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Durability of Polyimide/Titanium Adhesive Bonds: An Interphase InvestigationGiunta, Rachel K. 18 November 1999 (has links)
When bonded joints are subjected to harsh environmental conditions, the interphase, the three-dimensional region surrounding the adhesive/substrate interface, becomes critically important. Frequently, failure occurs in this region after adhesively bonded systems are subjected to elevated temperature oxidative aging. In a previous study, this was found to be the case with a polyimide adhesive bonded to chromic acid anodized (CAA) Ti-6Al-4V. The objective of the current research has been twofold: 1) to investigate the effect of thermal aging on the interphase region of polyimide/titanium adhesive joints, and 2) to evaluate the method used in the current study for durability characterization of other adhesive/substrate systems. The method used in this research has been to characterize the effect of elevated temperature aging on the following systems: 1) Notched coating adhesion (NCA) specimens and 2) bulk samples of dispersed substrate particles in an adhesive matrix. The NCA test has the advantages of an accelerated aging geometry and a mode mix that leads to failure through the interphase, the region of interest. The bulk samples have the advantage of an increased interphase volume and allow for the application of bulk analysis techniques to the interphase, a region that is traditionally limited to surface analysis techniques. The adhesive systems studied consisted of one of two polyimide adhesives, LaRC© PETI-5 or Cytec Fiberite© FM-5, bonded to CAA Ti-6Al-4V. The model filled system consisted of a PETI-5 matrix with amorphous titanium dioxide filler. Through the use of the NCA test, it was determined that bonded specimens made with FM-5 lose approximately 50% of their original fracture energy when aged in air at 177°C for 30 days. This aging temperature is well below the glass transition temperature of the adhesive, 250°C. At the same time, the failure location moves from the anodized oxide layer to the adhesive that is directly adjacent to the substrate surface, the interphase region. Through surface analysis of this region, it is determined that the adhesive penetrates the pores of the CAA surface to a depth of 70 to 100 nm, promoting adhesion at the interface. With aging, the adhesive in the interphase region appears to be weakening, although analysis of the bulk adhesive after aging shows little change. This indicates that adhesive degradation is enhanced in the interphase compared to the bulk. Analysis of the model filled system gave similar information. Specimens containing titanium dioxide filler had glass transition temperatures that were approximately 20°C lower than the neat polyimide samples. In addition, the filled samples contained a significant portion of low molecular weight extractable material that was not present in the neat specimens. The tan delta spectra from dynamic mechanical thermal analysis of the filled specimens exhibited a shoulder on the high-temperature side of the glass transition peak. This shoulder is attributed to the glass transition of the interphase, a distinct phase of the polyimide which is constrained by adsorption onto the filler particle surfaces. As a function of aging time at 177° or 204°C, the shoulder decreases substantially in magnitude, which may relate to loss of adhesive strength between the polyimide and the filler particles. From this research, it has been illustrated that information relating to the durability of adhesively bonded systems is gained using an interfacially debonding adhesive test and a model system of substrate particles dispersed in an adhesive matrix / Ph. D.
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Separation of CO2 using ultra-thin multi-layer polymeric membranes for compartmentalized fiber optic sensor applicationsDavies, Benjamin 20 March 2014 (has links)
Carbon dioxide sequestration is one of many mitigation tools available to help reduce carbon dioxide emissions while other disposal/repurposing methods are being investigated. Geologic sequestration is the most stable option for long-term storage of carbon dioxide (CO2), with significant CO2 trapping occurring through mineralization within the first 20-50 years. A fiber optic based monitoring system has been proposed to provide real time concentrations of CO2 at various points throughout the geologic formation. The proposed sensor is sensitive to the refractive index (RI) of substances in direct contact with the sensing component. As RI is a measurement of light propagating through a bulk medium relative to light propagating through a vacuum, the extraction of the effects of any specific component of that medium to the RI remains very difficult. Therefore, a requirement for a selective barrier to be able to prevent confounding substances from being in contact with the sensor and specifically isolate CO2 is necessary. As such a method to evaluate the performance of the selective element of the sensor was investigated. Polybenzimidazole (PBI) and VTEC polyimide (PI) 1388 are high performance polymers with good selectivity for CO2 used in high temperature gas separations. These polymers were spin coated onto a glass substrate and cured to form ultra-thin (>10 μm) membranes for gas separation. At a range of pressures (0.14 –0.41 MPa) and a set temperature of 24.2±0.8 °C, intrinsic permeabilities to CO2 and nitrogen (N2) were investigated as they are the gases of highest prevalence in underground aquifers. Preliminary RI testing for proof of concept has yielded promising results when the sensor is exposed exclusively to CO2 or N2. However, the use of both PBI and VTEC PI in these trials resulted in CO2 selectivities of 0.72 to 0.87 and 0.33 to 0.63 respectively, for corresponding feed pressures of 0.14 to 0.41 MPa. This indicates that both of the polymers are more selective for N2 and should not be used in CO2 sensing applications as confounding gas permeants, specifically N2, will interfere with the sensing element. / Graduate / 0428 / 0495 / 0542 / ben.t.davies@gmail.com
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Biokompatibilita a imunokompatibilita polymerů určených pro genovou terapii / Biocompatibility and immunocompatibility of polymers for gene therapyMatyášová, Veronika January 2010 (has links)
Gene therapy is a potential strategy for treatment of diseases caused by a gene defect. Recent studies are involved particulary in the cure of diseases caused by single gene defect (cystic fibrosis, haemophilia, muscular dystrophy etc.). Our work is part of a project aiming at developing ex vivo non-viral gene delivery systems that could be used for the treatment of ocular and cardiovascular diseases. The gene vectors are biodegradable polymeric carriers based on poly-α-amino acids. These polyplexes should transfect target cells which are supposed to be seeded on polyimide membranes. The biodegradable polymer membrane will be implanted into the retina or used as a coating for cardiovascular prosthesis. As a cover of the implantable membranes we used polymerized methacrylamide-modified gelatin forming hydrogels and mediating a growth support for transfected cells. We focus on material bio- and immunocompatibility/immunoacceptability. The results indicated a very good bio- and immunocompatibility of the gelatin B hydrogel both in vitro and in vivo. The gelatin B hydrogel did not cause erythrocytes lysis, stimulation of proliferation (spontaneous or mitogen-induced) of mouse or human lymphoid cells, neither production of cytokines or NO in vitro. Histological examination following subcutaneous...
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Interfacial Structure of Bilayer Compensation Films Prepared by Direct Coating ProcessYu, Wumin 11 December 2012 (has links)
No description available.
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I. Polymer Films for High Temperature Capacitor ApplicationsII. Differential Electrochemical Mass SpectrometryTreufeld, Imre 01 September 2016 (has links)
No description available.
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High-gain metasurface in polyimide on-chip antenna based on CRLH-TL for sub-terahertz integrated circuitsAlibakhshikenari, M., Virdee, B.S., See, C.H., Abd-Alhameed, Raed, Falcone, F., Limiti, E. 05 August 2020 (has links)
Yes / This paper presents a novel on-chip antenna using standard CMOS-technology based on metasurface implemented on two-layers polyimide substrates with a thickness of 500 μm. The aluminium ground-plane with thickness of 3 μm is sandwiched between the two-layers. Concentric dielectric-rings are etched in the ground-plane under the radiation patches implemented on the top-layer. The radiation patches comprise concentric metal-rings that are arranged in a 3 × 3 matrix. The antennas are excited by coupling electromagnetic energy through the gaps of the concentric dielectric-rings in the ground-plane using a microstrip feedline created on the bottom polyimide-layer. The open-ended feedline is split in three-branches that are aligned under the radiation elements to couple the maximum energy. In this structure, the concentric metal-rings essentially act as series left-handed capacitances CL that extend the effective aperture area of the antenna without affecting its dimensions, and the concentric dielectric rings etched in the ground-plane act as shunt left-handed inductors LL, which suppress the surface-waves and reduce the substrates losses that leads to improved bandwidth and radiation properties. The overall structure behaves like a metasurface that is shown to exhibit a very large bandwidth of 0.350–0.385 THz with an average radiation gain and efficiency of 8.15dBi and 65.71%, respectively. It has dimensions of 6 × 6 × 1 mm3 that makes it suitable for on-chip implementation. / This work is partially supported by RTI2018-095499-B-C31, Funded by Ministerio de Ciencia, Innovación y Universidades, Gobierno de España (MCIU/AEI/FEDER,UE), and innovation programme under grant agreement H2020-MSCA-ITN-2016 SECRET-722424 and the fnancial support from the UK Engineering and Physical Sciences Research Council (EPSRC) under grant EP/E022936/1. / Research Development Fund Publication Prize Award winner, March 2020
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Investigations into High Surface Area and Hierarchical Phase Segregated Network StructuresViggiano, Rocco P., III January 2015 (has links)
No description available.
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