Yes / A novel 50μm Silicon-based on-chip antenna is presented that combines metamaterial (MTM) and substrate integrated waveguide (SIW) technologies for integration in THz circuits operating from 0.28 to 0.30 THz. The antenna structure comprises a square patch antenna implemented on a Silicon substrate with a ground-plane. Embedded diagonally in the patch are two T-shaped slots and the edges of the patch is short-circuited to the ground-plane with metal vias, which convert the structure into a substrate integrated waveguide. This structure reduces loss resulting from surface waves and Silicon dielectric substrate. The modes in the structure can be excited through two coaxial ports connected to the patch from the underside of the Silicon substrate. The proposed antenna structure is essentially transformed to exhibit metamaterial properties by realizing two T-shaped slots, which enlarges the effective aperture area of the miniature antenna and significantly enhances its impedance bandwidth and radiation characteristics between 0.28 THz to 0.3 THz. It has an average gain and efficiency of 4.5dBi and 65%, respectively. In addition, it is a self-isolated structure with high isolation of better than 30dB between the two ports. The on-chip antenna has dimensions of 800×800×60 μm3. / H2020-MSCA-ITN-2016 SECRET-722424 and the financial support from the UK Engineering and Physical Sciences Research Council (EPSRC) under grant EP/E0/22936/1

Part B of two parts. Part A found at: http://hdl.handle.net/11375/18724 / <p> The theory of operation and advantages of a channeled substrate planar (CSP) laser is described. The processing of such devices utilizing 5 N m wide proton bombardment defined current stripes is detailed. The optical and electrical characteristics of the resultant devices is presented. The lasers had pulsed, room temperature thresholds averaging 90mA, lased predominantly in a single longitudinal mode and were kink-free to power levels in excess of 6mW. Accelerated aging yielded an "activation energy" for the degradation process of 0.7eV which allowed for a predicted useful lifetime of 5 x 10^4 hours for these lasers. </p> / Thesis / Master of Engineering (MEngr)

Yes / Bond between substrate and overlay concretes is a key factor for the success of the repair method and significantly influences the structural performance of the repaired element. This study investigated the effect of fly ash and the surface preparation method on the bond strength of repaired concrete after exposure to high temperatures, that has not been comprehensively studied in the literature. For this purpose, overlay concretes containing 0, 5, 10, 15, and 20% fly ash as a replacement by weight of cement were cast on the original concrete surface prepared by four methods namely, as-cast, wire brushed, grooved and grooved-wire brushed. The bond strength of the interface between concrete substrate and overlay concrete was evaluated after exposure to 23, 200, 400, and 600oC temperatures for 1 hour. The results showed that partial replacement of cement by fly ash in the overlay concrete increased the bond strength of repaired concrete by up to 71%, depending on the amount of fly ash used, surface preparation method, and the temperature to which the sample was exposed. The maximum increase of bond strength was recorded for concrete containing 20% fly ash when the wire brushed preparation method was adopted at temperature of 200oC. However, surface preparation was the most influential parameter, achieving a bond strength gradual increase in order from as-cast, wire brushed, grooved to grooved-wire brushed methods. The results also showed that for most of the samples having similar surface preparation and the same percentage of fly ash, bond strength decreased with the increase of exposure to temperature; for example, for overlay concretes without fly ash, in as-cast and wire brushed surface preparation methods at temperatures of 400 and 600 oC, the bond strength has reached zero. On the other hand, for grooved and grooved-wire brushed surface preparation methods, the bond strength reduction was about 63%, when temperature increased from 23 to 600oC. / The full-text of this article will be released for public view at the end of the publisher embargo, 12 month from first publication.

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