Diss. Linköping : Linköpings universitet, 2006.

Diss. (sammanfattning) Karlstad : Karlstads universitet, 2007. / Härtill 5 uppsatser.

Diss. Linköping : Univ., 2002.

Diss. Linköping : Univ., 2002.

Diss. (sammanfattning) Uppsala : Univ., 2004. / Härtill 6 uppsatser.

Diss. (sammanfattning) Karlstad : Karlstads universitet, 2008. / Härtill 4 uppsatser.

Diss. (sammanfattning) Uppsala : Univ., 2003. / Härtill 17 uppsatser.

Diss. Linköping : Univ., 2003.

The aim of this project was to, based on a given idea, develop and evaluate a method for measuring residual stress in thin PVD coatings. AlCrN was deposited, by PVD, on thin circular samples of stainless steel foil and the radius of the emerged curvature was measured using an optical profilometer. From the radius data the residual stress in the coating of each sample was calculated. The foil samples examined were of two different thicknesses, 0.3 mm and 0.5 mm. With the parameters of the project the foils of 0.3 mm were found most suitable. Furthermore, the method was compared to an already established method where depositions are made on thicker substrates, which are then ground to an appropriate thickness. A correlation factor between the two methods was calculated and found to be 0.91 ± 0.28. Finally, the possibility of adapting the method in running production was investigated. Cost and time analyses were conducted and both supported the applicability of the method. / Projektets syfte var att utveckla och utvärdera en metod för att mäta restspänningar i tunna PVD-beläggningar utifrån en redan befintlig idé. Tunna cirkulära prover av rostfritt stål belades med AlCrN genom PVD och radien på den utböjning som uppstod mättes med en optisk profilometer. Restspänningen bestämdes sedan utifrån den uppmätta radien. Folier av två olika tjocklekar, 0,3 mm och 0,5 mm, utvärderades. Med de processparametrar som användes i projektet visades att folien med tjocklek 0,3 mm var den bäst lämpade. Metoden jämfördes även med en etablerad metod där tjocka substrat beläggs och sedan slipas ned till lämplig tjocklek. En korrelationsfaktor som relaterar de två metoderna bestämdes till 0,91 ± 0,28. Slutligen undersöktes möjligheterna att använda metoden i löpande produktion. Kostnads- och tidsanalyser utfördes och resultaten stödjer metodens användbarhet.

Saab Microwave Systems, SMW is a supplier of radar systems. The circuit boards that are operating in their radars have components which solder joints contains lead. However, the EU directive RoHs and WEEE are causing SMW to prepare for a transition to lead free solder joints. The objective of this thesis is to gain deeper knowledge of lead free solder joints. Brittle fractures in solder joints is a type of failure that might increase in a transition to lead free solder joints. The brittle fractures are induced by the creation of the intermetallic phases which are formed during soldering. The amount and composition of the intermetallics affects the mechanical strength of the joint. An intermetallic layer is thickened during heat exposure as during soldering, thermal aging and rework. The focus of this thesis was to investigate how rework affect the brittleness of the lead free solder joint and thereby how the intermetallic layers change depending on chemical composition, design and reflow cycles. Two types of components and two types of solder materials (SnPb and SAC305) were studied. To study the mechanical properties of the joint a shear testing device was used. This is a way of measuring the reliability of the joint when subjected to mechanical shock. The intermetallic layers were examined in a Scanning Electron Microscope and the fracture surfaces were studied in a optical microscope, a scanning electron microscope and a stereomicroscope. The heat spread over the board where examined by soldering thermocouples to the board and plotting the values of time and temperature. The results showed that the rework process did not have any significant impact of the intermetallic growth. The adjecent and distant components were not damaged during rework. A lead free rework process can therefor be preformed successfully at SMW. The intermetallic layers formed at the interface between the a lead free solder and a nickel finish grew faster than an intermetallic layer formed between a leaded solder and a nickel finish. The presence of nickel could therefore have a more negative effect on the intermetallic growth rate for the lead free material compared to the leaded.