Thesis (Ph. D.)--University of Texas at Austin, 2004. / Supervisor: Michael D. Bryant. Vita. Includes bibliographical references.

Este trabalho procura desenvolver um novo modelo para análise estrutural de chapeamentos reforçados, que propõe ligar dois elementos estruturais de diferentes formulações, a saber: - Elementos de viga, analisados utilizando-se o método da rigidez, baseado na teoria linear de vigas, sendo, portanto, dentro das hipóteses inerentes à teoria , um método exato. Para tanto, desenvolve-se um novo elemento chamado viga excêntrica; - elementos de placa, analisados utilizando-se o método dos elementos finitos, podendo trabalhar com cargas em flexão e cargas no próprio plano acarretando um comportamento de membrana. O novo elemento de viga excêntrica é introduzido no programa SAP-VI (1) (podendo no entanto utilizar-se de outros programas), sendo realizados testes de interação com os elementos finitos de placa existentes no programa (2). O novo modelo revelou-se economicamente viável quando da sua utilização em chapeamentos reforçados, evitando-se a divisão em elementos finitos dos enrijecedores, que têm seu próprio comportamento dentro da teoria simples de vigas. / This work develops a new model for structural analysis of stiffened plating, involving two elements of different formulation, that is: - beam elements, analysed by the matrix method, based in the linear theory of beams, being then, with the hypothesis inherent to that theory, an exact method. For this purpose, it is developed a new element called \"eccentric beam\"; - plate elements, analysed by the finit element technique, working in bending and with loads in it\'s own plane, occasioning a membrane effect. The \"eccentric beam\" element is introduced in the SAP-IV (1) program (we might, however, use other programs). Tests were then carried out to assess the proper interaction of plate elements (2) and \"eccentric beam\". It was demonstrated that the new model is advantangeous when used in stiffened plating, avoinding the division in finite elements of the stiffeners.

Neste trabalho, é apresentado um estudo sobre a influência de aditivos em banhos de eletrodeposição de Au, análise da morfologia dos depósitos de Au e o crescimento de multicamadas da liga AuxSny por deposição eletroquímica. Os banhos de eletrodeposição estudados são baseados em uma composição, comum na literatura, formada por tetraclorourato(III) de potássio (KAuCl4), cloreto de estanho(II) (SnCl2), sulfito de sódio (Na2SO3), e citrato de amônio [(NH4)HC6H5O7]. Os contatos de solda da liga AuxSny, aplicáveis em diversos dispositivos microeletrônicos, podem ser formadas de maneira mais econômica a partir de banhos eletroquímicos. Banhos ácidos e reagentes de baixa toxicidade são exigências comuns dos novos banhos de eletrodeposição. A formação de multicamadas permite, ainda, ampliar o uso do metal de solda em dispositivos sensíveis a altas temperaturas, devido ao baixo ponto de fusão da liga. A obtenção das ligas AuxSny utilizando deposição eletroquímica, foi feita com base no estudo sobre banho de eletrodeposição e seus depósitos, a partir de um banho para deposição da liga AuxSny já conhecido. O aprimoramento do banho de eletrodeposição foi focado no banho de eletrodeposição de Au, com três opções de aditivos, buscando avaliar as características dos depósitos e o tempo de estabilidade do banho. Os aditivos utilizados foram hipofosfito de sódio (NaH2PO2), metanal (HCHO) e tiossulfato de sódio (Na2S2O3), separadamente. Esses banhos foram analisados por voltametria cíclica, e os depósitos obtidos a partir de eletrodeposições foram caracterizados por Espectrometria por Retroespalhamento de Rutherford (RBS), Microscopia Eletrônica de Varredura (SEM) e, em alguns casos, por Espectrometria de Energia Dispersiva de Raios X (EDS). Análises de dimensão fractal e de escalamento dinâmico da rugosidade forneceram detalhes importantes sobre a morfologia superficial dos depósitos. .A adição de Na2S2O3 ao banho permitiu o desenvolvimento de um novo banho de eletrodeposição para a co-deposição de Au AuxSny. O Na2S2O3 atua como um complexante dos íons de Au(I) juntamente com o sulfito de sódio. O emprego de 3 g L-1 de Na2S2O3 evita a degradação do banho durante as eletrodeposições. Finalmente, o estudo da eletrodeposição de multicamadas foi feito por controle do potencial aplicado e por controle da corrente aplicada. As multicamadas obtidas apresentaram camadas da liga AuxSny com a concentração de Sn incorporado, variando entre 6 % e 49 % (em porcentagem atômica). / It is shown in this work a study about the influence of additives in baths for electrodeposition of Au, analysis of morphology of gold deposits and the growth of multilayered AuxSny alloys from improved electrodeposition baths based on a common composition of the literature containing potassium gold(III) chloride (KAuCl4), tin(II) chloride (SnCl2), sodium sulfite (Na2SO3) and ammonium citrate dibasic [(NH4)HC6H5O7]. The AuxSny solders are commonly used in microelectronic devices. These solders can be applied in a number of ways, and electrochemical deposition is an attractive alternative due to the low cost process. Acidic baths and low toxicity reagents are common requirements of new electrochemical baths. The multilayered AuxSny alloys are applicable to temperature sensitive materials due to its reduced melting point temperature. Therefore, the study of electrodeposition of AuxSny alloys began with an already known bath and aiming its improvement. The focus of interest was the gold bath, which received additives to improve control of the deposits and their stability. The additives used were sodium hypophosphite (NaH2PO2), methanal (HCHO) and sodium thiosulfate (Na2S2O3), one of each time. These baths were analyzed by cyclic voltammetry and the deposits obtained from these baths were analyzed by Rutherford Backscattering Spectrometry (RBS), Scanning Electron Microscopy (SEM) and, in some cases, Energy Dispersive Spectrometry (EDS). Fractal dimension and dynamic scaling of the surface width analysis allowed one to quantify the surface morphology details. The addition of Na2S2O3 to the bath allowed the development of a new electrodeposition bath for co-deposition of AuxSny. The Na2S2O3 acts as complexing agent of Au(I) ions together with sodium sulfite. The use of 3 g L-1 of Na2S2O3 avoids bath degradation during the electrodepositions. Potential-controlled and current-controlled electrodepositions were employed to obtain multilayers of AuxSny alloys. The multilayer deposits obtained presented between 6 atomic % and 49 atomic % of tin.

The electrochemical quartz crystal microbalance (EQCM) has been proven an effective mean of monitoring up to nano-scale mass changes related to electrode potential variations at its surface. The principles of operation are based on the converse piezoelectric response of quartz crystals to mass variations on the crystal surface. In this work, principles and operations of the EQCM and piezo-electrodes are discussed. A conductive oxide, ruthenium oxide (RuO2) is a promising material to be used as a diffusion barrier for metal interconnects. Characterization of copper underpotential deposition (UPD) on ruthenium and RuO2 electrodes by means of electrochemical methods and other spectroscopic methods is presented. Copper electrodeposition in platinum and ruthenium substrates is investigated at pH values higher than zero. In pH=5 solutions, the rise in local pH caused by the reduction of oxygen leads to the formation of a precipitate, characterized as posnjakite or basic copper sulfate by means of X-ray electron spectroscopy and X-ray diffraction. The mechanism of formation is studied by means of the EQCM, presenting this technique as a powerful in-situ sensing device.

abstract: An ongoing effort in the photovoltaic (PV) industry is to reduce the major manufacturing cost components of solar cells, the great majority of which are based on crystalline silicon (c-Si). This includes the substitution of screenprinted silver (Ag) cell contacts with alternative copper (Cu)-based contacts, usually applied with plating. Plated Cu contact schemes have been under study for many years with only minor traction in industrial production. One of the more commonly-cited barriers to the adoption of Cu-based contacts for photovoltaics is long-term reliability, as Cu is a significant contaminant in c-Si, forming precipitates that degrade performance via degradation of diode character and reduction of minority carrier lifetime. Cu contamination from contacts might cause degradation during field deployment if Cu is able to ingress into c-Si. Furthermore, Cu contamination is also known to cause a form of light-induced degradation (LID) which further degrades carrier lifetime when cells are exposed to light. Prior literature on Cu-contact reliability tended to focus on accelerated testing at the cell and wafer level that may not be entirely replicative of real-world environmental stresses in PV modules. This thesis is aimed at advancing the understanding of Cu-contact reliability from the perspective of quasi-commercial modules under more realistic stresses. In this thesis, c-Si solar cells with Cu-plated contacts are fabricated, made into PV modules, and subjected to environmental stress in an attempt to induce hypothesized failure modes and understand any new vulnerabilities that Cu contacts might introduce. In particular, damp heat stress is applied to conventional, p-type c-Si modules and high efficiency, n-type c-Si heterojunction modules. I present evidence of Cu-induced diode degradation that also depends on PV module materials, as well as degradation unrelated to Cu, and in either case suggest engineering solutions to the observed degradation. In a forensic search for degradation mechanisms, I present novel evidence of Cu outdiffusion from contact layers and encapsulant-driven contact corrosion as potential key factors. Finally, outdoor exposures to light uncover peculiarities in Cu-plated samples, but do not point to especially serious vulnerabilities. / Dissertation/Thesis / Doctoral Dissertation Materials Science and Engineering 2020

The Galvanic Plating Technology is used by many branches of modern industry. Sizeable amounts of waste water are an integral part of plating technologies. It contains a versatile spectrum of chemical substances hazardous to the environment. This work focuses on monitoring the level and nature of waste water pollution resulting in primary production. Several indicators were selected to appreciate the quality of the effluent, which were defined according to the procedures. The possibility of quality monitoring process based on values of pollution was discussed after evaluating the results.

This diploma thesis is focused to nickel coatings on magnesium alloys. At the introduction of this work is briefly commented phase composition of AZ91 alloy, which is followed by detailed description of five very different theories of Ni-P coatings formation. Theoretical part is ended by review aimed to current states of development in areas of chemical nickel coating, influence of AZ91 alloy microstructure to current less deposition and possibility of surfactants influence to decrease of surface roughness. In experimental part of this thesis was the morphology and composition of Ni-P coatings including interlayers dependence on chemical composition of nickel-plating bath and magnesium alloy surface pre-treatment investigated using scanning electron microscopy and inverted optical microscopy. Average phosphorus content was obtained using energy dispersive analysis. Closing part of experimental part was dedicated for mechanical properties of coatings by micro-indentation analysis.

This work deals with the advanced methods of contact’s fabrication for monocrystalline solar cells and the appropriate methods for the analysis of their properties with a focus on the study and realization the contact’s structures with low contact and sheet resistance fabricated by galvanic and electroless processes. In the first part of the work is discussed the theory of solar cells and buried contacts and in the second part of the work is an evaluation of practical realization.

An analysis of current surface treatments used for electrical devices with a focus on the quality, durability and costs of the technologies. An overview of the surface treatments used in the specified area with a summary of parameters reached today.

The project elaborated in scope of engineering studies branch 2307. The project is submitting design of production technology of car emblem. Different manufacturing technologies have been compared based on study of technical literature. Most suitable technologies have been chosen such as pressure die casting, especially aluminum alloys and plastic injection molding. Plastic part is metal plated afterwards in order to get desired metal look. Part of this project is injection molding tool design inclusive technical, technological and economic analysis.