Wong Chun Ho. / Thesis (M.Phil.)--Chinese University of Hong Kong, 2006. / Includes bibliographical references (leaves 72-77). / Abstracts in English and Chinese. / Contents --- p.i / Acknowledgments --- p.iii / Abstract --- p.iv / Abbreviations and acronyms --- p.vi / Publications originated from the work of this thesis --- p.viii / Chapter Chapter 1 - --- Dendritic Macromolecules and Dendronized Polymers / Chapter 1.1 --- Introduction to Dendrimers and Dendronized Polymers --- p.1 / Chapter 1.2 --- Overview of the Synthesis of Dendronized Polymers --- p.4 / Chapter 1.2.1 --- Graft-from Approach --- p.4 / Chapter 1.2.2 --- Graft-to Approach --- p.5 / Chapter 1.2.3 --- Macromonomer Approach --- p.6 / Chapter 1.2.3.1 --- Step Growth Polymerization --- p.6 / Chapter 1.2.3.2 --- Chain Growth Polymerization --- p.8 / Chapter 1.2.3.3 --- Supramolecular Polymerization --- p.9 / Chapter Chapter 2 - --- En Route to Hydrogen Bond-Mediated. Supramolecular Dendronized Polymers / Chapter 2.1 --- Design of Supramolecular Dendronized Polymers --- p.15 / Chapter 2.1.1 --- Binding Modes in Supramolecular Polymers --- p.15 / Chapter 2.1.1.1 --- Hetero-Complementary Polymerization --- p.16 / Chapter 2.1.1.2 --- Self-Complementary Polymerization --- p.17 / Chapter 2.1.2 --- The Effect of Binding Constant on the Degrees of Polymerization --- p.18 / Chapter 2.1.3 --- The Effect of Dimerization Constant on the Molecular Weight Distribution --- p.21 / Chapter 2.1.4 --- The Dendritic Effect on the UPy Binding Behavior --- p.21 / Chapter 2.2 --- Summary --- p.24 / Chapter Chapter 3 - --- "Design, Synthesis, and Structural Characterization of Dendronized Dimers" / Chapter 3.1 --- Design of Dendronized Dimers --- p.25 / Chapter 3.1.1 --- The Nature of R and R on the Dimerization Behavior --- p.25 / Chapter 3.1.2 --- Selection of Dendrons --- p.26 / Chapter 3.1.3 --- Positioning of Dendrons and the Synthetic Feasibility --- p.27 / Chapter 3.2 --- Synthesis of Dendronized Dimers --- p.28 / Chapter 3.3 --- Characterizations of the Intermediates and Target Dimers --- p.31 / Chapter 3.3.1 --- 1H NMR Spectroscopy --- p.31 / Chapter 3.3.2 --- 13C NMR Spectroscopy --- p.38 / Chapter 3.3.3 --- Mass Spectrometry --- p.41 / Chapter 3.3.4 --- Vapor Pressure Osmometry --- p.43 / Chapter 3.3.5 --- Infrared Spectroscopy --- p.43 / Chapter 3.3.6 --- Gel Permeation Chromatography --- p.44 / Chapter 3.4 --- Conclusions --- p.46 / Chapter Chapter 4 - --- Determination of Dimerization Constants / Chapter 4.1 --- Overview of the Self-Assembling Process in UPy System --- p.47 / Chapter 4.2 --- Determination of the Dimerization Constants (Kdim*) --- p.49 / Chapter 4.2.1 --- Dimerization Constants in CDCl3 at 25 °C --- p.50 / Chapter 4.2.2 --- Dimerization Constants in 10% (v/v) DMSO-d6/CDCl3 at 25 °C --- p.53 / Chapter 4.2.3 --- Dimerization Constants in CDCl3 at 50 °C --- p.56 / Chapter 4.3 --- Heterodimerization Experiment --- p.56 / Chapter 4.4 --- Conclusions --- p.57 / Chapter Chapter 5 - --- Experimental Procedures / Chapter 5.1 --- General Information --- p.60 / Chapter 5.2 --- General Synthetic Procedures --- p.61 / Chapter 5.3 --- Experimental Procedures --- p.62 / References --- p.72 / Appendix / NMR Spectra --- p.78 / GPC results --- p.119

Chiu Lai Fan. / Thesis submitted in: December 2004. / Thesis (M.Phil.)--Chinese University of Hong Kong, 2005. / Includes bibliographical references (leaves [74-77]). / Abstracts in English and Chinese. / ABSTRACT (ENGLISH) --- p.iii / ABSTRACT (CHINESE) --- p.v / ACKNOWLEDGMENTS --- p.vi / TABLE OF CONTENTS --- p.vii / LIST OF FIGURES --- p.ix / LIST OF TABLES --- p.xi / LIST OF SYMBOLS --- p.xiii / Chapter CHAPTER ONE --- INTRODUCTION AND BACKGROUND --- p.1 / Chapter 1.1 --- Introduction --- p.1 / Chapter 1.2 --- The nature of hydrogen bonding interactions --- p.2 / Chapter 1.3 --- Evidences of hydrogen bonding interactions --- p.4 / Chapter 1.4 --- Three-centered hydrogen bond --- p.4 / Chapter 1.4.1 --- Literature review of three-centered H-bonds --- p.6 / Chapter 1.4.2 --- Review of three-centered H-bonds characterization --- p.8 / Chapter 1.5 --- Cooperative effect --- p.12 / Chapter 1.6 --- Scope of thesis --- p.13 / Chapter CHAPTER TWO --- THEORY AND METHODOLOGY --- p.15 / Chapter 2.1 --- Introduction --- p.15 / Chapter 2.2 --- Theory --- p.16 / Chapter 2.2.1 --- Density Functional Theory (DFT) --- p.16 / Chapter 2.2.2 --- Natural Bonding Orbital Theory (NBO) --- p.19 / Chapter 2.2.3 --- Spin-Spin coupling constants --- p.22 / Chapter 2.2.4 --- Wiberg Bond Index --- p.24 / Chapter 2.3 --- Methodology --- p.25 / Chapter CHAPTER THREE --- RESULTS AND DISCUSSION --- p.32 / Chapter 3.1 --- The nature of three-centered hydrogen bond interaction --- p.32 / Chapter 3.1.1 --- Geometries --- p.32 / Chapter 3.1.2 --- Natural bond orbital analysis - Donor-acceptor interactions --- p.41 / Chapter 3.1.3 --- Spin-Spin coupling across the hydrogen bonds --- p.46 / Chapter 3.1.4 --- Wiberg bond index --- p.51 / Chapter 3.1.5 --- Proton transfer -Hydrogen bond strengths on the effect of remote proton transfer --- p.53 / Chapter 3.1.6 --- Cooperactive character in hydrogen bonding clusters --- p.65 / Chapter CHAPTER FOUR --- CONCLUSING REMARKS --- p.71 / REFERENCES / APPENDIX

He, Guoyun. / Thesis (M.Phil.)--Chinese University of Hong Kong, 2011. / Includes bibliographical references (leaves 62-69). / Abstracts in English and Chinese. / Title Page --- p.i / Abstract (English Version) --- p.iv / Abstract (Chinese Version) --- p.v / Acknowledgement --- p.vi / List of Tables --- p.ix / List of Figures --- p.x / List of Abbreviations and Symbols --- p.xii / Chapter Chapter One: --- Introduction --- p.1 / Chapter 1.1 --- Mismatches in DNA Duplex --- p.1 / Chapter 1.2 --- T.T Mismatches in DNA Duplex --- p.5 / Chapter 1.3 --- Purpose of the Work --- p.7 / Chapter 1.4 --- DNA Structure --- p.7 / Chapter 1.4.1 --- Structure and Nomenclature of Nucleotide --- p.7 / Chapter 1.4.2 --- Base Pairing --- p.8 / Chapter 1.4.3 --- Double Helical DNA Conformation --- p.9 / Chapter Chapter Two: --- Materials and Methods --- p.10 / Chapter 2.1 --- Sample Design --- p.10 / Chapter 2.2 --- Sample Preparation --- p.11 / Chapter 2.3 --- NMR Study --- p.11 / Chapter 2.3.1 --- Non-labile Proton Resonance Assignment --- p.12 / Chapter 2.3.2 --- Labile Proton Resonance Assignment in Normal Base Pairs --- p.13 / Chapter 2.3.3 --- Method to Determine T.T Pairing Mode --- p.14 / Chapter Chapter Three: --- Determination of T.T Pairing Mode --- p.16 / Chapter 3.1 --- NMR Resonance Assignment --- p.16 / Chapter 3.2 --- Result --- p.18 / Chapter 3.2.1 --- Preferential Pairing Mode: W --- p.18 / Chapter 3.2.2 --- Preferential Pairing Mode: W --- p.19 / Chapter 3.2.3 --- Exchanging and Pairing Modes --- p.20 / Chapter 3.3 --- Discussion --- p.23 / Chapter 3.3.1 --- Patterns of T.T Pairing Mode --- p.23 / Chapter 3.3.2 --- Reason for Preferential Pairing Mode --- p.24 / Chapter 3.3.3 --- Temperature Effect on T.T Pairing Mode --- p.26 / Chapter Chapter Four: --- Conclusions and Future Works --- p.29 / Chapter Appendix I: --- NOESY and WATERGATER-NOESY Assignment --- p.30 / Chapter Appendix II: --- Chemical Shifts of XTY --- p.46 / References --- p.62

Recently, wirebonding process play an important role in IC assembly packaging manufacture. No degradation of bonding wire interconnection and defect free eutectic alloy bonding offer the high yield and reliability of products. The degradation of Au wire/Al bond pad has become a major bonding failure problem. By utilizing the SEM, AES, EDS and XPS techniques, it could be carried out to reveal and identify defects underneath Al layer, and the contaminated Al bond pads could cause poor intermetallic growths led to the failed or unreliable connections from the chip to the outside world. It is because that the molding resin with low thermal stability (e.g. bi-phenyl epoxy resin) and the IC devices under high thermal environments were used in packaging process. For the lifetime to bond failure, the bi-phenyl epoxy molding becomes shorter than that for cresol novolac epoxy due to the corrosion reaction of Au-Al intermetallics with bromine (Br) contained in the resin compounds. It was clarified that the reactive intermetallic was Au4Al phase formed in the bond interface.

Abstract The processing trade for China is based on the policy of exporting products to foreign countries while executing a bonding policy onto exported and imported materials and merchandise to increase competitions in the market. The taxation¡Blabour regulations¡Bforeign exchange control¡Bregulations and custom bookkeeping system of China are different from many countries, while the processing trade within China is a local economical activity, There is no consistent regulation established by the government for processing trade, Nevertheless, it has been executed through tentative policies and/or notification, Yet, it¡¦s still been persistently rectified, In the meantime , governing regulation have been widely prevailed among fields of customs¡Btrading¡Btaxation and accounting, which makes outsider difficult to understand. The aim of this study is to clarify the influence on the businesses type of processing trade resulting from the industrial policies and regulations of the Chinese government, and how S&M Enterprises should examine key elements of their businesses based on the industrial policies of the Chinese government, and choose an appropriate strategy to processing trade with their core specialties. Through qualitative research, the interviews with key figures in individual companies, and re-evaluation by other professionals, this study thoroughly examines the degree of influence on each type of processing trade from the seven key elements of business: industrial policies of the government¡B organization and human resources¡B taxation¡B finance¡B foreign exchange control¡B custom bookkeeping¡B market and quality control. Through inductive analysis, this study will make the following contributions to companies that either own or are considering the acquisition of a business to processing trade in China: • Contribution to literature¡Xreferences for running a business. • Contribution to evaluating the influence on the types of processing trade from the key elements of business¡Xa fish bone diagram of the key elements for the types of processing trade¡Xa strategic map. • Contribution to the analysis of key elements that are not appropriate for starting an effort to processing trade¡X self examination. • Contribution to the analysis and study of choosing key elements of the types of processing trade¡Xhelping management make the best decisions. [Key words] Processing trade, bonding policy

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It is an important topic for electronic packages to estimate the interfacial bonding strength between dissimilar materials. If it is not strong enough, delamination would arise easily under high temperature, vibration or collision. Its reliability will be reduced. The study on interfacial fracture behavior between epoxy resin and die based on experimental and numerical analyses is investigated, and it is useful to judge where the delamination happens . In terms of interfacial fracture mechanics, the critical strain energy release rate (G ) of crack tip is related to the phase angle (£r ) . Considering the interface of the epoxy /die existing a tiny crack, the compact mixed mode (CMM) fixture is used to decide the critical load . Finally , we adopt the finite element method to calculate that the critical strain energy release rate (G ) and the phase angle (£r ) in comparison with empirical results .

Modern development of electronic devices requires the integration of more and more powerful functions within the same amount of space. However, this is accompanied by increased difficulties within the manufacturing and packaging processes. A proposal for the arrangement of wire connecting is suggested. In this work, which is to replace the multi-tier design with conventional high & long wire bonding. The advance of bonding layout of the stack die HSBGA (Heat Slug Ball Grid Array) chip assembly can enhance wire bonding with electrical performance by shortening wire length. This promises a better thermal performance of thermal consumption between the function die and heat slugs. This analysis includes simulations of electrical and thermal performance, as well as simulations of drawing layout for an actual production, the bonding looping parameters optimization, and SEM analysis to confirm the results. Based on the above analyses, the results reveal three advantages of the proposal of ¡§Advance bonding layout of chip assembly¡¨ which are: (1)reduction of 40% thermal resistance, (2)£cJC voltage insertion loss improvement of 30~40%, and (3)reduction of the gold wire length from 4.5mm to 3mm, saving 1/3 of gold wire consumption. Overall, assembly costs can be reduced by 6%.

The study of alignment shift in flip chip bonding for VCSEL array was studied experimentally. We calculated the relation between the restoring force and the solder volume by the simulation software PadCAD. The metal pad size were 10£gm, 20£gm, 30£gm in diameter shape and 40£gm in square shape. The solder bump was electroplat by bidirection pulse in the silicon bench which was evaporated by Au/Pt/Ti. The oxidization in the surface of the solder was removed by using flux. The VCSEL array and the Si-bench in flip chip bonding was operated at the temperature 210¢J and 5 seconds. After the flip chip bonding, the minimum alignment shift in X direction was measured to be 2.2£gm. Base on the alignment shift measured result, the maximum coupling efficiency was calculated to be 48% for VCSEL array module.

Thesis (Ph. D.)--University of Oregon, 2003. / Typescript. Includes vita and abstract. Includes bibliographical references (leaves 140-147). Also available for download via the World Wide Web; free to University of Oregon users.