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  • About
  • The Global ETD Search service is a free service for researchers to find electronic theses and dissertations. This service is provided by the Networked Digital Library of Theses and Dissertations.
    Our metadata is collected from universities around the world. If you manage a university/consortium/country archive and want to be added, details can be found on the NDLTD website.
21

Geometric Shape Prediction for a Sn/4.0Ag/0.5Cu (SAC405) Solder Joint After Reflows

Liu, Kuang-Ting 08 July 2008 (has links)
The fatigue-induced solder joint failure of surface mounted electronic devices has become one of the most critical reliability issues in electronic packaging industry. Prediction of the shape of solder joints has drawn special attention to the related development and engineering applications. Numerous solder joint models, based on energy minimization principle and analytical methods, have been proposed and developed. The methods are extensively utilized to the shape design of solder joint. However, it is important to find a suitable method to real applications. Herein, a series of experiments with different geometric parameters of SAC405 solder joints were carried out and the results were compared with the prediction by Surface Evolver Program. The changes of geometric shape with respect to different parameters of solder joint were also discussed. The influence of the geometric parameters, such as volume of solder joint, package weight, solder surface tension, and gravity force to the shape of solder joint were investigated. Two experiments with SAC405 solder balls were carried out. One is to observe the different reflowed geometry shape of solder balls with various volumes, and another is to observe the different reflowed geometry shape of solder balls with various loadings on them. The results show that the models made by Surface Evolver program are very similar to the real shapes observed by experiments, and the differences are between -3% ~ 6.5%. Thus, the results show that the predicted shapes are satisfactorily suitable. Finally, the predicted models by Surface Evolver program were also put into the ANSYS program, and preceded the fatigue life prediction due to thermal cycling tests. The comparison of the effect on fatigue life with respect to different geometry shapes is illustrated. The results show the shape of solder ball due to high loadings is better than that in thermal cycling tests.
22

The Study of Mechanism for Pb-free Solder Lift-off

Su, Hsiao-lan 16 July 2009 (has links)
none
23

Soldering in high pressure die casting and its prevention by lubricant and oxide layers /

Fraser, Darren T. January 2000 (has links)
Thesis (Ph. D.)--University of Queensland, 2001. / Includes bibliographical references.
24

Study of polyarylene ether and its application in isotropically conductive adhesive

Liong, Silvia 08 1900 (has links)
No description available.
25

A study of six weak organic acids commonly used in soldering fluxes

Smith, Brian Andrew 08 1900 (has links)
No description available.
26

Solder paste inspection and 3D shape estimation using directional LED lightings

Chu, Ming-hei. January 2007 (has links)
Thesis (M. Phil.)--University of Hong Kong, 2008. / Also available in print.
27

Development of microelectronics solder joint Inspection system modal analysis, finite element modeling, and ultrasound signal processing /

Zhang, Lizheng. January 2006 (has links)
Thesis (Ph. D.)--Mechanical Engineering, Georgia Institute of Technology, 2007. / Ume, Charles, Committee Chair ; Book, Wayne, Committee Member ; Michaels, Jennifer, Committee Member ; Sitaraman, Suresh, Committee Member ; Tsui, Kwok-Leung, Committee Member ; Goyal, Deepak, Committee Member.
28

Microstructural evolution of eutectic Au-Sn solder joints

Song, Hogeon. January 2002 (has links) (PDF)
Thesis (Ph.D.)--University of California, Berkeley, 2002. / Chair: John W. Morris, Jr. Includes bibliographical references.
29

Thermodynamics and kinetics of oxidation and temperature dependent mechanical characterization of pure indium solder

Schoeller, Harry E. January 2007 (has links)
Thesis (M.S.)--State University of New York at Binghamton, Department of Mechanical Engineering, 2007. / Includes bibliographical references (leaves 121-122).
30

Solder paste inspection and 3D shape estimation using directional LED lightings

Chu, Ming-hei., 朱銘熙. January 2007 (has links)
published_or_final_version / abstract / Electrical and Electronic Engineering / Master / Master of Philosophy

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