In this thesis, a bottom gate TFT with smart body tie device is realized, For a PDSOI devices, which usually uses large layout areas of body ties, and it has self-heating effect resulting from the buried oxide between the silicon film and substrate, which has a lower thermal conductivity.
In order to suppress the short channel effect and reduce leakage current, we dug out in advance the PN junction to formed the ultra thin film body, besides, in order to reduce Miller's capacitance effect we formed enough thickness of spacer at both sides of the bottom gate and let the source and the drain region do not too closer nearly.
According to the simulation results of ISE TCAD, the TFT with smart body tie device can alleviate self-heating effect and can achieve kink-free at output characteristic curve due to hot carriers by impact ionization and enhance the breakdown voltage of the device. Although the drive current of the TFT device lower than conventional TFT due to the parasitic resistance in the body region, the output characteristic curve is smooth in the saturation zone; the device suppress the short channel effect and improve the performance of the device due to most areas of PN junction are dug out.
| Identifer | oai:union.ndltd.org:NSYSU/oai:NSYSU:etd-0731106-103712 |
| Date | 31 July 2006 |
| Creators | Lin, Shih-tsong |
| Contributors | Albert Chin, Yao-tsung Tsai, James-B. Kuo, Shu-fen Hu, Chia-hsiung Kao, Jyi-tsong Lin |
| Publisher | NSYSU |
| Source Sets | NSYSU Electronic Thesis and Dissertation Archive |
| Language | Cholon |
| Detected Language | English |
| Type | text |
| Format | application/pdf |
| Source | http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0731106-103712 |
| Rights | withheld, Copyright information available at source archive |
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