• Refine Query
  • Source
  • Publication year
  • to
  • Language
  • 6
  • 2
  • 1
  • 1
  • Tagged with
  • 10
  • 10
  • 4
  • 4
  • 3
  • 3
  • 3
  • 3
  • 3
  • 2
  • 2
  • 2
  • 2
  • 2
  • 2
  • About
  • The Global ETD Search service is a free service for researchers to find electronic theses and dissertations. This service is provided by the Networked Digital Library of Theses and Dissertations.
    Our metadata is collected from universities around the world. If you manage a university/consortium/country archive and want to be added, details can be found on the NDLTD website.
1

A Microfluidic Platform for the Automated Multimodal Assessment of Small Artery Structure and Function

Yasotharan, Sanjesh 24 July 2012 (has links)
In this thesis, I present a microfluidic platform that enables automated image-based assessment of biological structure and function. My work focuses on assessing intact resistance arteries from the mouse cerebral vascular bed with a diameter of approximately 120µm in vitro. The experimental platform consists of a microfluidic device and a world-to-chip fluidic interconnect that minimizes unwanted dead volumes and eliminates the need for any liquid-filled peripheral equipment. The integrated platform is computer controlled and capable of fully automated operation once a small blood vessel segment is loaded onto the chip. Robust operation of the platform was demonstrated through a series of case studies that assessed small artery function and changes therein induced by incubation with the drug nifedipine, a dihydropyridine calcium channel blocker. In addition artery segments were stained for L-type calcium channels, F-actin and nuclei, from which structural information about cell alignment and shape was quantified.
2

A Microfluidic Platform for the Automated Multimodal Assessment of Small Artery Structure and Function

Yasotharan, Sanjesh 24 July 2012 (has links)
In this thesis, I present a microfluidic platform that enables automated image-based assessment of biological structure and function. My work focuses on assessing intact resistance arteries from the mouse cerebral vascular bed with a diameter of approximately 120µm in vitro. The experimental platform consists of a microfluidic device and a world-to-chip fluidic interconnect that minimizes unwanted dead volumes and eliminates the need for any liquid-filled peripheral equipment. The integrated platform is computer controlled and capable of fully automated operation once a small blood vessel segment is loaded onto the chip. Robust operation of the platform was demonstrated through a series of case studies that assessed small artery function and changes therein induced by incubation with the drug nifedipine, a dihydropyridine calcium channel blocker. In addition artery segments were stained for L-type calcium channels, F-actin and nuclei, from which structural information about cell alignment and shape was quantified.
3

Reliable high-throughput FPGA interconnect using source-synchronous surfing and wave pipelining

Teehan, Paul Leonard 05 1900 (has links)
FPGA clock frequencies are slow enough that only a fraction of the interconnect’s bandwidth is used. By exploiting this bandwidth, the transfer of large amounts of data can be greatly accelerated. Alternatively, it may also be possible to save area on fixed-bandwidth links by using on-chip serial signaling. For datapath-intensive designs which operate on words instead of bits, this can reduce wiring congestion as well. This thesis proposes relatively simple circuit-level modifications to FPGA interconnect to enable high-bandwidth communication. High-level area estimates indicate a potential interconnect area savings of 10 to 60% when serial links are used. Two interconnect pipelining techniques, wave pipelining and surfing, are adapted to FPGAs and compared against each other and against regular FPGA interconnect in terms of throughput, reliability, area, power, and latency. Source-synchronous signaling is used to achieve high data rates with simple receiver design. Statistical models for high-frequency power supply noise are developed and used to estimate the probability of error of wave pipelined and surfing links as a function of link length and operating speed. Surfing is generally found to be more reliable and less sensitive to noise than wave pipelining. Simulation results in a 65nm process demonstrate a throughput of 3Gbps per wire across a 50-stage, 25mm link.
4

Design of an Asynchronous Ring Bus Architecture for Multi-Core Systems

Lei, Kin-fong 18 August 2010 (has links)
In the multi-core systems, the data transfer between cores becomes a major challenge. The on-chip interconnect networks should be low latency, high throughput, scalability, better router or arbitration strategy, and low power consumption. An asynchronous ring bus, which is 33 bit width, adopting dual-rail single-track data protocol is proposed in this thesis. It provides not only robust but also high-speed asynchronous circuits condition. Owing to asynchronous circuits design, there are different transfer times in different hop counts. The shorter the distance is, the faster the data can be transferred. Unlink the synchronous ring bus, the bus frequency must be limited by the longest hop count latency. On the other hand, the transmission time of asynchronous circuits will not be held up by the longest distance even though the number of core is increased. For providing higher throughput, multiple cores which are able to access the bus simultaneously make a direct connection between each other. In bus arbitration, distribution arbiter is adopted to arbitrate the right to use the bus and solve the collision. Finally, the system performance in different arbitration strategies has been estimated in TSMC 0.18£gm process in this thesis. The transmission time of the shortest distance is 1.5 ns approximately, and the longest distance first has a better performance in different arbitration strategies.
5

Reliable high-throughput FPGA interconnect using source-synchronous surfing and wave pipelining

Teehan, Paul Leonard 05 1900 (has links)
FPGA clock frequencies are slow enough that only a fraction of the interconnect’s bandwidth is used. By exploiting this bandwidth, the transfer of large amounts of data can be greatly accelerated. Alternatively, it may also be possible to save area on fixed-bandwidth links by using on-chip serial signaling. For datapath-intensive designs which operate on words instead of bits, this can reduce wiring congestion as well. This thesis proposes relatively simple circuit-level modifications to FPGA interconnect to enable high-bandwidth communication. High-level area estimates indicate a potential interconnect area savings of 10 to 60% when serial links are used. Two interconnect pipelining techniques, wave pipelining and surfing, are adapted to FPGAs and compared against each other and against regular FPGA interconnect in terms of throughput, reliability, area, power, and latency. Source-synchronous signaling is used to achieve high data rates with simple receiver design. Statistical models for high-frequency power supply noise are developed and used to estimate the probability of error of wave pipelined and surfing links as a function of link length and operating speed. Surfing is generally found to be more reliable and less sensitive to noise than wave pipelining. Simulation results in a 65nm process demonstrate a throughput of 3Gbps per wire across a 50-stage, 25mm link.
6

Reliable high-throughput FPGA interconnect using source-synchronous surfing and wave pipelining

Teehan, Paul Leonard 05 1900 (has links)
FPGA clock frequencies are slow enough that only a fraction of the interconnect’s bandwidth is used. By exploiting this bandwidth, the transfer of large amounts of data can be greatly accelerated. Alternatively, it may also be possible to save area on fixed-bandwidth links by using on-chip serial signaling. For datapath-intensive designs which operate on words instead of bits, this can reduce wiring congestion as well. This thesis proposes relatively simple circuit-level modifications to FPGA interconnect to enable high-bandwidth communication. High-level area estimates indicate a potential interconnect area savings of 10 to 60% when serial links are used. Two interconnect pipelining techniques, wave pipelining and surfing, are adapted to FPGAs and compared against each other and against regular FPGA interconnect in terms of throughput, reliability, area, power, and latency. Source-synchronous signaling is used to achieve high data rates with simple receiver design. Statistical models for high-frequency power supply noise are developed and used to estimate the probability of error of wave pipelined and surfing links as a function of link length and operating speed. Surfing is generally found to be more reliable and less sensitive to noise than wave pipelining. Simulation results in a 65nm process demonstrate a throughput of 3Gbps per wire across a 50-stage, 25mm link. / Applied Science, Faculty of / Electrical and Computer Engineering, Department of / Graduate
7

Capacitive Crosstalk Effects on On-Chip Interconnect Latencies and Data-Rates / Effekter av kapacitiv överhörning på fördröjning och datahastighet hos förbindelser på chip

Källsten, Rebecca January 2005 (has links)
<p>This thesis work investigates the effects of crosstalk on on-chip interconnects. We use optimal repeater insertion as a reference and derive analytical expressions for signal latency, maximum data-rate and power consumption. Through calculations and simulations we show that despite large uncertainties in arrival time of a signal that is subject to crosstalk, we are able to make predictions about the maximum data-rate on a bus. We also show that data-rates can exceed the classical limit of the latency inverted by using wave pipelining. To increase the data-rate, we can increase the number of repeaters to a limit, at the cost of additional latency and power. Savings in power consumption can be achieved by using fewer repeaters, paying in latency and data-rate. Through fewer repeaters, the top metal layer shows better performance in all investigated aspects.</p>
8

Capacitive Crosstalk Effects on On-Chip Interconnect Latencies and Data-Rates / Effekter av kapacitiv överhörning på fördröjning och datahastighet hos förbindelser på chip

Källsten, Rebecca January 2005 (has links)
This thesis work investigates the effects of crosstalk on on-chip interconnects. We use optimal repeater insertion as a reference and derive analytical expressions for signal latency, maximum data-rate and power consumption. Through calculations and simulations we show that despite large uncertainties in arrival time of a signal that is subject to crosstalk, we are able to make predictions about the maximum data-rate on a bus. We also show that data-rates can exceed the classical limit of the latency inverted by using wave pipelining. To increase the data-rate, we can increase the number of repeaters to a limit, at the cost of additional latency and power. Savings in power consumption can be achieved by using fewer repeaters, paying in latency and data-rate. Through fewer repeaters, the top metal layer shows better performance in all investigated aspects.
9

Ocin_tsim - A DVFS Aware Simulator for NoC Design Space Exploration and Optimization

Prabhu, Subodh 2010 May 1900 (has links)
Networks-on-Chip (NoCs) are a general purpose, scalable replacement for shared medium wired interconnects offering many practical applications in industry. Dynamic Voltage Frequency Scaling (DVFS) is a technique whereby a chip?s voltage-frequency levels are varied at run time, often used to conserve dynamic power. Various DVFSbased NoC optimization techniques have been proposed. However, due to the resources required to validate architectural decisions through prototyping, few are implemented. As a result, designers are faced with a lack of insight into potential power savings or performance gains at early architecture stages. This thesis proposes a DVFS aware NoC simulator with support for per node power-frequency modeling to allow fine-tuning of such optimization techniques early on in the design cycle. The proposed simulator also provides a framework for benchmarking various candidate strategies to allow selective prototyping and optimization. As part of the research, DVFS extensions were built for an existing NoC performance simulator and released for public use. This thesis presents some of the preliminary results from our simulator that show the average power consumed per node for all the benchmarks in SPLASH 2 benchmark suite [74] to be quite similar to each other. This thesis also serves as a technical manual for the simulator extensions. Important links for downloading and using the simulator are provided at the end of this document in Appendix C.
10

Power Optimal Network-On-Chip Interconnect Design

Vikas, G 02 1900 (has links) (PDF)
A large part of today's multi-core chips is interconnect. Increasing communication complexity has made new strategies for interconnects essential such as Network on Chip. Power dissipation in interconnects has become a substantial part of the total power dissipation. Hence, techniques to reduce interconnect power have become a necessity. In this thesis, we present a design methodology that gives values of bus width for interconnect links, frequency of operation for routers, in Network on Chip scenario that satisfy required throughput and dissipate minimal switching power. We develop closed form analytical expressions for the power dissipation, with bus width and frequency as variables and then use Lagrange multiplier method to arrive at the optimal values. To validate our methodology, we implement the router design in 90 nm technology and measure power for various bus widths and frequency combinations. We find that the experimental results are in good agreement with the predicted theoretical results. Further, we present the scenario of an Application Specific System on Chip (ASSoC), where the throughput requirements are different on different links. We show that our analytical model holds in this case also. Then, we present modified version of the solution considered for Chip Multi Processor (CMP) case that can solve the ASSoC scenario also.

Page generated in 0.1086 seconds