Since its inception as the Tungsten Workshop in 1984, AMC has served as the leading conference for the interconnect and contact metallization communities, and has remained at the leading edge of the development of tungsten, aluminum, and copper/low-K interconnects. As the semiconductor industry evolves, exciting new challenges in metallization are emerging, particularly in the areas of contacts to advanced devices, local interconnect solutions for highly-scaled devices, advanced memory device metallization, and 3D/packaging technology. While the conference content has evolved, the unique workshop environment of AMC fosters open discussion to create opportunities for cross-pollination between academia and industry.
Submissions are covering materials, process, integration and reliability challenges spanning a wide range of topics in metallization for interconnect/contact applications, especially in the areas of:
- Contacts to advanced devices (FinFET, Nanowire, III/V, and 2D materials)
- Highly-scaled local and global interconnects
- Beyond Cu interconnect
- Novel metallization schemes and advanced dielectrics
- Interconnect and device reliability
- Advanced memory (NAND/DRAM, 3D NAND, STT and RRAM)
- 3D and packaging (monolithic 3D, TSV, EMI)
- Novel and emerging interconnects
Executive Committee:
Sang Hoon Ahn (Samsung Electronics Co., Ltd.)
Paul R. Besser (Lam Research)
Robert S. Blewer (Blewer Scientific Consultants, LLC)
Daniel Edelstein (IBM)
John Ekerdt (The University of Texas at Austin)
Greg Herdt (Micron)
Chris Hobbs (Sematech)
Francesca Iacopi (Griffith University)
Chia-Hong Jan (Intel Corporation)
Rajiv Joshi (IBM)
Heinrich Koerner (Infineon Technologies)
Mehul Naik (Applied Materials Inc.)
Fabrice Nemouchi (CEA LETI MINATEC)
Takayuki Ohba (Tokyo Institute of Technology)
Noel Russell (TEL Technology Center, America)
Stefan E. Schulz (Chemnitz University of Technology)
Yosi Shacham-Diamand (Tel-Aviv University)
Roey Shaviv (Applied Materials Inc.)
Zsolt Tokei (IMEC)
| Identifer | oai:union.ndltd.org:DRESDEN/oai:qucosa.de:bsz:ch1-qucosa-206986 |
| Date | 22 July 2016 |
| Contributors | TU Chemnitz, Fakultät für Elektrotechnik und Informationstechnik, Universitätsverlag der Technischen Universität Chemnitz, |
| Publisher | Universitätsbibliothek Chemnitz |
| Source Sets | Hochschulschriftenserver (HSSS) der SLUB Dresden |
| Language | English |
| Detected Language | English |
| Type | doc-type:conferenceObject |
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