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<p>Transient liquid phase sintering (TLPS) technologies are potential low-temperature solders for
sustainable replacements of lead-based solders and high-temperature lead-free solders. Compared to solid-state sintering and lead-free solders, TLPS uses lower temperatures
and is, thus, suitable for assembling temperature-sensitive components. TLPS is a non-
equilibrium process and determining the kinetics is critical to the estimation of processing times
needed for good joining. The tin-indium (Sn-In) system with a eutectic temperature of 119°C is
being considered as the basis for a TLPS system when combined with tin. Most models of TLPS
include interdiffusion, dissolution, isothermal solidification, and homogenization and are based
on simple binary alloys without intermediate phases. The Sn-In system has two intermediate
phases and thus the reaction kinetics require additional terms in the modeling. Differential
Scanning Calorimetry (DSC) has been used to measure the response of Sn-In alloys during the
transient liquid phase reaction. Preparation of tin indium alloys for microstructural analysis is
challenging due to their very low hardness. This study uses freeze-fracturing of the tin indium
alloys to obtain sections for microstructural analysis. The combination of DSC and
microstructure analysis provides information on the reaction kinetics. It was observed that the
solid/liquid reaction does not proceed as quickly as desired, that is, substantial liquid remains
after annealing even though the overall composition is in the single-phase region in the phase
diagram. </p>
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| Identifer | oai:union.ndltd.org:purdue.edu/oai:figshare.com:article/17157686 |
| Date | 03 January 2022 |
| Creators | John Osarugue Obamedo (11250306) |
| Source Sets | Purdue University |
| Detected Language | English |
| Type | Text, Thesis |
| Rights | CC BY 4.0 |
| Relation | https://figshare.com/articles/thesis/Compositional_Effect_on_Low-Temperature_Transient_Liquid_Phase_Sintering_of_Tin_Indium_Solder_Paste/17157686 |
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