NDLTD Global ETD Search
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  • About
  • The Global ETD Search service is a free service for researchers to find electronic theses and dissertations. This service is provided by the Networked Digital Library of Theses and Dissertations.
    Our metadata is collected from universities around the world. If you manage a university/consortium/country archive and want to be added, details can be found on the NDLTD website.

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Showing 211 to 220 of 7682 (0.072 seconds)
211

Analysis of fault coverage masking in built-in self-test schemes

Cotsapas, Nicos. January 1985 (has links)
No description available.
Integrated circuits -- Testing.
212

Organic film and contaminant removal from surfaces in the manufacture of integrated circuits

Chavez, Kristi Lynn 12 1900 (has links)
No description available.
Integrated circuits Cleaning.
213

Test support processor for enhanced testability of high performance integrated circuits

Zhou, Qing 08 1900 (has links)
No description available.
Integrated circuits Testing
214

Opportunities and limitations of three-dimensional integration for interconnect design

Joyner, James W. 08 1900 (has links)
No description available.
215

Analog four-quadrant multiplier using NMOS integrated circuit technology

Peña Finol, Jesús Salvador 08 1900 (has links)
No description available.
Integrated circuits
Analog multipliers
216

Signature based testing of analog and RF circuits

Voorakaranam, Ramakrishna 05 1900 (has links)
No description available.
Integrated circuits Testing
217

Integrated optical delay-lines : architectures, performance optimization, and applications

Anemogiannis, Emmanuel 12 1900 (has links)
No description available.
Integrated optics
Signal processing
218

Micromachined movable platforms as integrated optic devices

Kim, Young Woon 05 1900 (has links)
No description available.
Integrated optics
Micromechanics
219

Study on thermally reworkable underfills for flip chip, BGA, and CSP applications

Wang, Lejun 05 1900 (has links)
No description available.
Integrated circuits
Electronic packaging
220

Enhancement of flow time and adhesion of high-performance underfill encapsulants for flip-chip applications

Vincent, Michael Brien 12 1900 (has links)
No description available.

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