The objective of this research is to comprehensively compare bulk accumulation and inversion MOSFETs, and find application areas where each is superior.Short channel effect (SCE) models for accumulation and inversion MOSFETs are derived that accurately predict threshold voltage, subthreshold swing, and subthreshold current. A source/drain junction depth dependent characteristic length is derived that can be used to rapidly assess the impact of junction depth scaling on minimum channel length. A fast circuit simulation methodology is developed that uses physically based I-V models to simulate inversion and accumulation MOSFET inverter chains, and is found to be accurate over a wide range of supply voltages. The simulation methodology can be used for rapid technology optimization, and performance prediction. Design guidelines are proposed for accumulation MOSFET design; the guidelines result in a low process sensitivity, low SCE, and a subthreshold current less than the allowable limit. The relative performance advantage of accumulation/inversion MOSFETs is gate-technology dependent. In critical comparisons, on-current is evaluated by means of a full band Monte Carlo device simulation. Gate-leakage, and band-to-band tunneling leakage at the drain-substrate region are included in the performance analysis. For mid-bandgap metal gate, accumulation MOSFETs perform better than inversion MOSFETs for hi-performance (HiP) and low-operating power (LOP) applications. For tunable metal gate technology, inversion MOSFETs always perform better than accumulation MOSFETs. For dual poly technology, accumulation MOSFETs perform better than inversion MOSFETs for low standby power (LSTP) applications. A comprehensive scaling analysis has been performed on accumulation and inversion MOSFETs using both SCE models and 2-D simulations. Results show that accumulation MOSFETs can scale better than inversion MOSFETs for mid-bandgap metal gate HiP, and LOP applications; and poly gate LSTP applications.

In this paper, several new MOSFET devices, vertical MOSFET with L-shaped internal block layers (bVMOS), planar MOSFET with self-aligned internal block layers (bMOS), and Silicon-Germanium MOSFET with self-aligned internal block layers (bSGMOS) are presented. We use the sidewall spacer and etch back techniques to form the L-shaped internal block layers of bVMOS. They can suppress the short channel effects, diminish the parasitic capacitance, and reduce the leakage current cause by P-N junction between source/drain and body regions. They also provide a pass way to eliminate carriers and heat which generated by impact ionization resulting in suppression of floating-body effect and self-heating effect. In addition, we use Si3N4 cap layer upon gate as a hard mask, combining self-aligned and sidewall spacer techniques to fabricate the internal block layers under the both sides of channel end to form bMOS. The depleted region between source/drain and body is shielded and so the short channel effects and the controllability of gate to channel are improved. The internal block layers not only maintain the character of internal block layers but also ameliorate the drawback of bVMOS. The ISE TCAD simulation results show the short channel effect is suppressed and the thermal instability is improved by the internal block layers effectively in each device. Furthermore, we employ the epitaxial silicon-germanium thin film process (bSGMOS) to form silicon-germanium thin film at source/drain region to improve the device current drive by the strain thereby enhancing the device performance.

This paper investigates the device behavior of a novel pseudo tri-gate ultrathin channel vertical MOSFET with source/drain tie (S/D tie), the PTG-SDT VMOS. The S/D tie (SDT) of this novel device circumvents short channel effect (SCEs). A double- surround-gate (the mid-gate and the spacer gate) is also presented to investigate the effect of S/D tie. According to the 2D simulation, three kinds of pseudo vertical MOSFETs are now proposed. The first one is to investigate the device characteristics of the new PTG-SDT VMOS. Our proposed structure also mitigates self-heating effect (SHEs), thereby enhancing the drain drive current and the thermal stability. Owing to its ultrathin channel (Tsi = 10 nm), the PTG-SDT VMOS has a very low subthreshold swing of 60 mV/dec, for channel lengths from 90 nm down to 40 nm. It is also found to control drain-induced barrier lowing (DIBL) and to have an excellent Gm of 4.5 mS/£gm at the channel length 40 nm. The second one, we proposed the ultrathin channel pseudo tri-gate vertical MOSFET with natural source/drain tie (NSDT), the big source/drain tie (BSDT), the SDT and the without source/drain tie (WSDT) VMOS. The PTG VMOS of this novel structure circumvents short channel effects (SCEs). A new natural S/D tie (N-SDT) is also presented to investigate of the PTG VMOS. According to 2D simulation, the PTG-NSDT also show the excellent thermal dissipated such as the lattice temperature in the drain-on-top configuration and drain-on-bottom configuration were improved 47% and 66% respectively, thereby enhancing the ON-state and OFF-state current ratio. In addition, the dependence of GIDL current on body bias and temperature is characterized and discussed when the source and drain interchanged. Although the PTG VMOS keep the double-surround-gate and S/D tie structure, the design flow is more simplify even increase the drain drive current and immunity the SHEs.

I propose compact models of single-gate (SG) and double-gate (DG) JFETs predicting the current-voltage characteristics for both long and short channel devices. In order to make the current equation continuous through all operating conditions from subthreshold to well-above threshold, without non-physical fitting parameters, mobile carriers in depletion region are considered. For describing the short channel behavior, relevant parameters extracted from the two-dimensional analytical solution of Poisson's equation are used for modifying long channel equations. Comparisons of models with the numerical simulation showing close agreement are presented. Based on models, merits of DG JFET over SG JFET and SG MOSFET are discussed by examining the schematic circuit diagram describing the relation between gate and channel potentials for each device. / text

The recent developments of high resolution flat panel imagers have prompted interests in fabricating smaller on-pixel transistors to obtain higher fill factor and faster speed. This thesis presents fabrication and modeling of short channel amorphous silicon (a-Si:H) vertical thin film transistors (VTFT). <br /><br /> A variety of a-Si:H VTFTs with different channel lengths, from 100 nm to 1 &mu;m, are successfully fabricated using the discussed processing steps. Different structural and electrical characteristics of the fabricated device are measured. The results of I-V and C-V characteristics are comprehensively discussed. The 100 nm channel length transistor performance is diverged from regular long channel TFT characteristics, as the short channel effects become dominant in the device, giving rise to necessity of having a physical model to explain such effects. <br /><br /> An above threshold model for a-Si:H VTFT current characteristics is extracted. The transport mechanisms are explained and simulated for amorphous silicon material to be used in the device model. The final model shows good agreement with experimental results. However, we used numerical simulation, run in Medici, to further verify the model validity. Simulation allows us to vary different device and material parameters in order to optimize fabrication process for VTFT. The capacitance behavior of the device is extensively studied alongside with a TFT breakdown discussion.

The recent developments of high resolution flat panel imagers have prompted interests in fabricating smaller on-pixel transistors to obtain higher fill factor and faster speed. This thesis presents fabrication and modeling of short channel amorphous silicon (a-Si:H) vertical thin film transistors (VTFT). <br /><br /> A variety of a-Si:H VTFTs with different channel lengths, from 100 nm to 1 &mu;m, are successfully fabricated using the discussed processing steps. Different structural and electrical characteristics of the fabricated device are measured. The results of I-V and C-V characteristics are comprehensively discussed. The 100 nm channel length transistor performance is diverged from regular long channel TFT characteristics, as the short channel effects become dominant in the device, giving rise to necessity of having a physical model to explain such effects. <br /><br /> An above threshold model for a-Si:H VTFT current characteristics is extracted. The transport mechanisms are explained and simulated for amorphous silicon material to be used in the device model. The final model shows good agreement with experimental results. However, we used numerical simulation, run in Medici, to further verify the model validity. Simulation allows us to vary different device and material parameters in order to optimize fabrication process for VTFT. The capacitance behavior of the device is extensively studied alongside with a TFT breakdown discussion.