With the development of fuel cell based power systems, the need for more advanced DC-DC power converters has become apparent. In such applications DC-DC converters provide an important link between low voltage fuel cell sources and inverter buses operating at significantly higher voltages. Advancements in converter efficiency, cost reduction, and size reduction are the most necessary. These challenges are formidable, even when considering the improvements made to conventional DC-DC topologies. However, it can be possible to achieve these criteria through the implementation of more advanced topologies. A recently developed efficient three-phase DC-DC topology offers benefits over standard designs. Passive component sizes and output ripple voltage were reduced as a result of an effective boost in switching frequency. Converter output voltage was reached more easily due to an increased transformer voltage boost ratio in addition to the turns ratio. For cost reduction, the converter was designed and built with discrete components instead of more expensive integrated modules. This thesis presents an overview of the three-phase converter, with a detailed focus on the design, implementation, and performance of the switching stage. The functionality of the three-phase topology is covered along with the selection of converter components. Simulation results are shown for both ideal and real converter models. Considerations for the switching device package with respect to circuit board and heat sinking configurations are discussed in support of the selection of an insulated metal substrate (IMS) circuit board. An effective circuit layout designed to minimize parasitic trace inductances as well as provide favorable component positioning is presented. Experimental converter test results are shown and the causes of undesired effects are identified. Switching stage modifications and their results are discussed along with the benefits of proposed future design enhancements. / Master of Science

LEDs are being developed as the next generation lighting source due to their high efficiency and long life time, with a potential to save $15 billion per year in energy cost by 2020. State of the art LEDs are capable of emitting light at ~115 lm/W and have lifetime over 50,000 hours. It has already surpassed the efficiency of incandescent light sources, and is even comparable to that of fluorescent lamps. Since the total luminous flux generated by a single LED is considerably lower than other light sources, to be competitive the total light output must be increased with higher forward currents and packages of multiple LEDs. However, both of these solutions would increase the junction temperature, which degrades the performance of the LED--as the operating temperature goes up, the light intensity decreases, the lifetime is reduced, and the light color changes. The word "junction" refers to the p-n junction within the LED-chips. Critical to the temperature rise in high powered LED sources is the very large heat flux at the die level (100-500 W/cm2) which must be addressed in order to lower the operating temperature in the die. It is possible to address the spreading requirements of high powered LED die through the use of power electronic substrates for efficient heat dissipation, especially when the die are directly mounted to the power substrate in a chipon- board (COB) architecture. COB is a very attractive technology for packaging power LEDs which can lead improved price competiveness, package integration and thermal performance. In our work high power LED-chips (>1W/die) implementing COB architectures were designed and studied. Substrates for these packaging configurations include two types of power electronic substrates; insulated-metal-substrates (IMS) and direct-bonded-copper (DBC). To lower the operating temperature both the thermal impedance of the dielectric layer and the heat spreading in the copper circuit layers must be studied. In the analysis of our architectures, several lead free solders and thermal interface materials were considered. We start with the analysis of single-chip LED package and extend the result to the multi-chip arrays. The thermal resistance of the system is only a function of geometry and thermal conductivity if temperature-independent properties are used. Thus through finite element analysis (ANSYS) the effect of geometry and thermal conductivity on the thermal resistance was investigated. The drawback of finite element analysis is that many simulations must be conducted whenever the geometry or the thermal conductivity is changed. To bypass same of the computational load, a thermal resistance network was developed. We developed analytical expressions of the thermal resistance, especially focusing on the heat spreading effect at the substrate level. Finally, multi-chip LED arrays were analyzed through finite element analysis and an analytical analysis; where die-spacing is another important factor to determine the junction temperature. With this thermal analysis, critical design considerations were investigated in order to minimize device temperatures and thereby maximizing light output while also maximizing device reliability.

Les systèmes photovoltaïques à concentration, ou CPV, reposent sur le principe de la concentration des rayons du soleil sur une cellule photovoltaïque à très haut rendement. Le CPV reste jeune face au photovoltaïque (PV) classique qui accumule plus de 30 ans de retour d’expérience.La pérennisation de cette technologie CPV ne passera que par la démonstration d’une certaine maturité. Aussi, la question de la fiabilité de ces systèmes est plus que jamais d’actualité. Dans ce contexte, le Commissariat à L’Energie Atomique et aux Energies Alternatives (CEA) a répondu à la sollicitation lancée par des fabricants de modules CPV français sur la thématique de la conception et de la fiabilisation de modules CPV par une collaboration de ses différents laboratoires, dont le Laboratoire des Modules Photovoltaïques (LMPV). C’est au sein de ce laboratoire que s’effectuent les travaux de thèse. La diversité des éléments constituant un module CPV a poussé les travaux de thèse à se concentrer sur le coeur fonctionnel des modules : les assemblages CPV. Une première partie des travaux de thèse a consisté à mettre en place les bons outils de caractérisation, en partant parfois d’une feuille blanche. La mesure de caractéristique IV dans l’obscurité, la mesure de réponse spectrale, la tomographie RX ou encore l’électroluminescence sont autant de moyens de caractérisation de cellules multi-jonctions amenés par les travaux de thèse. Les efforts conduits sur l’électroluminescence auront permis l’invention d’une nouvelle technique de caractérisation des interfaces cellule/ substrat des assemblages CPV, concrétisée par le dépôt d’un brevet. Une collaboration entre le laboratoire d’accueil et l’Institut de l’Energie Solaire (IES) à Madrid a permis l’accès à la mesure de performance des assemblages CPV sous éclairement. Tous ces moyens ont rendu possible une caractérisation fine des assemblages CPV et ont permis de s’intéresser à leur robustesse-fiabilité, deuxième partie des travaux de thèse. Deux types d’assemblages CPV ont été étudiés durant les travaux de thèse. Le premier, basé sur un substrat Direct Bonded Copper (DBC) correspond à l’état de l’art et est le plus utilisé dans l’industrie CPV. Le deuxième, en rupture technologique avec l’état de l’art, repose sur un Substrat Métal Isolé (SMI), et a été intégralement développé par le CEA et ses partenaires industriels. L’étude de la robustesse de ces assemblages CPV a été faite par l’emploi de tests de vieillissement accéléré dont la nature est justifiée par le retour d’expérience et la définition des spécifications environnementales. Aucune défaillance n’a été observé sur chacun des types d’assemblage. Les assemblages SMI se comportent comme les assemblages DBC, considérés comme références. Les travaux de thèse offrent donc un premier retour d’expérience propre au laboratoire d’accueil et la mise en place d’une infrastructure complète de caractérisation d’assemblage CPV permet aujourd’hui au CEA d’être un acteur clé du CPV en France. / Concentrating Photovoltaic (CPV) is based on the concentration of solar rays on very-high efficienciessolar cells. Multi-junction architectures used in CPV systems reach efficiency superior to44% under concentration. This has created great interest for this technology over the past decade.Nevertheless, CPV has still to be proven reliable. This work contributes to this goal.CPV assemblies -or receivers- are defined by the electrical, mechanical and thermal cohesionof a multi-junction solar cell on an appropriate substrate. The complexity of multi-junctionarchitecture does not allow their characterization with the existing PV tools. Therefore, the firstachievement of the work was the development of a complete infrastructure for the characterizationof such devices. The second part developed accelerated ageing tests and analysis methods to studythe degradation process of these assemblies.A new method for the characterization of die-attached CPV cell assembly has been provensuccessful. It is called EEL for Enhanced ElectroLuminescence. This method is cost effective andreally fast and has therefore been patented. Regarding the characterization of performance of CPVcell assembly under illumination (2nd part of the thesis), collaboration has been made with theInstituto de Energìa Solar (IES) in Madrid, Spain. Thanks to this collaboration, two types of CPVcell assemblies have been studied. One based on the Direct Bonded Copper (DBC) substrate, correspondingto the state-of-the-art and most used type of substrate in CPV industry. The other is acompletely new type of substrate, inspired by the Insulated Metal Substrate (IMS). This new IMSbased CPV cell assembly has been developed by the CEA and its industrial partners. The reliabilitystudy of these CPV cell assemblies (DBC and IMS) has been conducted through acceleratedageing tests. It has been shown that none of the DBC or IMS cell assembly present infant mortalityor failure upon ageing.This work has launched the CPV activity at INES. Results on receivers now need to be confirmedon complete CPV-modules and systems.