A novel room temperature bonding method is used to package the micro-component. The bonding method utilizes metal microcap to package the micro-component under room temperature status, which not only can provide micro-component mechanical support also can prevent micro-component from contamination. The bonding condition under room temperature is the most conventional method can not achieve, which characteristic is the most significant effect factor to drive the wafer-level packaging process to improve in today. Utilizing ASTM standard, which was used as a macroscopic standard to evaluate and analyze the bonding shear strength relationship between the ASTM standard specimen and the metal microcap. The carrier wafer has been oxidized before photolithography process; the diameter of cavity and the contact area between the metal microcap and glass substrate were controlled by the photomask design and the accuracy of the photoresist exposure. The passivation treatment was developed to separate the microcap from the carrier wafer more easily. In this thesis, the metal microcap was fabricated by using electroforming process, which can control the thickness of metal microcap. The advantages of microcap are superior to the thin film poly-silicon made by the surface micromachining technique on the quality and mechanical properties. A glass is used as substrate of the metal microcap, and its transparent characteristic is a feature how we perform UV curing process. The adhesive can be cured under room temperature and the results exhibit the adhesive has excellent bonding strength. SEM is used to analyze the passivation result, the increasing rate of electroforming thickness. The shear stress-strain relationship between the metal microcap and the ASTM standard specimen is also discussed and analyzed in this thesis.

Along with the rising and flourishing development of the modern technology and human knowledge, the demands for optical-electric products and communication systems are getting more and more. By combining the semi-conductor technology process with micro optical elements, a complete micro optical system can be integrated. The functions of a micro optical system include beam-splitting, beam-light offsetting, focusing, and switching, etc. Letting micro optical elements be integrated on a substrate, the fix and alignment problems, which are caused by the relative displacements between the elements, can be improved. Also, the production rate can be increased and cost can be reduced if the products are made by micro mold and array fabricated process. Thus, the technology of the Micro Optical Electro Mechanical System is widely applied to manufacture the products of optical-electric and communication, such as the backlight module of a LCD, projector, and optical fiber communication system, etc. The main purpose of this study is to design and fabricate a microball-lens array, and to apply it to couple optical fibers. The proposed product is a 3D micro-ball-lens array with vertical and non-vertical focus directions and better coupling efficiency. A v-groove is fabricated by using semi-conductor technology in order to fix the micro-ball-lens array and optical fiber such that an optical fiber switch coupling system can be obtained. The packaging of the optical fiber switch coupling system is formed by UV-cure and a microcap which is fabricated by MEMS. It can provide the protection to the system. Also, the completed system can achieve the demands of the industry fields such as precise localization, cost reduction and so on.