DoD EO/IR applications continue to push imaging technology. Next generation advances require new material systems, novel device structures, as well as the improvement and development of read out integrated circuits. The common methodology used to assess devices and materials is to process test chip structures and focal plane arrays. Test chips have advantages over focal plane arrays; such as, variable area and stand alone devices and can be measured as a function of bias and temperature; however, focal plane arrays are the heart of the imager, but are measured through the read out integrated circuits, which can add complexity to the measurement and to the extraction of properties. Differences between a test chip and a focal plane array make it difficult to relate test chip characterization with focal plane array performance and the interaction of defects and the impact they have to the image. Therefore, it is vital to be able to characterize the detector array directly from 77 to 300 K. This thesis presents the design for a transparent cryogenic probe card based on a silicon carbide substrate. An inspection into the design for the bonding printed circuit board and its compliant structures is included. The design for the silicon carbide probe die is explored. The design and process for fabricating tungsten probe tips is discussed. Results on research efforts are presented showing the validity of the design based upon fabrication outcomes. It is recommended that future work explore additional tungsten tip fabrication methods.

A Study On the Strategy of Semiconduuctor Probe Card Industry ¡V The Case of L Corportation Abstract Probe card is a kind of electronic consumption material that used in the machines of semiconductor packaging factories. For the growth of semiconductor industries of Taiwan, production capacity has been expanded in packaging manufacturers together with the requirement of probe card. Most of probe cards are imported before year 1990; but recently years, USA and Japan probe card manufacturers transferred production technique and production line to Taiwan and then Taiwan have the ability to produce the probe cards and also cooperate with other vendors in the ways of strategic alliance and technical transferring. Gradually, short lead time and in time customer service are becoming the most important items within this field. The example company L is especially analyze via Porter¡¦s SWOT for research the strategic method and find out the competition within this field, which base on quality, lead time, service and customer service, and etc. The consultation and the suggestions are as below: 1. Best quality: One of the most important items that customers concern about, and much more important than the price of the probe cards, sample company should have to strength on the administrative structure to meet the customers¡¦ requirements. 2. Variation of products Vertical probe card is the benefit based market much more than epoxy ones, high gross profit, and the competitive companies are just 2-3 ones, if the sample company can develop and get advanced within, he will be expand much in possession of markets with his high quality of products. ii 3. Focusing on key customers With the focusing on 3-5 customers with high level products and mass production, the sample company will get the stable orders with the important selling and service. 4. Customers Relationship Management (CRM) We found it¡¦s very important for this field to count on the service after selling; therefore, it¡¦s very important to do well in Customers Relationship Management (CRM) The researches above are the suggestions for sample company and only with right strategy, it¡¦s possible for him to stand one seat in this field. Key words: semiconductor, packaging factories, probe card, strategic alliance, SWOT

Silicon carbide has many properties that make it a promising and desirable material for diverse applications. One such application for silicon carbide wafers is as a transparent cryogenic probe card. This thesis briefly describes the design of a probe card based on a silicon carbide wafer substrate. It includes a description of electroplating fundamentals and demonstrates the feasibility of electroplating copper onto a wafer for the formation of bond pads between the substrate and external PCB ring. The process for electroplating copper with good adhesion and quality based on metal alloy formation, current control, and materials selection is outlined. Results of this process are also presented. This work also demonstrates the ability to machine silicon carbide using electrical discharge machining, abrasive water jet machining, and diamond bit milling, proving diamond grinding to be the most versatile of the described methods for machining intricate patterns into the wafers.