfondir la compréhension des mécanismes de formation du contact ohmique sur une structure AlGaN/GaN. Dans un premier temps, une étude thermodynamique sur une dizaine de métaux de transition utilisables comme base de l’empilement métallique du contact a été menée, ce qui a permis de retenir une métallisation Ti/Al. Puis, les différentes réactions physico-chimiques de cet empilement avec des substrats nitrurés ont été étudiées en faisant varier la composition et les températures de recuit de formation du contact ohmique. Enfin, plusieurs études sur structure AlGaN/GaN couplant caractérisations électriques et physico-chimiques ont permis d’identifier des paramètres décisifs pour la réalisation d’un contact ohmique, peu résistif et nécessitant une faible température de recuit. / This PhD is part of the development of Gallium nitride based power transistors at the CEA-LETI. These transistors, especially those based on AlGaN/GaN heterostructure, are very promising for power electronics applications. The goal of this PhD is to increase the knowledge of the mechanisms responsible for the ohmic contact formation on a AlGaN/GaN structure. First, a thermodynamic study of several transition metals has been performed, leading us to select Ti/Al metallization. Then, the multiple physico-chemical reactions of this stack with nitride substrates have been studied depending on the stack composition and the annealing temperature. Finally, several studies on AlGaN/GaN structure coupling both physico-chemical and electrical characterizations reveal different decisive parameters for the formation of an ohmic contact with a low-resistance and a low annealing temperature.

abstract: In recent years, wide bandgap (WBG) devices enable power converters with higher power density and higher efficiency. On the other hand, smart grid technologies are getting mature due to new battery technology and computer technology. In the near future, the two technologies will form the next generation of smart grid enabled by WBG devices. This dissertation deals with two applications: silicon carbide (SiC) device used for medium voltage level interface (7.2 kV to 240 V) and gallium nitride (GaN) device used for low voltage level interface (240 V/120 V). A 20 kW solid state transformer (SST) is designed with 6 kHz switching frequency SiC rectifier. Then three robust control design methods are proposed for each of its smart grid operation modes. In grid connected mode, a new LCL filter design method is proposed considering grid voltage THD, grid current THD and current regulation loop robust stability with respect to the grid impedance change. In grid islanded mode, µ synthesis method combined with variable structure control is used to design a robust controller for grid voltage regulation. For grid emergency mode, multivariable controller designed using H infinity synthesis method is proposed for accurate power sharing. Controller-hardware-in-the-loop (CHIL) testbed considering 7-SST system is setup with Real Time Digital Simulator (RTDS). The real TMS320F28335 DSP and Spartan 6 FPGA control board is used to interface a switching model SST in RTDS. And the proposed control methods are tested. For low voltage level application, a 3.3 kW smart grid hardware is built with 3 GaN inverters. The inverters are designed with the GaN device characterized using the proposed multi-function double pulse tester. The inverter is controlled by onboard TMS320F28379D dual core DSP with 200 kHz sampling frequency. Each inverter is tested to process 2.2 kW power with overall efficiency of 96.5 % at room temperature. The smart grid monitor system and fault interrupt devices (FID) based on Arduino Mega2560 are built and tested. The smart grid cooperates with GaN inverters through CAN bus communication. At last, the three GaN inverters smart grid achieved the function of grid connected to islanded mode smooth transition / Dissertation/Thesis / Doctoral Dissertation Electrical Engineering 2017