Within the context of the imminent implementation of the Pb-free soldering in Europe in 2006, this thesis addresses the gap in understanding that has emerged in the fundamental materials issues between well-understood and mature lead-containing solders and a plethora of new, Pb-free solders for which there are neither long term reliability data nor understanding of the materials behaviour and how these might be influenced by manufacture and in-service conditions. In addition, this thesis also addresses the question as to whether the solder joint size and geometry could become a reliability issue and therefore affect the implementation of the Pb-free solders in ultrafine micro joints. Thermodynamic calculations using MTDATA (developed by the National Physical Laboratory, NPL, UK) together with a thermodynamic database for solders under either equilibrium or Scheil conditions, have shown their usefulness in Pb-free solder design and processing, generating a wealth of information in respect of the temperature dependence of phase formation and composition. The predictions from MTDATA on a number of selected systems is generally in good agreement with the results from experimental work, and has assisted in the understanding of the microstructure and mechanical properties of the Pb-free solders and the implications of their interactions with a tin-lead solder. However, further critical assessment and the addition of new elements into the solder database, such as Ni and P, are required to make MTDA TA a more effective computational tool to assist the optimization of processing parameters and cost-effective production in using Pb-free solders. Molten solder can interact with the under bump metallizations (UBM) and/or board level metallizations on either side of the solder bump to form intermetallic compounds (IMCs) during solder reflow. In the modelling of the kinetics of the dissolution process of UBM into the liquid solder, the commonly used NernstBrunner (N-B) equation is found to have poor validity for these calculations for micro joints at 100 μm in diameter or less. Three bumping techniques, i.e. solder dipping (SD), solder paste stencil printing followed by reflow (SPR) and electroplating of solders and subsequent reflow (EPR), are used to investigate the interfacial interactions of molten Sn/Sn-rich solders, i.e. pure Sn, Sn-3.5Ag, and Sn-3.8AgO.7Cu, on electroless nickel immersion gold (ENIG) and copper pads at 240°C. The resultant bulk and interfacial microstructures from a variety of pad sizes, ranging from 1 mm down to 25 μm, suggest that in general the small bumps contain smaller β-Sn dendrites and Ag₃Sn IMC particles, nevertheless the interfacial IMC is thicker in the smalI bumps than in the large bumps. In addition, one and two-dimensional combined thermodynamic and kinetic models have been developed to assist the understanding of the kinetics of interdiffusion and the formation of interfacial intermetallic compounds during reflow. Both the experimental results and theoretical predictions suggest that the solder bump size and geometry can influence the as-soldered microstructure, and therefore this factor should be taken into consideration for the design of future reliable ultrafine Ph-free solder joints.

This research work is dealing with impact and size of the thermoelectric that may influence DC circuits. Main part of this thesis is to build experimental equipment for measurement of the thermoelectric and following usage this equipment for detection of the size the thermoelectric voltage for lead and lead-free solders. The theoretical part of this work deals with creation and usage of the thermoelectric in electrical engineering industry. In this particular part of this work is an example how the thermoelectric influence DC circuits. Then I describe thermoelectric generation from the motherboard to the die. The practical part of this thesis is focused on the development of the equipment for measuring of the thermoelectric of different types of materials. The Thermoelectric has been measured on two types of the lead, six types lead-free solders and on four types of the thermocouple wires. It has been measured within the range from 0°C to 80°C. In the end of this work is summary, where is reviewed witch of solders is the best for an applications affected by the thermoelectric.

Die vorliegende Arbeit beschäftigt sich mit der Entwicklung, Herstellung und Charakterisierung partikelverstärkter Weich- und Weichaktivlote mit dem Ziel der Eigenschaftsverbesserung der Lötverbindungen. Ausgehend vom Stand der Wissenschaft und Technik wird ein Konzept zur Einbringung von keramischen Verstärkungspartikeln in eine Sn-Basis-Lotmatrix erarbeitet und umgesetzt. Im Falle partikelverstärkter Weichaktivlote wird durch das zusätzliche Legieren der Lotmatrix mit dem reaktiven Element Titan die Ausbildung von zwei Reaktionszonen erreicht, welche die Haftung zwischen Partikel und Matrix steigern. Die mechanischen Eigenschaften dieser Verbindungen werden gegenüber der Partikelverstärkung ohne Aktivelement weiter verbessert. Zum Fügen der Aluminium- und Alumi-niummatrix-Verbundwerkstoffe (AMC) findet ein ultraschallunterstütztes Lötverfahren Anwendung, das eine Benetzung ohne den Einsatz von Flussmitteln ermöglicht. Die hergestellten Lötverbindungen zeichnen sich durch gesteigerte Verbindungsfestigkeiten, vor allem bei erhöhten Temperaturen, sowie eine verbesserte Kriechbeständigkeit aus. Aufgezeigt wird das Potenzial der Lote anhand von Zug- und Scherzugversuchen sowie Kriechuntersuchungen, die mit den Ergebnissen der Mikrostrukturanalyse und der fraktografischen Bewertung korreliert werden. Die Arbeit schließt mit einer Diskussion und sich daraus ergebenden Folgerung. Weiterhin liefert sie Ansätze für weitere Forschungstätigkeiten auf diesem Gebiet. / This thesis deals with the development, manufacturing and characterisation of particle-reinforced solders and active solders to improve the mechanical properties of soldered joints. Based on the state of the art, a concept for embedding of ceramic particles in a Sn-based filler matrix is planed and realised. In the case of particle-reinforced active solders two interfacial reaction layers which increase the bonding between the particles and the filler matrix are formed due to the alloying by the reactive element Ti. The mechanical properties of these joints are improved in comparison to particle-reinforced solders without surface-active elements. For joining of aluminium and aluminium matrix composites (AMC), an ultrasound-supported soldering process was used, that accomplishes a fluxless wetting. The produced joints are featured by an improved joining strength, mainly at elevated temperatures, and an increased creep resistance. The potential of the developed solders is performed by tensile and shear as well as creep tests that are correlated with the results of the micro-structural and fractographical analysis. The Discussion and the drawn conclusions summarise the work and give new approaches for following investigations.

A reliable and robust diffusion barrier, commonly known as under bump metallisation (UBM), is indispensable in solder interconnects in order to retard the interfacial reaction rate, hence the growth of intermetallic compounds (IMCs). However, electroless Ni-P coatings are not adequate to inhibit interfacial reactions effectively since the formation of columnar structure and voids in the crystalline Ni3P layer in hybrid automotive devices (operating temperature above 300ºC) can significantly deteriorate the mechanical integrity of solder joints. In this thesis, electroless Ni-W-P coatings, as an effective UBM capable to serving under high temperature (up to 450ºC), are developed, characterised and subsequently applied onto the high temperature lead-free solder interconnects.

Cette recherche porte sur l'étude métallographique et électrochimique des brasures primaires et secondaires pour huit alliages employés en prothèse fixée dentaire (cinq de haute noblesse, un noble et deux non nobles) et leurs brasures correspondantes réalisées de façon conventionnelle. Des soudures laser ont également été réalisées. La première partie de l'étude concerne la caractérisation des propriétés des alliages et des brasures sur le plan de leurs propriétés physiques, de leur microstructure, de leur comportement mécanique. L'étude a révélée notamment qu'il pouvait exister des défauts métallurgiques plus ou moins important au sein des alliages parent et des zone de liaison métallurgiques. Une deuxième partie de l'étude porte sur le comportement électrochimique des alliages et brasures secondaires dans différents types d'électrolyte simulant la salive. Les alliages sont étudiés individuellement et en couplage galvanique. Leur comportement en corrosion est ainsi analysé. Ces études montrent que tous les alliages étudiés (y compris les non nobles) présentaient une très grande résistance à la corrosion / This study deals with metallographic and electrochemical properties of eight parent alloys used in fixed partial denture (five High Noble, one Noble and two predominantly based alloy), and their corresponding pre- and post-solder realized in conventionnal way. Laser solder have also been realized. In the fisrt part of the study, parent alloys and their corresponding solders were caracterized by considering their physical properties, microstructure and mechanical aspect. Different types of internal defects were noticed in several parent alloys and solder joints. The second main aspect of the study concerns electochemical comportement of parents alloys and their post-solders alloys in diffent in several types of electrolyte simulating articificial saliva. Parent alloys are study individually and in galvanic coupling conditions. The results show that all alloys of the study (predominantly based alloys inclued) are very corrosion resistant

These thesis deals with electromigration in solder joint. In theoretical part are described lead-free solders, surface finish, formation of solder joint, intermetallic compounds a electromigration. In practical part is investigated a effect of electromigration on growth intermetallic compounds in solder jsoint.

<p>  </p> <p>Due to miniaturization of electronic devices new electronic packaging strategies, such as Heterogeneous Integration Packaging (HIP), are being developed. In HIP, the space in the package is strategically mapped out to maximize the placement of components including all types of materials. Thus, there is a need to develop and understand the behavior of lower-melting point metallic interconnects as they will be located next to lower melting point materials, such as polymers. </p> <p>The composition of alloying elements in Sn-rich solder plays a pivotal role in determining the microstructural properties of the solder joint. However, the complex mechanisms governing the solidification processes of Sn-In, and Sn-Bi alloys are still not fully understood. Furthermore, the experimental characterization of phase formation poses significant challenges.</p> <p>This dissertation focuses on understanding microstructural evolution in Sn-In and Sn-Bi alloys during reflow. A systematic approach to characterizing the microstructure of alloys was developed, utilizing electron microscopy, non-destructive x-ray tomography and diffraction techniques, ranging from lab-scale to synchrotron experiments. The influence of In addition on microstructure was correlated with the mechanical behavior obtained using nanoindentation. The experimental understanding was further correlated with the Density Functional Theory (DFT) calculations. To study the Sn-Bi microstructures, the effect of experimental parameters, such as the cooling rate during solidification was elucidated. A 4D study was conducted, involving the analysis of 3D microstructures along with time evolution, to gain a comprehensive understanding of the solidification dynamics using synchrotron white beam tomography. For the first time, we observed a regular pyramidal morphology of Bi forming in the solder alloy. The 4D analysis provided crucial insights into morphology formation, growth kinetics, defect formation during solidification. The crystallographic analysis unraveled unique insights into the solid-liquid interface stability for semi-metals. Furthermore, the simultaneous Energy Dispersive Diffraction (EDD) analysis yielded a deeper understanding into the phase formation and lattice strain evolution. A fundamental relationship between the diffraction intensity and phase fractions, from imaging, was obtained. The experimental methodology developed in this work has the potential to be extended to investigate a wide range of alloy solidification mechanisms, enabling a deeper understanding of these materials.</p>

The factors controlling the reliability of Pb-free solders when subject to thermomechanical regimes relevant to the harsh aerospace environment have been studied. Ball grid array (BGAs) typical of microelectronic devices have been manufactured in-house and subjected to isothermal ageing and thermal cycling. The BGAs comprised both Cu and Ni-Au metallizations, Pb-free Sn-Ag-Cu 400 and 600&mu;m solder balls, FR4 and Al₂O₃ boards, and included circuits to measure resistance changes due to damage in the joints during thermal cycling. Microstructural evolution within the solders balls and complex interfacial reactions were studied in all configurations using various types of electron microscopy. The mechanical properties of the different phases formed within solder joints were studied using nanoindentation at room and elevated temperatures up to 175°C for the first time. Intermetallic compounds (IMCs) were stiff, hard and brittle with very low creep rates, while the softer primary Sn, eutectic regions and Cu metallization readily underwent creep. Two-dimensional finite element analysis (FEA) of nanoindentation was used to understand better the physical meaning of nanoindentation creep data. Reliability experiments comprised both thermal cycling and FEA of BGAs. The difference in coefficient of thermal expansion (CTE) in the BGA materials caused interfacial fatigue damage in the solder joints, which was detected primarily at the solder/metallization interface of the outermost, most strained solder joint. Accumulated creep strain per cycle at this interface was evaluated using 3D FEA of the stress-strain state of the BGA and results calibrated against experimental BGA mean lifetimes using the Coffin-Mason relationship. Nanoindentation combined with FEA has been shown to be a viable route for the rapid assessment of creep performance and lifetime in lead-free solders under aerospace thermal cycles.

This research aims to understand the reliability of Sn-Ag-Cu solder interconnects used in plastic ball grid array (PBGA) packages using microstructure evolution, laser moiré interferometry and finite-element modeling. A particle coarsening based microstructure evolution of the solder joint material during thermal excursions was studied for extended periods of time lasting for several months. The microstructure evolution and particle coarsening was quantified, and acceleration factors were determined between benign field-use conditions and accelerated thermal cycling (ATC) conditions for PBGA packages with different form factors and for two different lead-free solder alloys. A new technique using laser moiré interferometry was developed to assess the deformation behavior of Sn-Ag-Cu based solder joints during thermal excursions. This technique can used to estimate the fatigue life of solder joints quickly in a matter of few days instead of months and can be extended to cover a wide range of temperature regimes. Finite-element analysis (FEA) in conjunction with experimental data from the ATC for different lead-free PBGA packages was used to develop a fatigue life model that can be used to predict solder joint fatigue life for any PBGA package. The proposed model will be able to predict the mean number of cycles required for crack initiation and crack growth rate in a solder joint.

The control of interfacial microstructural stability is of utmost importance to the reliability of liquid solder interconnects in high temperature electronic assemblies. This is primarily due to excessive intermetallic compounds (IMCs) that can form and continuously grow during high temperature operation, which practically renders conventional barrier metallisations inadequate. In this study, electrically conducting, NbOx containing Ni coatings were developed using electrodeposition. Their suitability as a solder diffusion barrier layer was assessed in terms of the electrical conductivity and barrier property. The present work explores a novel electrochemical route to produce Ni-NbOx composite coatings of good uniformity, compactness and purity, from non-aqueous glycol-based electrolytes consisting of NiCl2 and NbCl5 as metal precursors. The effects of cathodic current density and NaBH4 concentrations on the surface morphology, composition and thickness of the coatings were examined. A combined study of Scanning Transmission Electron Microscopy (STEM) and Electrochemical Quartz Crystal Microbalance (EQCM) was conducted to understand the fundamental aspects of this novel electrodeposition process. The composite coatings generally exhibited good electrical conductivity. The reaction behaviour between a liquid 52In-48Sn solder and Ni-NbOx, with Nb contents up to 6 at.%, were studied at 200°C. The results indicate that, Ni-NbOx with sufficient layer thickness and higher Nb content, offered longer service lifetime. Nb enrichment was generally observed at or close to the reaction front after high temperature storage, which suggests evident effectiveness of the enhanced diffusion barrier characteristics.