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This research is concerned with the mechanisms of diffusion in the Earth and the implications of such an understanding. Specifically, this work is concerned with one particular aspect of diffusion: Grain Boundary Diffusion (GBD). An experimental investigation of GBD has been conducted by considering three specific scenarios; GBD of H in stoichiometric Mg-spinel, GBD of Ti in Quartz and GBD of Li in olivine. By considering the GBD of three very different elements it has been possible to synthesise an understanding of some of the mechanisms involved in the process. GBD is potentially a very important process within the Earth with wide ranging implications. Grain boundaries may provide fast pathways for transportation of a range of compatible and incompatible diffusing species in the Earth’s interior – potentially acting as storage locations and also as efficient pathways between different geological reservoirs. It is also potentially very important in the application of a number of techniques including dating and geothermometry and geobarometry. Here, an experimental study of the GBD of H has been carried out with the overall finding that GBD appears to occur at slightly greater yet broadly similar rates to lattice diffusion. This finding is considered in terms of the mantle properties which are affected by the presence and transport of H. A follow up series of experiments was conducted looking at Li diffusion. Li was chosen due to its volatile nature and larger atomic radius as compared to H. As such, it provided a useful test of the hypothesis that the radius of a diffusant might affect its chosen method of diffusion. A third set of experiments were carried out to investigate the GBD of Ti in quartz with particular reference to the TitaniQ geothermo(baro)meter. This set of experiments provided a very useful comparison to the data which had previously been obtained from lighter elements. This investigation has found that a combination of factors including charge, diffusant diameter and the specific mineralogical characteristics of the host phase will define the dominant diffusive mechanism and the size of the contribution made by that mechanism towards observed bulk diffusivities. A characterisation of the temperature dependency of diffusion within each setting has also been completed. As such, it also makes a useful contribution to the current dataset for GBD.

A simplified model with only 2 degrees of freedom is developed for cavity growth along a grain-boundary by surface and grain-boundary diffusion following a similar model for a row of grains used by Sun et al, (1996). A variational principle for the coupled diffusion problem is used to follow the cavity growth. The approximate solution can be reduced to the well-established equilibrium cavity growth model at the fast surface diffusion extreme. By comparing the 2 degree of freedom model with the full finite element solution by Pan et al, (1997), a 'Validity Map' is constructed in terms of the relative diffusivity and applied stress relative to the capillarity stress. It is found that the simplified model accurately describes the evolution process, in terms of overall cavity profile and propagation rate for engineering alloys subject to normal levels of applied stresses. The 2 degree of freedom model for a single cavity was then extended to allow the modelling of multiple cavities. These cavities can be either pre-existing or nucleated during the lifetime of the system. The relative rotation between the grains is also considered. The initial 2 degrees of freedom were increased to six, and a cavity element has been derived. The cavity elements are assembled together using the classical finite element approach. This allows the evolution of multiple cavities and their interactions to be modelled under different applied loads and material parameters. This simplified multiple cavity finite element model was compared with a model for cavity evolution based on a 'smeared-out' approach. It was shown that the 'smeared-out' model does not accurately predict the creep damage for realistic engineering materials and conditions and results in an under prediction of creep lifetime. Using the simplified finite element model the effect of surface diffusion on the evolution of the creep damage was investigated. The evolution of a large pre-existing 'crack-like' cavity was modelled and the effects of nucleation, surface diffusion and loading were also investigated. It was shown that in the majority of cases as the surface diffusion was increased the rupture time was also increased. The results from the large 'crack-like' cavity simulations showed that there was very little crack propagation through the material and the smaller cavities tended to grow independently of the large 'crack-like' cavity.

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Two different aluminium alloys, AA6111 (Al-Mg-Si) and AA7055 (Al-Mg-Zn), were chosen as the aluminium alloys to be welded with DC04, and two welding methods (USW and FSSW) were selected to prepare the welds. Selected pre-welded joints were then annealed at T=400 - 570oC for different times. Kinetics growth data was collected from the microstructure results, and the growth behaviour of the IMC layer was found to fit the parabolic growth law. A grain growth model was built to predict the grain size as a function of annealing time. A double-IMC phase diffusion model was applied, together with grain growth model, to predict the thickness of each phase as a function of annealing time in the diffusion process during heat treatment. In both material combinations and with both welding processes a similar sequence of IMC phase formation was observed during the solid state welding. η-Fe2Al5 was found to be the first IMC phase to nucleate. The IMC islands then spread to form a continuous layer in both material combinations. With longer welding times a second IMC phase, θ-FeAl3, was seen to develop on the aluminium side of the joints. Higher fracture energy was received in the DC04-AA6111 joints than in the DC04-AA7055 joints. Two reasons were claimed according to the microstructure in the two joints. The thicker IMC layers were observed in the DC04-AA7055 joints either before or after heat treatment, due to the faster growth rate of the θ phase. In addition, pores were left in the aluminium side near the interface as a result of the low melting point of AA7055.The modelling results for both the diffusion model and grain growth model fitted very well with the data from the static heat treatment. Grain growth occurred in both phases in the heat treatment significantly, and was found to affect the calculated activation energy by the grain boundary diffusion. At lower temperatures in the phases with a smaller grain size, the grain boundary diffusion had a more significant influence on the growth rate of the IMC phases. The activation energies for the grain boundary diffusion and lattice diffusion were calculated as 240 kJ/mol and 120 kJ/mol for the η phase, and 220 kJ/mol and 110 kJ/mol for the θ phase, respectively. The model was invalid for the growth of the discontinuous IMC layers in USW process. The diffusion model only worked for 1-Dimensional growth of a continuous layer, which was the growth behaviour of the IMC layer during heat treatment. However, due to the highly transient conditions in USW process, the IMC phases were not continuous and uniform even after a welding time of 2 seconds. Therefore, the growth of the island shaped IMC particles in USW was difficult to be predicted, unless the nucleation stage was taken into consideration.

abstract: Fission products in nuclear fuel pellets can affect fuel performance as they change the fuel chemistry and structure. The behavior of the fission products and their release mechanisms are important to the operation of a power reactor. Research has shown that fission product release can occur through grain boundary (GB) at low burnups. Early fission gas release models, which assumed spherical grains with no effect of GB diffusion, did not capture the early stage of the release behavior well. In order to understand the phenomenon at low burnup and how it leads to the later release mechanism, a microstructurally explicit model is needed. This dissertation conducted finite element simulations of the transport behavior using 3-D microstructurally explicit models. It looks into the effects of GB character, with emphases on conditions that can lead to enhanced effective diffusion. Moreover, the relationship between temperature and fission product transport is coupled to reflect the high temperature environment. The modeling work began with 3-D microstructure reconstruction for three uranium oxide samples with different oxygen stoichiometry: UO2.00 UO2.06 and UO2.14. The 3-D models were created based on the real microstructure of depleted UO2 samples characterized by Electron Backscattering Diffraction (EBSD) combined with serial sectioning. Mathematical equations on fission gas diffusion and heat conduction were studied and derived to simulate the fission gas transport under GB effect. Verification models showed that 2-D elements can be used to model GBs to reduce the number of elements. The effect of each variable, including fuel stoichiometry, temperature, GB diffusion, triple junction diffusion and GB thermal resistance, is verified, and they are coupled in multi-physics simulations to study the transport of fission gas at different radial location of a fuel pellet. It was demonstrated that the microstructural model can be used to incorporate the effect of different physics to study fission gas transport. The results suggested that the GB effect is the most significant at the edge of fuel pellet where the temperature is the lowest. In the high temperature region, the increase in bulk diffusivity due to excess oxygen diminished the effect of GB diffusion. / Dissertation/Thesis / Doctoral Dissertation Materials Science and Engineering 2014

abstract: Microelectronic industry is continuously moving in a trend requiring smaller and smaller devices and reduced form factors with time, resulting in new challenges. Reduction in device and interconnect solder bump sizes has led to increased current density in these small solders. Higher level of electromigration occurring due to increased current density is of great concern affecting the reliability of the entire microelectronics systems. This paper reviews electromigration in Pb- free solders, focusing specifically on Sn0.7wt.% Cu solder joints. Effect of texture, grain orientation, and grain-boundary misorientation angle on electromigration and intermetallic compound (IMC) formation is studied through EBSD analysis performed on actual C4 bumps. / Dissertation/Thesis / M.S. English 2013

Use of welded titanium alloy to aluminium alloy structures in the aerospace industry has a number of potential benefits for both cost and weight saving by enabling titanium to be used only in the most critical parts, with the cheaper and lighter aluminum alloy making up the rest of the structure. However, due to the formation of brittle intermetallic compounds (IMC) at interface and the enormous gap in melting point, the welding of titanium to aluminium remains a major challenge. Solid state welding processes are most likely to be successful since they do not involve any melting, and so issues associated with the large difference in melting point and the high reaction rate of the liquid phase are avoided. In this study, an emerging low energy input solid state welding process - high-power ultrasonic spot welding (USW) was applied to weld Al and Ti (AA6111-T4/Ti6Al4V and AA2139-T8/Ti6Al4V combinations). No obvious intermetallic reaction layer was observed on the Al/Ti interface even using transmission electron microscopy. As a result, the maximum joint strength measured reached the same level as similar Al-Al (AA6111) welds and greatly exceeded those observed in Al-Fe and Al-Mg joints made using the same technique, in which a brittle reaction layer forms rapidly. However, the Al/Ti welds always failed at the weld interface after natural ageing, which is not desirable due to the low fracture energy associated with interfacial fracture mode. By using high resolution STEM-EDS, residual oxides and Si segregation were detected on the as-welded Al/Ti interface, which are thought to be factors that result in the no reaction layer Al/Ti interface. The Si segregation is predicted to be able to increase the weld interface cohesion through thermodynamic calculation. A series of prolonged heat treatment experiments were performed to understand the Al-Ti reaction layer growth kinetics and to explain the lack of reaction layer in as-welded Al-Ti joint. Al3Ti (D022 structure) was the only Al-Ti intermetallic phase observed in the reaction layer (IMC layer). In pure Al/Ti joints, it is found that the very long slow-growth stage of IMC layer is probably caused by the residual oxides on the interface. Calculations show that grain boundary (GB) diffusion makes the major contribution to the effective diffusion coefficient in the Al3Ti layer. In AA2139/Ti joints, the IMC layer growth is significantly slower than that in pure Al/Ti joints. The effects of alloying elements on the IMC layer growth was studied in detail. Cu was observed to segregate on both the Al3Ti grain boundaries and the Al3Ti/Ti interface. Si also segregated on the the Al3Ti/Ti interface and enriched in the Al3Ti layer. Both Cu and Si are thought to retard IMC layer growth. Interestingly small patches of Al were found trapped in the IMC layer; its formation mechanism is discussed. In pure Al/Ti6Al4V joints, the IMC layer growth rate did not change significantly. The presence of V greatly retarded the Al3Ti grain growth at high annealing temperature (630 °C) and suppressed the anisotropic growth of Al3Ti at 600 °C. Overall this study successfully joined Al/Ti by USW and systematically investigated the grain size effect and alloying effects on the Al3Ti layer growth. The present study for the first time: (a) observed the no-IMC-layer Al/Ti weld interface; (b) observed Cu segeration on Al3Ti GBs; (c) quantitatively studied the grain size effect on Al3Ti layer growth kinetics; (d) observed the orientation relationship between trapped Al islands and the adjacent Al3Ti grains; (e) observed that V greatly retarded the anisotropic growth of Al3Ti grains.

A highly resolving micro-light beam-induced current (µLBIC)-system is presented in this work. Based on the laser excitation via an optical microscope, current values can be measured with sub-micron precision. We show, that this non-destructive, light-based approach delivers superior results to a reference electron microscope based electron beam induced current method concerning contrast and robustness towards reflection differences, whereas no vacuum is needed, no charging effects can occur and equal resolution is achieved. µLBIC allows therefore mapping of pn-junctions at silicon solar cell cross sections. By combination of µLBIC with other measurement methods in the same setup, such as micro-Raman spectroscopy, complementary microscopic information about material stress or crystallinity and electronic properties at the same region of interest on the sample is revealed. By applying µLBIC for analyzing silicon solar cross sections, two characterization examples of current technological relevance are presented: enhanced dopant diffusion along grain boundaries between grains with different orientations is quantified and the impact of a nickel silicide spike on local charge collection quality is studied.