Due to the potential uses and advantages of 3D microelectromechanical systems (MEMS), research has been ongoing to advance the field. The intention of my reasearch is to explore different gripper designs and their interaction with corresponding components to establish a 3D microassembly system. In order to meet these goals, two grippers were designed using different mechanisms for grasping. At the same time, corresponding parts capable of being constructed into a 3D microstructure were designed to interact with the grippers. The microcomponents were fabricated using PolyMUMPS, a part of the Multi-User MEMS Processes (MUMPS), and experimentation was conducted with the goal of constructing a 3D microstructure. The results were partially successful in that both grippers were able to pick up corresonponding parts and bring them out of plane in order to make them stand up. However, a final 3D microstructure was unfortunately not achieved due to time constraints. This will be left to future researchers who continue the project. On the equpiment side a microassembly system was fully integrated using cameras for vision and motors with micro-resolution for movement. A computer program was used to control each part of the system. The cameras provided feedback from various views, allowing the operator to observe what was happening to the microcomponents. The grippers were attached to one of the motors and manipulated to pick up the parts. The final overall system proved sufficient for microassembly, but had some areas that could be improved upon.

Multilayer microwave circuit processing technology is essential in developing more compact radio frequency (RF) electronically scanned arrays (ESAs) for next generation radar systems. ESAs are typically realized using the hybrid connection of four discrete components: RF manifold, phase shifters or Butler matrices, antennas and T/R modules. The hybrid connection of these components increases the system size, packaging cost and introduces parasitic effects that lead to higher losses. In order to eliminate these drawbacks, there is a need to integrate these components on the same substrate, forming a monolithic phased array. RF MEMS technology enables the monolithic integration of the ESA components into one highly integrated multifunctional module, thereby enhancing ESA designs by significantly reducing size, fabrication cost and interconnection losses. A novel capacitive dual-warped beam shunt MEMS switch is presented that utilizes warped beams to enhance its RF performance. This switch exhibits an off-to-on capacitive ratio of almost 170, isolation better than 40dB, switching speeds as low as 6μs without the need for thin dielectrics or high dielectric constant materials. These MEMS switches are implemented into single pole three throw (SP3T) and single pole four throw (SP4T) configurations. A novel 3-bit finite ground coplanar waveguide switched delay line MEMS phase shifter is developed with four cascaded SP3T dual-warped beam capacitive switches to achieve low-loss performance and simplify ESA design. The fabricated prototype unit exhibits an insertion loss of 2.5∓0.2dB with a phase error of ∓6°. Moreover, a compact 4 x 4 Butler matrix switchable with the use of a MEMS SP4T switch is investigated as an alternative passive beamforming method. The overall beam-switching network is monolithically integrated within a real-estate area of 0.49cm2. This technique provides a unique approach to fabricate the entire beamforming network monolithically. An 8-mask fabrication process is developed that monolithically integrates the MEMS phase shifter and RF combining network on one substrate. The wafer-scale integrated ESA prototype unit has an area of 2.2cm2. It serves as the basic building block to construct larger scanning array modules and introduces a new level of functionality previously achieved only by the use of larger, heavier and expensive systems

Due to the potential uses and advantages of 3D microelectromechanical systems (MEMS), research has been ongoing to advance the field. The intention of my reasearch is to explore different gripper designs and their interaction with corresponding components to establish a 3D microassembly system. In order to meet these goals, two grippers were designed using different mechanisms for grasping. At the same time, corresponding parts capable of being constructed into a 3D microstructure were designed to interact with the grippers. The microcomponents were fabricated using PolyMUMPS, a part of the Multi-User MEMS Processes (MUMPS), and experimentation was conducted with the goal of constructing a 3D microstructure. The results were partially successful in that both grippers were able to pick up corresonponding parts and bring them out of plane in order to make them stand up. However, a final 3D microstructure was unfortunately not achieved due to time constraints. This will be left to future researchers who continue the project. On the equpiment side a microassembly system was fully integrated using cameras for vision and motors with micro-resolution for movement. A computer program was used to control each part of the system. The cameras provided feedback from various views, allowing the operator to observe what was happening to the microcomponents. The grippers were attached to one of the motors and manipulated to pick up the parts. The final overall system proved sufficient for microassembly, but had some areas that could be improved upon.

Microelectromechanical systems (MEMS) devices have been increasing in popularity for radio frequency (RF) and microwave communication systems due to the ability of MEMS devices to improve the performance of these circuits and systems. This interdisciplinary field combines the aspects of lithographic fabrication, mechanics, materials science, and RF/microwave circuit technology to produce moving structures with feature dimensions on the micron scale (micro structures). MEMS technology has been used to improve switches, varactors, and inductors to name a few specific examples. Most MEMS devices have been fabricated using planar micro fabrication techniques that are similar to current IC fabrication techniques. These techniques limit the thickness of individual layers to a few microns, and restrict the structures to have planar and not vertical features. <p> One micro fabrication technology that has not seen much application to microwave MEMS devices is LIGA, a German acronym for X-ray lithography, electroforming, and moulding. LIGA uses X-ray lithography to produce very tall structures (hundreds of microns) with excellent structural quality, and with lateral feature sizes smaller than a micron. These unique properties have led to an increased interest in LIGA for the development of high performance microwave devices, particularily as operating frequencies increase and physical device size decreases. Existing work using LIGA for microwave devices has concentrated on statically operating structures such as transmission lines, filters, and couplers. This research uses these unique fabrication capabilities to develop dynamically operating microwave devices with high frequency performance. <p>This thesis documents the design, simulation, fabrication, and testing of MEMS variable capacitors (varactors), that are suitable for fabrication using the LIGA process. Variable capacitors can be found in systems such as voltage-controlled oscillators, filters, impedance matching networks and phase shifters. Important figures-of-merit for these devices include quality factor (Q), tuning range, and self-resonant frequency. The simulation results suggest that LIGA-MEMS variable capacitors are capable of high Q performance at upper microwave frequencies. Q-factors as large as 356 with a nickel device layer and 635 with a copper device layer, at operational frequency, have been simulated. The results indicate that self-resonant frequencies as large as 45 GHz are possible, with the ability to select the tuning range depending on the requirements of the application. Selected capacitors were fabricated with a shorter metal height for an initial fabrication attempt. Test results show a Q-factor of 175 and a nominal capacitance of 0.94 pF at 1 GHz. The devices could not be actuated as some seed layer metal remained beneath the cantilevers and further etching is required. As such, LIGA fabrication is shown to be a very promising technology for various dynamically operating microwave MEMS devices.

No description available.

Thesis (M.S.)--Brigham Young University. Dept. of Mechanical Engineering, 2004. / Includes bibliographical references (p. 51-54).

Thesis (Ph. D.)--School of Mechanical Engineering, Georgia Institute of Technology, 2004. Directed by Said I. Abdel-Khalik. / Includes bibliographical references (leaves 292-296).

Thesis (M.S.)--Worcester Polytechnic Institute. / Keywords: self-powered; universal hashing; ultra-low-power; message authentication codes; provable security. Includes bibliographical references (p. 55-61).

Thesis (Ph. D.)--School of Electrical and Computer Engineering, Georgia Institute of Technology, 2004. Directed by James Meindl. / Includes bibliographical references (leaves 58-60).

Thesis (M.S.)--Worcester Polytechnic Institute. / Keywords: MEMS; suspension; gyroscope; folded springs; statics. Includes bibliographical references (p. 182-187).